Abstract: A storage device may include a memory device and a memory controller. The memory device may include a plurality of physical pages. The memory controller may include a plurality of physical pages. The memory controller may group the plurality of physical pages into a plurality of stress physical page groups according to a stress level of each of the plurality of physical pages, the stress level associated with read disturb, and perform a garbage collection operation on each of the plurality of stress physical page groups, based on the stress level.

Abstract: Disclosed is a method of manufacturing an insulating sheet, comprising: forming at least a groove on a flat sheet; a first cutting step for cutting a side surface of the groove by irradiating a laser beam to a side surface of the sheet; a second cutting step for cutting the insulating sheet to completely separate the groove from the insulating sheet by irradiating a laser beam from above the groove having the side surface cut; a tape attaching step for attaching a tape to an outer surface of the insulating sheet; and a bending step for bending one end portion of the surface of the insulating sheet having the tape attached toward a place where the tape is attached. It is possible to mass-produce the insulating sheets having a three-dimensional shape, regarded as being difficult to manufacture with a mold.

Abstract: The present invention relates to induction-heated soldering automation equipment and, particularly, to equipment comprising: a jig unit for fixing a substrate on which an electronic element is mounted; a first conveyor for transferring the jig unit; an induction heating unit which is provided above the jig unit so as to be movable in the X-axis, Y-axis, and Z-axis directions, and which includes a magnetic induction coil for soldering the electronic element by induction-heating the substrate fixed to the jig unit; and a controller for controlling the first conveyor and the induction heating unit, wherein continuously supplied molded interconnected devices (MIDs), PCBs, or FPCBs are locally heated through contactless induction heating so that electronic elements can be automatically soldered in a state in which thermal damage is minimized.

Abstract: A method of manufacturing interior parts for a vehicle includes: forming a first plating layer on a surface of an injection molded product through electroless plating; printing a symbol part on the first plating layer; partially removing the first plating layer to a size corresponding to the symbol part from a rear surface of the injection molded product; forming a second plating layer on the first plating layer; and removing the symbol part and the first plating layer from the surface of the injection molded product on which the second plating layer is formed.

Abstract: Disclosed herein are an apparatus and method for an adaptive checkpoint in intermittent computing. The apparatus for an adaptive checkpoint in intermittent computing includes memory in which at least one program is recorded and a processor for executing the program. The program may perform statically setting locations at which checkpoints are to be performed at compile time of program code and dynamically determining whether to perform the checkpoints depending on energy-harvesting conditions at runtime of the program code.

Abstract: Disclosed is a method of manufacturing an insulating sheet, comprising: forming at least a groove on a flat sheet; a first cutting step for cutting a side surface of the groove by irradiating a laser beam to a side surface of the sheet; a second cutting step for cutting the insulating sheet to completely separate the groove from the insulating sheet by irradiating a laser beam from above the groove having the side surface cut; a tape attaching step for attaching a tape to an outer surface of the insulating sheet; and a bending step for bending one end portion of the surface of the insulating sheet having the tape attached toward a place where the tape is attached. It is possible to mass-produce the insulating sheets having a three-dimensional shape, regarded as being difficult to manufacture with a mold.

Abstract: An electrode slurry control device may include a main body configured to receive electrode slurry from an outside storage, a coater configured to discharge electrode slurry, a supply tube configured to supply the electrode slurry to the coater and connected to the main body through a first connection tube having a first opening/closing member, a first circulation tube connected to the main body through a second connection tube having a second opening/closing member; and a second circulation tube connected to the main body through a third connection tube having a third opening/closing member, a diameter of an inner peripheral surface of the second connection tube is smaller than an average diameter of an inner peripheral surface of the first circulation tube, and a diameter of an inner peripheral surface of the third connection tube is larger than an average diameter of an inner peripheral surface of the second connection tube.

Abstract: A light-emitting diode (LED) lamp for a vehicle and a method of manufacturing the same use MID and magnetic induction technologies. The LED lamp includes a LED module, a housing accommodating the LED module, and a molded interconnect device (MID) electrode formed on a surface of the housing. The LED module may be mounted on the MID electrode by soldering using magnetic induction heating, the housing may be an injection molded product, and the MID electrode may be formed on the housing using a MID process.

Abstract: A memory device may include a plurality of memory cells, a plurality of word lines, and a plurality of bit lines. The memory device may determine, when programming a first memory cell among the plurality of memory cells to a target program state, a precharge time based on a number of times that a program voltage is applied to a first word line connected to the first memory cell among the plurality of word lines, and may precharge the plurality of bit lines during the precharge time when executing a verify operation on the first memory cell.

Abstract: Disclosed herein are an apparatus and method for an adaptive checkpoint in intermittent computing. The apparatus for an adaptive checkpoint in intermittent computing includes memory in which at least one program is recorded and a processor for executing the program. The program may perform statically setting locations at which checkpoints are to be performed at compile time of program code and dynamically determining whether to perform the checkpoints depending on energy-harvesting conditions at runtime of the program code.

Abstract: A light-emitting diode (LED) lamp for a vehicle and a method of manufacturing the same use MID and magnetic induction technologies. The LED lamp includes a LED module, a housing accommodating the LED module, and a molded interconnect device (MID) electrode formed on a surface of the housing. The LED module may be mounted on the MID electrode by soldering using magnetic induction heating, the housing may be an injection molded product, and the MID electrode may be formed on the housing using a MID process.

Abstract: Embodiments of the present disclosure relate to a memory device and an operating method of the memory device. According to embodiments of the present disclosure, a memory device may include a plurality of memory cells, a plurality of word lines, and a plurality of bit lines, wherein the memory device may determine, when programming a first memory cell among the plurality of memory cells to a target program state, a precharge time based on a number of times that a program voltage is applied to a first word line connected to the first memory cell among the plurality of word lines, and may precharge the plurality of bit lines during the precharge time when executing a verify operation on the first memory cell.

Abstract: Provided herein may be a memory system and a method of operating the memory system. The memory system may include a memory device including a plurality of memory blocks, and a memory controller configured to: manage an accumulated erase count value and an open block erase count value of each of the plurality of memory blocks, and select a target memory block on which a program operation is to be performed based on the accumulated erase count value and the open block erase count value of each of the plurality of memory blocks.

Abstract: A semiconductor memory device includes a memory cell array, a read/write circuit, control logic, and a bit flip sensor. The memory cell array includes a plurality of memory cells. The read/write circuit is configured to receive program data, and perform a program operation on selected memory cells among the plurality of memory cells, based on the program data. The bit flip sensor is configured to receive the program data from the read/write circuit, and determine whether a bit flip has occurred in the program data. The control logic is configured to control the program operation of the read/write circuit, and generate program status information, based on a determination result of the bit flip sensor.

Abstract: Provided herein may be a memory system and a method of operating the memory system. The memory system may include a memory device including a plurality of memory blocks, and a memory controller configured to: manage an accumulated erase count value and an open block erase count value of each of the plurality of memory blocks, and select a target memory block on which a program operation is to be performed based on the accumulated erase count value and the open block erase count value of each of the plurality of memory blocks.

Abstract: A semiconductor memory device includes a memory cell array, a read/write circuit, control logic, and a bit flip sensor. The memory cell array includes a plurality of memory cells. The read/write circuit is configured to receive program data, and perform a program operation on selected memory cells among the plurality of memory cells, based on the program data. The bit flip sensor is configured to receive the program data from the read/write circuit, and determine whether a bit flip has occurred in the program data. The control logic is configured to control the program operation of the read/write circuit, and generate program status information, based on a determination result of the bit flip sensor.

Abstract: There are provided a memory system and an operating method of the memory system. The memory system includes: a memory device including a plurality of semiconductor memories; and a controller for controlling the memory device to perform a bad block detection operation on free blocks among a plurality of memory blocks included in a selected semiconductor memory among the plurality of semiconductor memories. The controller selects, as a target memory block, memory blocks adjacent to a bad bock detected based on a result of the bad block detection operation, and controls the memory device to perform the bad block detection operation on the target memory block.

Abstract: A method of handling a page fault occurring in a non-volatile main memory system including analyzing a pattern of occurrence of the page fault based on the page fault when the page fault occurs, setting the number of pages to be consecutively processed based on analysis result of the analyzing, and consecutively processing as many pages as the number may be provided.

Abstract: The present invention relates to a magnet-integrated-type torque angle sensor module and, more particularly, to a torque angle sensor module that integrates magnets used for detecting steering direction, steering angle, torque, and steering speed and simplifies component configuration, capable of minimizing the rate of defects during assembly, improving disassembling ability, and inducing performance stabilization.

Abstract: An electronic device and a method a provided. The electronic device includes a first surface, a second surface opposite to the first surface, and a side surface that surrounds at least part of a space between the first and second surfaces; a Radio Frequency (RF) communication circuit; an antenna radiator that forms at least part of at least one of the first surface, the second surface, and the side surface and is connected to the RF communication circuit; a sensor that detects whether an external object contacts the antenna radiator; a switching circuit connected to the antenna radiator and the sensor; and a processor configured to receive a first value from the sensor when the antenna radiator and the sensor are connected to each other and to receive a second value from the sensor when the antenna radiator and the sensor are separated from each other.