Abstract: A method includes rotating a wafer, dispensing a liquid from a center of the wafer to an edge of the wafer to control a temperature of the wafer, and etching an etch layer of the wafer with an etchant during or after dispensing the liquid. The liquid is dispensed through a nozzle.

Abstract: The present disclosure relates to an apparatus for wafer cleaning. The apparatus includes an enclosure made of a noncombustible material, a wafer holder, a cleaning nozzle, at least one sensor, and an exhaust unit. The wafer holder can hold and heat a wafer. The cleaning nozzle can supply a flow of a cleaning fluid onto a surface of the wafer. The at least one sensor can detect attributes of the wafer. The exhaust unit can expel a vapor generated by the cleaning fluid in the enclosure. The exhaust unit can include a rinse nozzle to rinse the vapor passing through the exhaust unit with a mist.

Abstract: A polymer film and a laminated glass manufactured using the polymer film are provided. The polymer film has a first surface and a second surface, wherein the first surface has a standard deviation of a void volume (Vv) value at a material ratio of 10% ranging from 0.5 ?m3/?m2 to 2.5 ?m3/?m2, and wherein the material ratio and void volume are defined in accordance with ISO 25178-2:2012.

Abstract: The present invention discloses a light redirecting film, a polarizer with the light redirecting film, and a display comprising the polarizer. The light redirecting film includes a light redistribution layer, and a light guide layer disposed on the light redistribution layer. The light redistribution layer includes a plurality of strip-shaped micro prisms extending along a first direction and arranged at intervals and a plurality of diffraction gratings arranged at bottoms of the intervals between the adjacent strip-shaped micro prisms, wherein each of the strip-shaped micro prisms has at least one inclined light-guide surface, and the bottom of each interval has at least one set of diffraction gratings, and the light guide layer is in contact with the strip-shaped micro prisms and the diffraction gratings.

Abstract: A method and an electronic device for configuring signal pads between three-dimensional stacked chips are provided. The method includes: obtaining a plurality of frequency response curves corresponding to a plurality of parameter sets; obtaining an operating frequency; selecting a selected frequency response curve from the plurality of frequency response curves according to the operating frequency, where the selected frequency response curve corresponds to a selected parameter set among the plurality of parameter sets; generating, according to the selected parameter set, a signal pad configuration for configuring a first signal pad and a second signal pad on a surface of a chip; and outputting the signal pad configuration.

Abstract: A touch sensitive processing method, comprising: performing capacitance sensing by a touch panel to gather an approximating or touching position of an external conductive object with regard to the touch panel; determining whether the approximating or touching position is within a non-report area, wherein a shape of the non-report area is a circle or an ellipse; when the approximating or touching position is determined outside the non-report area, reporting the approximating or touching position to a host; and when the approximating or touching position is determined inside the non-report area, ignoring the approximating or touching position.

Abstract: A wireless communication device includes a processor, a baseband signal processing circuit and a wireless transceiver circuit. The processor determines a transmission need, determines a transmission rate according to the transmission need and a channel condition, and provides data and information regarding the transmission rate to the baseband signal processing circuit. The information regarding the transmission rate includes at least one of a selected transmission standard, a selected physical layer data transmission rate and a selected modulation and coding scheme. The baseband signal processing circuit is coupled to the processor and processes the data according to the information regarding the transmission rate to accordingly generate a packet. The wireless transceiver circuit is coupled to the baseband signal processing circuit and transmits the packet.

Abstract: The present invention provides a caption service system for remote speech recognition, which provides caption service for the hearing impaired. This system includes a speaker and a live broadcast equipment at A, a listener-typist and a computer at B, a hearing impaired and a live screen at C, and an automatic speech recognition (ASR) caption server at D. Connect the live broadcast equipment, the computer, the live screen and the ASR caption server with a network. The speaker's audio is sent to the automatic speech recognition (ASR) caption server to be converted into text, which is corrected by the listener-typist, and then the text caption is sent to the live screen of the hearing impaired together with the speaker's video and audio, so that the hearing impaired can see the text caption spoken by the speaker.

Abstract: A polymer film and laminated glass manufactured using the same are provided. The polymer film has a first surface and a second surface, wherein the first surface has a root mean square gradient (Sdq) ranging from 1.5 to 3 and a root mean square height (Sq) ranging from 8 ?m to 20 ?m, wherein the Sdq and Sq are defined in accordance with ISO 25178-2:2012.

Abstract: A polymer film and laminated glass manufactured using the same are provided. The polymer film has a first surface and a second surface, wherein the first surface has a root mean square gradient (Sdq) ranging from 0.1 to 1.5 and a root mean square height (Sq) ranging from 1 ?m to 15 ?m, wherein Sdq and Sq are defined in accordance with ISO 25178-2:2012.

Abstract: A plurality of devices for testing, connected in series using one or more redistribution layers (RDLs), are used to perform a semiconductor device test on a plurality of dies. As a result, the semiconductor device test may support thousands of gross dies per wafer or greater (e.g., 10,000 dies or greater). Furthermore, the RDL(s) may be removed after use. In some implementations, the devices for testing corresponding to the dies may execute the semiconductor device test sequentially. Accordingly, test data may be generated and may include a bit sequence, where a first bit in the bit sequence indicates an overall outcome for the test and one or more subsequent bits in the bit sequence indicate respective outcomes for each semiconductor dies or for each line of the semiconductor device test.

Abstract: A splicing device includes a first splicing unit and a second splicing unit. The first splicing unit includes a first substrate, a first light-emitting unit, and a second light-emitting unit. The second splicing unit includes a second substrate, a third light-emitting unit, and a fourth light-emitting unit. P is a pitch between the first light-emitting unit and the second light-emitting unit, and a pitch between the third light-emitting unit and the fourth light-emitting unit. LA1 is a horizontal distance from a center of the second light-emitting unit to a first reference plane. LB3 is a horizontal distance from a boundary between a light-emitting surface of the second splicing unit and a second reference plane to the first reference plane. LB1x and LB1y are respectively a horizontal component and a vertical component of a distance from the boundary to a center of the third light-emitting unit.

Abstract: The present disclosure describes a system and a method for an ion implantation (IMP) process. The system includes an ion implanter configured to scan an ion beam over a target for a range of angles, a tilting mechanism configured to support and tilt the target, an ion-collecting device configured to collect a distribution and a number of ejected ions from the ion beam scan over the target, and a control unit configured to adjust a tilt angle based on a correction angle determined based on the distribution and number of ejected ions.

Abstract: A transceiver circuit includes a counter device, a compensation circuit and an adjusting circuit. The counter device is configured to count an execution time of a reception operation and accordingly generate a counting result. The compensation circuit is coupled to the counter device and configured to receive the counting result, determine a plurality of compensation values according to the counting result and sequentially output the compensation values in a transmission operation. The transmission operation follows the reception operation. The adjusting circuit is coupled to the compensation circuit, and configured to receive the compensation values and sequentially adjust amplitude of a signal according to the compensation values in the transmission operation. The compensation values are respectively applied to different portions of the signal.

Abstract: A multi-piece connector is provided. The multi-piece connector is formed by using an assembling component to assemble a primary connector sub-component and a secondary connector sub-component to a plastic casing. Thus, even if the connector is finished, the number and structure of conductive terminals of the connector can still be modified and customized by adjusting the primary connector sub-component and the secondary connector sub-component in response to development requirements for the electronic device.

Abstract: A multi-piece connector is provided. The multi-piece connector includes a jumper conductor for electrically interconnecting parts of conductive terminals of the connector, without having to use any additional jumper, such that an electronic device having such a connector can be made more compact in size.

Abstract: A connector assembly allows a conductive terminal to provide shielding to reduce any effect of external interference on signal transmission of the connector assembly so as to meet signal transmission requirements for the connector assembly, and with the use of a jumper conductor, at least partial conductive terminals on the connector assembly can be electrically interconnected with no need of any additional jumper, such that an electronic device using such connector assembly can be made compact in size desirably.

Abstract: A connector assembly is provided. The connector assembly allows a conductive terminal to provide shielding to reduce any effect of external interference on signal transmission of the connector assembly so as to meet signal transmission requirements for the connector assembly, and with the use of a jumper conductor, at least partial conductive terminals on the connector assembly can be electrically interconnected with no need of any additional jumper, such that an electronic device using such connector assembly can be made compact in size desirably.

Abstract: A connector assembly is provided. The connector assembly allows a conductive terminal to provide shielding to reduce any effect of external interference on signal transmission of the connector assembly so as to meet signal transmission requirements for the connector assembly, and with the use of a jumper conductor, at least partial conductive terminals on the connector assembly can be electrically interconnected with no need of any additional jumper, such that an electronic device using such connector assembly can be made compact in size desirably.

Abstract: The present disclosure relates to a polymer film comprising a polyvinyl acetal resin and a plasticizer, wherein the polymer film comprises at least one first layer and at least one second layer, and the loss factor of the first layer and the loss factor the second layer are different; furthermore, the ratio of the loss factor of the first layer to that of the second layer is 1.30 to 3.12. The polymer film provided herein has an improved sound insulation effect.