Abstract: A cable-end connector and insulation housing assembly thereof are provided. The cable-end connector is paired with a conductive cable, and the insulation housing assembly is capable of guiding the extension of the conductive cable so that extension direction of the conductive cable aligns with expectations. This allows the conductive cable to be easily organized within the electronic device, preventing unnecessary tangling and enabling electronic devices to continue evolving toward being thinner, lighter, and more compact. Additionally, the insulation housing assembly is formed by combining multiple housings. By adjusting the structure of the combined housings, the insulation housing assembly can guide the conductive cable to extend in the desired direction.

Abstract: An electrical connector, which is assembled and constructed from multiple components with conductive terminals. Therefore, the electrical connector can be customized by altering the conductive terminals of the assembled components to adjust the number and configuration of the conductive terminals, enabling the electrical connector to meet the requirements of electronic devices.

Abstract: An electrical connector, and the electrical connector is manufactured through an assembly method, enabling the assembly of conductive terminals tailored to the requirements of electronic devices, thereby achieving customized adjustment of the number of conductive terminals in the electrical connector according to the demands. Additionally, the electrical connector comprises a circuit board capable of accommodating electronic elements, ensuring that the electrical characteristics of the electrical connector meet the requirements of electronic devices.

Abstract: An electronic device including a first conductive element, a second conductive element, a substrate, and a conductor is provided. The first conductive element has a first region. The substrate has a through hole. The first through hole is disposed between the first conductive element and the second conductive element. The conductor electrically connects the first conductive element to the second conductive element through the through hole. The through hole is partially surrounded by the first region.

Abstract: A multi-piece connector is provided. The multi-piece connector includes a jumper conductor for electrically interconnecting parts of conductive terminals of the connector, without having to use any additional jumper, such that an electronic device having such a connector can be made more compact in size.

Abstract: An electrical connector that can provide a shielding wall capable of transmitting shielded signals on at least three sides of the non-grounding conductive terminal, enabling to effectively reduce interference during high-speed signal transmission, thereby optimizing transmission quality for high-speed signals of the electrical connector, in order to meet the special requirements and development of electronic devices.

Abstract: An electrical connector is described that provides a shielding wall for at least three sides of non-grounded conductive terminals, enabling the transmission of shielded signals. This design effectively reduces interference for the electrical connector when transmitting high-speed signals, thereby optimizing the transmission quality of high-speed signals for the electrical connector. This meets the specific requirements and advancements in electronic devices.

Abstract: An electrical connector is described that provides a shielding wall for at least three sides of non-grounded conductive terminals, enabling the transmission of shielded signals. This design effectively reduces interference for the electrical connector when transmitting high-speed signals, thereby optimizing the transmission quality of high-speed signals for the electrical connector. This meets the specific requirements and advancements in electronic devices.

Abstract: Some implementations herein include a semiconductor die and methods of formation. The semiconductor die includes an array of interconnect pad structures, including interconnect pad structures having surfaces located within an overlay region of an active device area of the semiconductor die. As part of manufacturing the semiconductor die, temporary conductive structures are formed across the overlay region to support wafer acceptance testing and/or circuit probe testing process. Forming the temporary conductive structures includes using an anti-reflective coating layer having a composition that enables the temporary conductive structures to be formed using a single etch cycle.

Abstract: Embodiments of the present disclosure relates to a wet bench processing including an in-situ pre-treatment prior to performing the first set of wet bench operations. The pre-treatment may include a pre-clean operation and/or a pre-heat operation. The pre-treatment may be performed in one of the existing ONB tanks without requiring adding new tanks to an existing wet bench tool. The pre-clean operation removes particles from a batch of wafers to avoid or reduce cross-contamination and defect issues, thus improving the yield rate of the wet bench process. The pre-heat operation provides better control and stabilize the temperature in the CHB tank to stabilize the process, such as to stabilize an etch rate.

Abstract: In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.

Abstract: A control circuit is coupled to a power converter having an input voltage VIN and an output voltage VOUT. The control circuit includes a capacitor connected between a current source and a ground. The current source is configured to charge the capacitor with a current ?VIN or ?(VIN?VOUT) when a pulse width modulate (PWM) signal of a PWM controller of the power converter is high, and to discharge the capacitor with a current ?(?VOUT) or ?(VIN?VOUT) when the PWM signal is low. ? is a pre-configured constant. The control circuit is configured to trigger the PWM controller to skip pulses when a voltage across the capacitor decreases to be less than a threshold before a present switching cycle of the power converter ends.

Abstract: An electronic device is provided. The electronic device includes at least one electrical connection structure. The at least one electrical connection structure includes a first substrate, a first conductive pad, a second substrate, a second conductive pad, a first conductive material, a through-hole, and a second conductive material. The first conductive pad is disposed on the first substrate and has a top surface and a side surface. The second conductive pad is disposed on the second substrate. The first conductive material is disposed on the second conductive pad. The through-hole passes through the first conductive pad and the first substrate. The second conductive material is partially disposed within the through-hole and is at least partially in contact with the top surface and the side surface of the first conductive pad, and the first conductive material.

Abstract: A power converter includes a voltage transformer, a clamp capacitor, a main switch, a clamp switch, and a control circuit. The clamp capacitor is coupled to the primary winding of the voltage transformer, and the main switch is coupled in series between the primary winding and a ground terminal. The clamp switch is coupled in series between the clamp capacitor and the main switch, and the clamp switch, the main switch, and the primary winding are coupled to a common node. The control circuit turns on the main switch periodically, and turns on the clamp switch before turning on the main switch. After turning off clamp switch and before turning on the main switch, the control circuit determines a length of time that the clamp switch should be turned on next time according to a voltage of the common node sensed right before the main switch is turned on and a threshold voltage.

Abstract: An atomization device includes a cooling chip, a discharge electrode, a heat sink, and a counter electrode. The discharge electrode includes a first side, a second side opposite to the first side, and a plurality of first tip portions located on the first side. The second side is connected to the cooling chip. The cooling chip is located between the heat sink and the discharge electrode. The counter electrode is spaced apart from the discharge electrode and includes multiple second tip portions. The second tip portions and the first tip portions are opposite to each other.

Abstract: A connector assembly includes a female connector, a male connector, and an engaging member. The female connector is formed with an insertion slot and includes an inner peripheral surface surrounding the insertion slot. The male connector includes an insertion section for insertion into the insertion slot. The insertion section has an outer peripheral surface for facing the inner peripheral surface when the insertion section is inserted into the insertion slot. One of the inner peripheral surface and the outer peripheral surface is formed with an annular engaging groove, and the engaging member is disposed on the other one of the inner and outer peripheral surfaces. When the insertion section is inserted into the insertion slot, the engaging member is engaged in the annular engaging groove to fix the insertion section into the insertion slot.

Abstract: An apparatus includes a secondary controller coupled to a secondary circuit of a power conversion system, and a primary controller coupled to a primary circuit of the power conversion system, the primary controller being coupled to the secondary controller through an isolation interface, wherein the secondary controller is configured to detect whether a load is coupled to the power conversion system, in response to the load being disconnected from the power conversion system, communicate with the primary controller through pulling down a secondary feedback node in the secondary circuit and a primary feedback node in the primary circuit for a first predetermined time, provide a high impedance at the secondary feedback node to reduce power consumption, and in response to the load being reconnected to the power conversion system, communicate with the primary controller through pulling down the secondary feedback node in the secondary circuit for a second predetermined time.

Abstract: A polymer film including a first portion and a second portion laminated with the first portion. Each portion independently consists of one or more layers. The first and second layers each independently have a melt index ranging from 3.5 g/10 min to 10.0 g/10 min, and lower than 3.5 g/10 min, respectively. Each layer of the first portion independently has a product of its melt index and a thickness ratio of its thickness to the total thickness of the first and second portions, such that the sum of the product of each layer of the first portion ranges from 0.39 g/10 min to 2.50 g/10 min. Each layer of the second portion independently has a product of its melt index and a thickness ratio of its thickness to the total thickness of the first and second portions, such that the sum of the product of each layer of the second portion ranges from 1.10 g/10 min to 2.95 g/10 min.

Abstract: A laser processing device includes a laser beam source, a compensation system, and an imaging system. The laser beam source is configured to provide a laser beam, in which a non-zero angle is defined between an optical axis of the laser beam and a normal direction of the surface of the workpiece. The compensation system includes a phase compensation sheet. The phase compensation sheet is configured to force the laser beam spreading away from the optical axis thereby forming a beam pattern, and the phase compensation sheet is designed based on the non-zero angle. The imaging system is configured to transform the beam pattern to a processing beam that focuses on a processing position, and a distance from the phase compensation sheet to the laser beam source along the optical axis is decided according to a processing depth of the processing position. A laser processing method is also disclosed.

Abstract: A polymer film is provided. The polymer film sequentially includes a first layer, a second layer and a third layer, where the two surfaces of the second layer are in contact with the first layer and the third layer, respectively. The first layer has a first melt index, the second layer has a second melt index, and the third layer has a third melt index. The second melt index ranges from 3.5 g/10 min to 10.0 g/10 min, the first melt index and the third melt index are independently lower than 3.5 g/10 min, and the difference between the second melt index and the first melt index, as well as the difference between the second melt index and the third melt index independently range from 0.2 g/10 min to 8.5 g/10 min.