Patents by Inventor Jung-Soo Kim

Jung-Soo Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11758650
    Abstract: A flexible printed circuit board includes a base film; a circuit pattern disposed on one surface of the base film; and a coverlay film covering the circuit pattern. The base film is divided into a flexible area and a rigid area, and the circuit pattern of the flexible area comprises a portion thinner than a portion of the circuit pattern of the rigid area.
    Type: Grant
    Filed: April 30, 2021
    Date of Patent: September 12, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dae Jung Byun, Jung Soo Kim, Sang Hyun Sim, Chang Min Ha, Jin Won Lee
  • Patent number: 11744033
    Abstract: A storage device assembly is provided. The storage device assembly includes a latch assembly having a body and a hook mounted on the body, the hook having elasticity and having distal ends thereof bend away from the body; and a storage device to be joined to the latch assembly. The storage device includes a memory module including a memory connector, and a first enclosure and a second enclosure that encase the memory module except for an opening through which the memory connector is accessible. The first enclosure includes fixing holes corresponding to the distal ends of the hook and configured to accommodate the distal ends of the hook in a configuration in which the storage device is joined to the latch assembly.
    Type: Grant
    Filed: April 12, 2021
    Date of Patent: August 29, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sung Chui Hur, Bum Jun Kim, Jung Soo Kim, Young Seok Hong
  • Patent number: 11744012
    Abstract: A printed circuit board includes a first insulating layer having a first modulus; a second insulating layer disposed on the first insulating layer and having a second modulus; and a cavity penetrating the second insulating layer, wherein the second modulus is greater than the first modulus, and wherein an edge portion of a bottom surface of the cavity is formed of an insulating material.
    Type: Grant
    Filed: March 11, 2021
    Date of Patent: August 29, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dae Jung Byun, Mi Sun Hwang, Jung Soo Kim, Jin Won Lee, Duck Young Maeng
  • Patent number: 11602308
    Abstract: Provided are a system and method for informing of attachment positions of electrocardiogram (ECG) electrodes to improve the quality of ECG data. The system includes a judgment indicator extractor configured to extract a plurality of judgment indicator values from ECG data obtained through ECG electrodes, a reference value setter configured to, in a user-specific reference value setting mode, collect the judgment indicator values for a plurality of pieces of ECG data extracted by the judgment indicator extractor and set user-specific reference values for each judgment indicator, a similarity determiner configured to, in an ECG measurement mode, determine similarity by comparing a plurality of judgment indicator values extracted by the judgment indicator extractor with the user-specific reference values, and an electrode attachment position guide configured to inform a user of attachment positions of the ECG electrodes according to a similarity determination result of each of the judgment indicator values.
    Type: Grant
    Filed: March 5, 2021
    Date of Patent: March 14, 2023
    Assignee: WELLYSIS CORP.
    Inventors: Young Juhn, Byung Ki Moon, Jong Woo Kim, Rick Hongryul Kim, Jung Soo Kim, Jae Woo So
  • Patent number: 11576254
    Abstract: A cable substrate includes an insulating layer, a slit portion penetrating through at least a portion of the insulating layer in a thickness direction of the insulating layer, and a dummy pattern disposed on the insulating layer. At least a portion of the dummy pattern is exposed to the slit portion.
    Type: Grant
    Filed: March 11, 2021
    Date of Patent: February 7, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jung Soo Kim, Dae Jung Byun, Sang Hyun Sim, Chang Min Ha
  • Publication number: 20220401951
    Abstract: Provided is a cell culture test device including a plurality of well units. Each of the well units includes a first inlet portion through which a first fluid is introduced, a first accommodation space communicating with the first inlet portion to accommodate a flow of the first fluid introduced through the first inlet portion, a second inlet portion through which a second fluid is introduced, and a second accommodation space in which the second fluid is accommodated. The second accommodation space accommodates an island structure connected with an island-connecting structure extending from the wall surface of the second accommodation space. A third inlet portion through which an antibiotic is loaded is formed above the island structure. The antibiotic loaded through the third inlet portion is fixedly accommodated on the inner and outer surfaces of the island structure.
    Type: Application
    Filed: October 6, 2020
    Publication date: December 22, 2022
    Inventors: Jung Soo KIM, Tae Geun LIM, Gi Yoon LEE, Dong Young KIM
  • Publication number: 20220367044
    Abstract: The present invention relates to an electrocardiogram analysis matching support service system that supports timely and real-time analysis of an individual's electrocardiogram, and it is characterized in that it includes: a patient service app module that is installed and executed in a patient's mobile communication terminal, transmits an electrocardiogram measurement data received from a wearable electrocardiogram measurement device, requests for reading, and receives and displays the result of the reading; and a patient and medical staff matching server that reads the electrocardiogram measurement data transmitted from the patient service app module using a deep learning trained artificial intelligence network model, selects pre-registered medical staff according to the result of the reading, and supports reading the electrocardiogram measurement data.
    Type: Application
    Filed: June 24, 2021
    Publication date: November 17, 2022
    Applicant: Wellysis Corp.
    Inventors: Young JUHN, Rick Hongryul KIM, Jong Woo KIM, Jung Soo KIM
  • Patent number: 11460247
    Abstract: A vacuum dryer including a chamber configured to provide an interior space, support pins in the interior space proximate to a bottom of the chamber, a power supply configured to supply power to the support pins, and a pump coupled to the interior space in the chamber.
    Type: Grant
    Filed: February 19, 2020
    Date of Patent: October 4, 2022
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jung Wook Lee, Yeon Ju Kwon, Do Hyun Kim, Jung Soo Kim, Ga Hee Park, Ha Jun Song, Do Yoon Lee, Hun Hyeon Im
  • Patent number: 11439026
    Abstract: A method for manufacturing a printed circuit board includes forming a through hole in an insulating layer of the printed circuit board, filling the through hole by plating to form a plating layer on the insulating layer, and removing the plating layer from the insulating layer; and forming a circuit pattern on the insulating layer.
    Type: Grant
    Filed: February 24, 2020
    Date of Patent: September 6, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jung-Soo Kim, Jin-Won Lee
  • Publication number: 20220174812
    Abstract: A cable substrate includes an insulating layer, a slit portion penetrating through at least a portion of the insulating layer in a thickness direction of the insulating layer, and a dummy pattern disposed on the insulating layer. At least a portion of the dummy pattern is exposed to the slit portion.
    Type: Application
    Filed: March 11, 2021
    Publication date: June 2, 2022
    Inventors: Jung Soo KIM, Dae Jung BYUN, Sang Hyun SIM, Chang Min HA
  • Publication number: 20220167496
    Abstract: A flexible printed circuit board includes a base film; a circuit pattern disposed on one surface of the base film; and a coverlay film covering the circuit pattern. The base film is divided into a flexible area and a rigid area, and the circuit pattern of the flexible area comprises a portion thinner than a portion of the circuit pattern of the rigid area.
    Type: Application
    Filed: April 30, 2021
    Publication date: May 26, 2022
    Inventors: Dae Jung Byun, Jung Soo Kim, Sang Hyun Sim, Chang Min Ha, Jin Won Lee
  • Publication number: 20220133229
    Abstract: Provided are a system and method for informing of attachment positions of electrocardiogram (ECG) electrodes to improve the quality of ECG data. The system includes a judgment indicator extractor configured to extract a plurality of judgment indicator values from ECG data obtained through ECG electrodes, a reference value setter configured to, in a user-specific reference value setting mode, collect the judgment indicator values for a plurality of pieces of ECG data extracted by the judgment indicator extractor and set user-specific reference values for each judgment indicator, a similarity determiner configured to, in an ECG measurement mode, determine similarity by comparing a plurality of judgment indicator values extracted by the judgment indicator extractor with the user-specific reference values, and an electrode attachment position guide configured to inform a user of attachment positions of the ECG electrodes according to a similarity determination result of each of the judgment indicator values.
    Type: Application
    Filed: March 5, 2021
    Publication date: May 5, 2022
    Applicant: Wellysis Corp.
    Inventors: Young JUHN, Byung Ki MOON, Jong Woo KIM, Rick Hongryul KIM, Jung Soo KIM, Jae Woo SO
  • Publication number: 20220117107
    Abstract: A storage device assembly is provided. The storage device assembly includes a latch assembly having a body and a hook mounted on the body, the hook having elasticity and having distal ends thereof bend away from the body; and a storage device to be joined to the latch assembly. The storage device includes a memory module including a memory connector, and a first enclosure and a second enclosure that encase the memory module except for an opening through which the memory connector is accessible. The first enclosure includes fixing holes corresponding to the distal ends of the hook and configured to accommodate the distal ends of the hook in a configuration in which the storage device is joined to the latch assembly.
    Type: Application
    Filed: April 12, 2021
    Publication date: April 14, 2022
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sung Chul HUR, Bum Jun KIM, Jung Soo KIM, Young Seok HONG
  • Publication number: 20220095458
    Abstract: A printed circuit board includes a first insulating layer disposed on a flexible region and a rigid region; and a first wiring layer disposed on one surface of the first insulating layer in the rigid region and the flexible region. A thickness of the first wiring layer in at least a portion of the rigid region is greater than a thickness of the first wiring layer in the flexible region.
    Type: Application
    Filed: December 17, 2020
    Publication date: March 24, 2022
    Inventors: Jung Soo KIM, Dae Jung BYUN, Chang Min HA, Sang Hyun SIM
  • Publication number: 20220095449
    Abstract: A printed circuit board includes a first substrate portion including a plurality of first insulating layers, a plurality of first wiring layers respectively disposed on the plurality of first insulating layers, and a plurality of first adhesive layers respectively disposed between the plurality of first insulating layers to respectively cover the plurality of first wiring layers; and a second substrate portion disposed on the first substrate portion, and including a plurality of second insulating layers, a plurality of second wiring layers respectively disposed on the plurality of second insulating layers, and a plurality of second adhesive layers respectively disposed between the plurality of second insulating layers to respectively cover the plurality of second wiring layers.
    Type: Application
    Filed: December 17, 2020
    Publication date: March 24, 2022
    Inventors: Dae Jung BYUN, Jung Soo KIM, Sang Hyun SIM, Chang Min HA, Tae Hong MIN, Jin Won LEE
  • Publication number: 20220078905
    Abstract: A printed circuit board includes a first insulating layer having a first modulus; a second insulating layer disposed on the first insulating layer and having a second modulus; and a cavity penetrating the second insulating layer, wherein the second modulus is greater than the first modulus, and wherein an edge portion of a bottom surface of the cavity is formed of an insulating material.
    Type: Application
    Filed: March 11, 2021
    Publication date: March 10, 2022
    Inventors: Dae Jung BYUN, Mi Sun HWANG, Jung Soo KIM, Jin Won LEE, Duck Young MAENG
  • Patent number: 11256099
    Abstract: A head-mounted display (HMD) apparatus includes a main body having a first surface facing a user's facial side, at least one connecting part connected to at least one surface of the main body, and a wearing part having a strap form, the wearing part being connected to the at least one connecting part and surrounding a portion of a head of the user such that the main body is held on the user's facial side. The main body includes a first support part extending from a portion of the first surface. The wearing part includes a second support part formed on an inner circumferential surface of a front portion of the wearing part facing a forehead of the user. The first support part and the second support part are supported on the user's forehead, thereby minimizing pressure exerted on zygomatic regions and relieving pressure and weight felt by the user.
    Type: Grant
    Filed: May 9, 2018
    Date of Patent: February 22, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jung Hoon Park, Tae Hyung Kwon, Jung Soo Kim, Joong Kyung Park, Won Ho Shin, Young Gun Lee, Jin Choul Lee, Hyoung Gil Choi
  • Patent number: 11229117
    Abstract: A printed circuit board includes: an insulating layer having one surface and the other surface; metal layers respectively disposed on the one surface and the other surface of the insulating layer; a through-hole penetrating through the insulating layer and the metal layers; a first plating layer disposed in a center portion of the through-hole in a thickness direction thereof; and a plug disposed in the through-hole.
    Type: Grant
    Filed: January 27, 2021
    Date of Patent: January 18, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jung Soo Kim, Jin Won Lee, Woo Seok Jeon
  • Patent number: 11189567
    Abstract: A semiconductor package includes: a connection structure having first and second surfaces opposing each other and including a redistribution layer; a semiconductor chip disposed on the first surface of the connection structure and having connection pads connected to the redistribution layer; an encapsulant disposed on the first surface of the connection structure, encapsulating the semiconductor chip, and including an opaque or translucent resin; a mark indicating identification information and carved in the encapsulant; and a passivation layer disposed on the encapsulant and including a transparent resin.
    Type: Grant
    Filed: September 24, 2019
    Date of Patent: November 30, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Pyung Hwa Han, Jung Soo Kim, Won Choi, Sung Hawn Bae
  • Publication number: 20210343659
    Abstract: A fan-out semiconductor package includes a core member having a through hole, at least one dummy structure disposed in the core member, a semiconductor chip disposed in the through hole and including an active surface on which a connection pad is disposed and an inactive surface opposing the active surface, an encapsulant sealing at least a portion of each of the core member and the semiconductor chip, and filing at least a portion of the through hole, and a connection member disposed on the core member and the active surface of the semiconductor chip, and including a redistribution layer electrically connected to the connection pad.
    Type: Application
    Filed: July 7, 2021
    Publication date: November 4, 2021
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Jung Soo KIM