Abstract: A universal serial bus (USB) type wireless data card is used for wireless communication in a multi-in/multi-out (MIMO) environment. The USB type wireless data card includes a card body. A USB connector is disposed at one end of the card body and connectable to a USB port of an electronic device. An antenna part includes first and second antennae connected to the card body such that the first and second antennae may be received in the card body and may be extended from the card body to move away from the card body and be spaced apart from the USB connector.

Abstract: A semiconductor package and a method for manufacturing the same are provided. The semiconductor package includes a semiconductor chip having a first surface, a second surface and a pixel area, first adhesion patterns disposed on the first surface, second adhesion patterns disposed between the first adhesion patterns and the pixel area and disposed on the first surface, and external connection terminals disposed on the second surface, wherein the second adhesion patterns and the external connection terminals are disposed to overlap each other.

Abstract: A semiconductor device includes an isolation layer defining an active region formed in a semiconductor substrate. A first recessing process is performed on the isolation layer to expose edge portions of the active region. A first rounding process is performed to round the edge portions of the active region. A second recessing process is performed on the isolation layer. A second rounding process is performed to round the edge portions of the active region.

Abstract: Disclosed herein is a no-welding type battery pack using one or more forced-inserting type rivets. A cap assembly includes a base plate mounted to an open upper end of a battery case, a protection circuit module (PCM) mounted on the base plate, and a top cap coupled to the upper end of the battery case while the top cap covers the PCM. The top cap is made of an insulative material. The electrical connection and the mechanical coupling between the PCM and the base plate are accomplished by one or more forced-inserting type rivets. The cap assembly is included the battery pack. The no-welding type battery pack using the one or more forced-inserting type rivets is manufactured without welding or soldering requiring an excessive amount of time and skilled technique during the electrical connection between the battery cell and the PCM. As a result, the assembly process of the battery pack is simplified, and therefore, the manufacturing time of the battery pack is reduced.

Abstract: A method of prefetching data in a hard disk drive includes searching for a logic block address (LBA) of data requested by an external apparatus in a history of a non-volatile cache of the hard disk drive, and if the LBA of the data is stored in the history, storing data recorded in a LBA stored after the LBA of the data requested by the external apparatus from among LBAs stored in the history in a buffer of the hard disk drive.

Abstract: An optical sensor providing enhanced reliability in sensing peripheral light and reduced power consumption, and a liquid crystal display device incorporating this optical sensor. In the optical sensor, a first transistor is electrically coupled between a first power supply and a second transistor, which is electrically coupled between the first transistor and a second power supply having a voltage less than that of the first power supply. The first transistor is either turned-on or turned-off according to a control signal. The second transistor controls an amount of an electric current flowing from the first transistor to the second power supply corresponding to an intensity of peripheral light. A sensing section is constructed with a first capacitor electrically coupled to the second transistor in parallel. A gate electrode of the second transistor is electrically coupled to the second power supply.

Abstract: Microelectronic devices include a conductive via that extends into a substrate face and that also protrudes beyond the substrate face to define a conductive via end surface and a conductive via sidewall that extends from the end surface towards the substrate face. A conductive cap is provided on the end surface, the conductive cap including a conductive cap body that extends across the end surface and a flange that extends from the conductive cap body along the conductive via sidewall towards the substrate face. Related fabrication methods are also described.

Abstract: Disclosed herein is a battery pack, which comprises a connecting member including an insulation frame mounted to the upper end of a battery cell and a pair of connection protrusions formed at the upper end surface of the frame, the connection protrusions being in contact with electrode terminals of the battery cell, a protection circuit module (PCM) mounted to the connecting member, the PCM including connection grooves, into which the connection protrusions are inserted such that the PCM can be coupled to the connecting member, and which are connected to a protection circuit, and a cap housing coupled to the connecting member or the battery cell while the PCM is surrounded by the cap housing.

Abstract: An array substrate includes a substrate, a gate line on the substrate, a data line crossing the gate line to define a pixel region, a thin film transistor connected to the gate and data lines, a pixel electrode in the pixel region, and a common electrode including first, second, third, fourth and fifth portions, wherein the first and second portions are disposed at both sides of the data line, each of the third and fourth portions is connected to the first and second portions, and the fifth portion is connected to the second portion and is extended into a next pixel region adjacent to the pixel region.

Abstract: An image forming apparatus includes a main controller unit provided in a main body of the image forming apparatus. The main controller includes a replacement component management memory to store lifespan information of a replacement component is provided in An authentication operation is performed with respect to the replacement component management memory, and the lifespan information of the replacement component is encrypted and stored in the replacement component management memory. Accordingly, the security of the main controller unit may be enhanced and illegal use of the replacement component may be prevented.

Abstract: A semiconductor device includes an isolation layer defining an active region formed in a semiconductor substrate. A first recessing process is performed on the isolation layer to expose edge portions of the active region. A first rounding process is performed to round the edge portions of the active region. A second recessing process is performed on the isolation layer. A second rounding process is performed to round the edge portions of the active region.

Abstract: A print head includes a first nozzle group which includes a plurality of first nozzles arranged linearly, and a second nozzle group and a third nozzle group which include a plurality of second nozzles and a plurality of third nozzles arranged linearly, and are disposed in parallel with each other and spaced from the first nozzle group by a first interval and a second interval at opposite sides of the first nozzle group, respectively.

Abstract: In a method of manufacturing a floating gate of a non-volatile semiconductor memory, a pattern is formed on a substrate to have an opening that exposes a portion of the substrate. A first preliminary polysilicon layer is formed on the pattern and the exposed portion of the substrate to substantially fill the opening. A first polysilicon layer is formed by partially etching the first preliminary polysilicon layer until a first void formed in the first preliminary polysilicon layer is exposed. A second polysilicon layer is formed on the first polysilicon layer.

Abstract: A semiconductor device includes an isolation layer defining an active region formed in a semiconductor substrate. A first recessing process is performed on the isolation layer to expose edge portions of the active region. A first rounding process is performed to round the edge portions of the active region. A second recessing process is performed on the isolation layer. A second rounding process is performed to round the edge portions of the active region.

Abstract: An array substrate includes a substrate, a gate line on the substrate, a data line crossing the gate line to define a pixel region, a thin film transistor connected to the gate and data lines, a pixel electrode in the pixel region, and a common electrode including first, second, third, fourth and fifth portions, wherein the first and second portions are disposed at both sides of the data line, each of the third and fourth portions is connected to the first and second portions, and the fifth portion is connected to the second portion and is extended into a next pixel region adjacent to the pixel region.

Abstract: Provided are an apparatus and method of grouping and displaying messages. The apparatus verifies a grouping condition corresponding to messages, generates group message boxes obtained by grouping the messages based on the grouping condition, and displays the group message boxes. The group message boxes are connected with a reference axis, and the reference axis is used to arrange the group message boxes according to the grouping condition.

Abstract: A landmark display apparatus and method are provided. The landmark display apparatus may extract a landmark from lifelog information, locate the extracted landmark on a time axis, and display the landmark on the time axis. Also, when lifelog information associated with a landmark is displayed, the landmark may be displayed on the displayed lifelog information.

Abstract: A semiconductor device includes an isolation layer defining an active region formed in a semiconductor substrate. A first recessing process is performed on the isolation layer to expose edge portions of the active region. A first rounding process is performed to round the edge portions of the active region. A second recessing process is performed on the isolation layer. A second rounding process is performed to round the edge portions of the active region.

Abstract: The present invention relates to a novel iridium complex into which carbazole-substituted pyridine derivatives and various substituents-substituted phenyl derivatives are introduced as main ligand and a electrophosphorescence diode containing the same as a dopant of a light-emitting layer. When the iridium complex according to the present invention is applied to an organic light-emitting diode, the heat-resistance property and the light-emitting property can be significantly improved as well as the light-emitting efficiency and the like can be significantly improved by doping the iridium complex compound into the light-emitting layer as compared to the conventional organic light-emitting diode.

Abstract: Disclosed herein is a method of manufacturing a barrier rib for a plasma display panel, including a silicon compound resin. The method according to a first embodiment of this invention includes providing a silicon compound resin layer on a substrate; pressing the silicon compound resin layer using a master having a pattern corresponding to the shape of a barrier rib to be transferred; and curing the silicon compound resin and then releasing the master. In addition, the method according to a second embodiment includes loading a silicon compound resin into grooves of a master having a pattern corresponding to the shape of a barrier rib; pressing the master on a substrate to transfer the silicon compound to the substrate; and curing the transferred silicon compound resin and then releasing the master.