Abstract: A frequency locked loop is disclosed. The disclosed frequency locked loop may include: a voltage-controlled oscillator configured to output a LO signal; a mixer configured to mix an RF signal with the LO signal to output an IF signal; a first IF path part configured to transfer the IF signal; a second IF path part configured to transfer the IF signal; and an error amplifier configured to receive output signals of the first IF path part and output signals of the second IF part as input, where the voltage-controlled oscillator adjusts a frequency of the LO signal based on an output signal of the error amplifier, the first IF path part has the conversion gain decreased according to an increase in the frequency of the IF signal, and the second IF path part has the conversion gain increased according to an increase in the frequency of the IF signal.

Abstract: A fan-out semiconductor package includes a core member having a through hole, at least one dummy structure disposed in the core member, a semiconductor chip disposed in the through hole and including an active surface on which a connection pad is disposed and an inactive surface opposing the active surface, an encapsulant sealing at least a portion of each of the core member and the semiconductor chip, and filling at least a portion of the through hole, and a connection member disposed on the core member and the active surface of the semiconductor chip, and including a redistribution layer electrically connected to the connection pad.

Abstract: A nonvolatile memory device includes a memory cell array, a voltage generator, and a control circuit. The voltage generator generates word-line voltages to be applied to the memory cell array. The control circuit generates control signals that control the voltage generator in response to a command and an address. The control circuit includes a hacking detection circuit. The hacking detection circuit disables an operation of the nonvolatile memory device when a hacking is detected, wherein the hacking is detected when an access sequence of the command and the address does not match a standard sequence of the nonvolatile memory device a consecutive number of times.

Abstract: Provided are an auto focus (AF) locking unit and a photo-graphing apparatus including the AF locking unit. In particular, the AF locking unit supports a lens group barrel holder that is descended by a movement of a front barrel in an optical axis direction by using a locking lever provided with an elastic force, and the photographing apparatus includes the AF locking unit. According to an embodiment, the AF locking unit supports the lens group barrel holder including lenses in the optical axis direction by using a driving force transmitted from a motor in correspondence to movements of a cam barrel and a front barrel, and the photographing apparatus includes the AF locking unit.

Abstract: An electronic device is provided. The electronic device mountable on a head of a user includes a display, a sensor configured to capture an image, a processor electrically connected with the display and the sensor, and a memory electrically connected with the processor, wherein the memory includes instructions, which, when executed, cause the processor to provide a guide screen that guides the user to gaze at a front of a display, to capture an image, in which at least a portion of an eye of the user is included, using the sensor, and to determine a wearing state of the electronic device based on at least one of a location of the eye or a location of a pupil of the user displayed in the captured image.

Abstract: A head-mounted display (HMD) apparatus includes a main body having a first surface facing a user's facial side, at least one connecting part connected to at least one surface of the main body, and a wearing part having a strap form, the wearing part being connected to the at least one connecting part and surrounding a portion of a head of the user such that the main body is held on the user's facial side. The main body includes a first support part extending from a portion of the first surface. The wearing part includes a second support part formed on an inner circumferential surface of a front portion of the wearing part facing a forehead of the user. The first support part and the second support part are supported on the user's forehead, thereby minimizing pressure exerted on zygomatic regions and relieving pressure and weight felt by the user.

Abstract: An optical measuring method includes generating a Bessel beam, filtering the Bessel beam to generate a focused Bessel beam, vertically irradiating the focused Bessel beam onto a substrate in which an opening is formed, and detecting light reflected from the substrate to obtain an image of a bottom surface of the opening.

Abstract: A 3D profiling system of a semiconductor chip is provided and includes a storage unit that receives scanning electron microscope (SEM) images of a plurality of semiconductor devices having respective data with respect to a plurality of different components and gray levels of each SEM image. An extraction unit that performs principal component analysis (PCA) on the gray level of the SEM image and separates principal components from among the plurality of different components is also part of the system. Additionally, a calculation unit receives provision of actually measured values of the plurality of semiconductor devices, and applies a multiple linear regression to the principal components based on the measured values to complete a 3D profile of the semiconductor chip.

Abstract: A lens assembly and an electronic device are provided. The lens assembly and/or the electronic device includes a lens barrel, a housing configured to accommodate the lens barrel on one surface of the housing, and an image sensor assembly mounted to the other surface of the housing, the image sensor being configured to rotate around an optical axis of the lens barrel. The image sensor assembly includes a ring-shaped rotation member facing the other surface of the housing, and a plurality of balls interposed between the rotation member and the other surface of the housing. The rotation member rotates on a plane perpendicular to the optical axis.

Abstract: Disclosed is a device for protection a program. The device includes a protection domain unit including an encrypted protection domain, a start point display unit configured to display a start point of the encrypted protection domain, and an end point display unit configured to display an end point of the encrypted protection domain; and a protection domain connection unit including a decryption unit configured to generate a running code unit by decrypting the encrypted protection domain and a protection domain calling unit configured to call the running code unit.

Abstract: A semiconductor device inspecting apparatus includes a light source for emitting light to a semiconductor pattern. The semiconductor pattern includes a structure that reflects the light from the light source. The semiconductor device inspecting apparatus further includes an objective optical system disposed in a path of the reflected light from the semiconductor pattern, and a first noise filter disposed in a path of the reflected light having passed through the objective optical system, the first noise filter including at least one bar pattern that filters a diffraction noise of the light. The semiconductor device inspecting apparatus additionally includes a second noise filter disposed in a path of the filtered light from the first noise filter, the second noise filter including an outer frame surrounding a central portion. The semiconductor device inspecting apparatus further includes a first photodetector detecting the light having passed through the second noise filter.

Abstract: According to an embodiment, an electronic device including a camera lens module having a miniaturization and a lightening function, as well as a hand-trembling correction function mounted thereon, is described. The camera lens module may include a base, a first moving part containing a lens assembly and coupled to the base, and a second moving part. The first moving part may be configured to move on a plane perpendicular to the optical axis of the lens assembly. The second moving part may be disposed under the base and configured to move in the optical axis direction of the lens assembly. A variable gap between the first moving part and the second moving part may have a distance that varies based on a movement of the second moving part forward or backward in the optical axis direction.

Abstract: Disclosed is a process of preparing sustained release microspheres, containing a biodegradable polymer as a carrier and a drug, using spray drying. The process comprises preparing a solution, suspension or emulsion containing a biodegradable polymer, a drug and a solvent; spray drying the solution, suspension or emulsion; and suspending spray-dried microspheres in an aqueous solution containing polyvinyl alcohol to remove the residual solvent and increase the hydrophilicity of the microsphere surface. The process enables the preparation of microspheres having high drug encapsulation efficiency, almost not having a toxicity problem due to the residual solvent, and having good syringeability. The microspheres prepared according to the present invention release an effective concentration of a drug in a sustained manner for a predetermined period when administered to the body, and are thus useful in the treatment of diseases.

Abstract: A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole; an encapsulant encapsulating at least portions of the first interconnection member and the semiconductor chip; a second interconnection member disposed on the first interconnection member and the semiconductor chip and including redistribution layers electrically connected to the connection pads of the semiconductor chip; a passivation layer disposed on the second interconnection member and having openings exposing at least portions of the redistribution layer of the second interconnection member; and an under-bump metal layer disposed on the passivation layer and filling at least portions of the openings. In the under-bump metal layer, the number of conductor layers formed on a surface of the passivation layer is different from that of conductor layers formed on the exposed redistribution layer and walls of the openings.

Abstract: A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole; an encapsulant encapsulating at least portions of the first interconnection member and the semiconductor chip; a second interconnection member disposed on the first interconnection member and the semiconductor chip and including redistribution layers electrically connected to the connection pads of the semiconductor chip; a passivation layer disposed on the second interconnection member and having openings exposing at least portions of the redistribution layer of the second interconnection member; and an under-bump metal layer disposed on the passivation layer and filling at least portions of the openings. In the under-bump metal layer, the number of conductor layers formed on a surface of the passivation layer is different from that of conductor layers formed on the exposed redistribution layer and walls of the openings.

Abstract: In a method for verifying the integrity of first to Nth binaries (N is a natural number greater than or equal to 2), the method may comprise: loading the first to Nth binaries into a main memory in order to execute the binaries; verifying a self hash to verify, by the Kth binary (K=1, . . . , N?1) which has been loaded into the main memory, the integrity thereof by using a hash; and verifying a link hash by setting any one of the first to Kth binaries as a verification binary and setting a (K+1)th binary to be loaded into the main memory as a binary to be verified so that the verification binary verifies the integrity of the binary to be verified by using a hash.

Abstract: The present invention relates to a poly(ethylene-aliphatic diene)-g-polystyrene-based copolymer having an improved mechanical property and heat resistance, and a method for preparing the same. More particularly, the present invention relates to a poly(ethylene-aliphatic diene)-g-polystyrene-based copolymer, which includes an ethylene-aliphatic diene copolymer as a soft segment and a polystyrene-based polymer grafted to the soft segment as a hard segment, and a method for preparing the same. The poly(ethylene-aliphatic diene)-g-polystyrene-based copolymer has elasticity equivalent to that of SBS or SEBS, and improved mechanical properties such as tensile strength and heat resistance, thereby being used as a substituent for SBS or SEBS.

Abstract: A 3D profiling system of a semiconductor chip is provided and includes a storage unit that receives scanning electron microscope (SEM) images of a plurality of semiconductor devices having respective data with respect to a plurality of different components and gray levels of each SEM image. An extraction unit that performs principal component analysis (PCA) on the gray level of the SEM image and separates principal components from among the plurality of different components is also part of the system. Additionally, a calculation unit receives provision of actually measured values of the plurality of semiconductor devices, and applies a multiple linear regression to the principal components based on the measured values to complete a 3D profile of the semiconductor chip.

Abstract: A lens assembly and an electronic device are provided. The lens assembly and/or the electronic device includes a lens barrel, a housing configured to accommodate the lens barrel on one surface of the housing, and an image sensor assembly mounted to the other surface of the housing, the image sensor being configured to rotate around an optical axis of the lens barrel. The image sensor assembly includes a ring-shaped rotation member facing the other surface of the housing, and a plurality of balls interposed between the rotation member and the other surface of the housing. The rotation member rotates on a plane perpendicular to the optical axis.

Abstract: A structure analysis method using a scanning electron microscope includes irradiating a sample with an electron beam having a first landing energy to obtain a first image at a first depth of the sample and accelerating the electron beam to have a second landing energy higher than the first landing energy to obtain a second image at a second depth of the sample.