Patents by Inventor Jung Yu

Jung Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Real-time charging system and method for managing QoS and charging rule of service
    Patent number: 8913508
    Abstract: A method for controlling a charging condition change in a real-time charging system that sends a QoS and charging rule request to be applied to a user terminal from a packet processing node to a real-time charging function server. If a charging condition change is detected, a charging rule change request is sent to a management server and a changed QoS and charging rule is sent, from the management server to the real-time charging function server. The changed QoS and charging rule is sent from the QoS and charging rule management server to the packet processing node. The changed QoS and charging rule are forwarded from the packet processing node to the real-time charging function server and, at the real-time charging function server, quotas for the user terminal are reallocated according to the changed QoS and charging rule.
    Type: Grant
    Filed: August 30, 2010
    Date of Patent: December 16, 2014
    Assignee: Samsung Electronics Co., Ltd
    Inventor: Su Jung Yu
  • Rear shock-absorbing device
    Patent number: 8887881
    Abstract: A shock-absorbing device includes a first cylinder with a first room defined therein and a room is defined in an end of the first cylinder. A second cylinder extends into the first cylinder and has a first piston so as to define a third room and a third room. Hydraulic liquid is filled in the second and third rooms. A first tube and a second tube extending through the first tube are located in the first room. A first path and a second path communicate with the recess. The first and second tubes extend into the second cylinder and are connected to the first piston. When the first and second cylinders are relative moved, the hydraulic liquid is controlled to flow or not flow between the first and second paths so as to absorb different levels of shocks, and the speed that the shock-absorbing device returns can be adjusted.
    Type: Grant
    Filed: May 9, 2011
    Date of Patent: November 18, 2014
    Assignee: Kind Shock Hi-Tech Co., Ltd.
    Inventor: Jung Yu Hsu
  • DIRECTIONALLY BIASED VALVE
    Publication number: 20140319401
    Abstract: A valve for regulating fluid flowing bidirectionally therethrough includes a first flow body defining a passage configured to direct fluid flow in a downstream direction defined from the inlet to the outlet. The inlet includes an enlargement configured to provide decreased resistance to fluid flow in the downstream direction relative to flow in an upstream direction opposite the downstream direction.
    Type: Application
    Filed: April 29, 2013
    Publication date: October 30, 2014
    Applicant: DELAVAN INC
    Inventors: Jason Allen Ryon, Chien-Jung Yu, Philip E. O. Buelow, Neal Thomson
  • Misting control method of clothing dryer
    Patent number: 8863403
    Abstract: Disclosed herein is a control method of clothing dryer that sprays an appropriate amount of mist based on the amount of clothing and dries the clothing at a fiber rearrangement temperature to remove wrinkles from the clothing. Standard regain of clothing is confirmed, mist is sprayed such that an amount of mist equivalent to approximately twice the standard regain reaches the clothing, and the clothing is dried at the fiber rearrangement temperature, whereby wrinkles are removed from the clothing.
    Type: Grant
    Filed: October 25, 2010
    Date of Patent: October 21, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Bo Ram Lee, Hyun Sook Kim, Hwang Mook Cho, So Jung Yu
  • Apparatus and method for allocating resource in communication system
    Patent number: 8861470
    Abstract: A resource allocation apparatus in a communication system includes an identification unit configured to identify a new frequency band for transmission and reception of data between a plurality of terminals and a first access point, and identify a first frequency band which is being used by a second access point in the new frequency band; a setting unit configured to divide the new frequency band into sub bands of a basic frequency band, and set priorities of the sub bands; and an allocation unit configured to allocate the sub bands in correspondence to the priorities, for transmission and reception of data between the plurality of terminals and the first access point.
    Type: Grant
    Filed: December 20, 2012
    Date of Patent: October 14, 2014
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Min-Ho Cheong, Hee-Jung Yu, Sok-Kyu Lee
  • SEMICONDUCTOR PACKAGES INCLUDING A HEAT SPREADER AND METHODS OF FORMING THE SAME
    Publication number: 20140299980
    Abstract: Semiconductor packages including a heat spreader and methods of forming the same are provided. The semiconductor packages may include a first semiconductor chip, a second semiconductor chip, and a heat spreader stacked sequentially. The semiconductor packages may also include a thermal interface material (TIM) layer surrounding the second semiconductor chip and directly contacting a sidewall of the second semiconductor chip. An upper surface of the TIM layer may directly contact a lower surface of the heat spreader, and a sidewall of the TIM layer may be substantially coplanar with a sidewall of the heat spreader. In some embodiments, a sidewall of the first semiconductor chip may be substantially coplanar with the sidewall of the TIM layer.
    Type: Application
    Filed: January 21, 2014
    Publication date: October 9, 2014
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Eun-Kyoung Choi, Jong-Youn Kim, Sang-Wook Park, Hae-Jung Yu, In-Young Lee, Sang-Uk Han, Ji-Seok Hong
  • METHOD FOR DIRECT COMMUNICATION BETWEEN STATIONS IN WIRELESS LOCAL AREA SYSTEM
    Publication number: 20140301294
    Abstract: Disclosed is a method for direct communication between stations. The method for direct communication between stations may include: receiving scheduling information on a frequency selective transmission (FST) from an access point; setting up a link for communication with another station based on the scheduling information; and communicating with the other station using the link.
    Type: Application
    Filed: March 27, 2014
    Publication date: October 9, 2014
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Hyoung Jin KWON, Jae Seung LEE, Min Ho CHEONG, Sok Kyu LEE, Hee Jung YU
  • Breeding cage for experimental animal
    Patent number: 8851016
    Abstract: A breeding cage for experimental animals is composed of a box body and a cover body covered with the box body. A side of the cover body is disposed with an air intake valve and an air vent valve. A partition is disposed in the cover body to allow an inside of the cover body to define a drainage channel. Fresh air enters from the air intake valve and is then downwardly introduced into the box body through the drainage channel and pushes air originally within the box body to exhaust it away from the air vent valve to allow air within the box body to perform circulation.
    Type: Grant
    Filed: June 8, 2011
    Date of Patent: October 7, 2014
    Assignee: Rung Shin Plastic Industrial Co., Ltd.
    Inventor: Jung Yu Lin
  • DOUBLE PATTERNING VIA TRIANGULAR SHAPED SIDEWALL SPACERS
    Publication number: 20140291735
    Abstract: An intermediate semiconductor structure in fabrication includes a silicon semiconductor substrate, a hard mask of silicon nitride (SiN) over the substrate and a sacrificial layer of polysilicon or amorphous silicon over the hard mask. The sacrificial layer is patterned into sidewall spacers for mandrels of a filler material substantially different in composition from the sidewall spacers, such as a flowable oxide. The mandrels are removed such that the sidewall spacers have vertically tapered inner and outer sidewalls providing a rough triangular shape. The rough triangular sidewall spacers are used as a hard mask to pattern the SiN hard mask below.
    Type: Application
    Filed: March 28, 2013
    Publication date: October 2, 2014
    Applicant: GLOBAL FOUNDRIES, Inc.
    Inventors: HongLiang Shen, Dae-Han Choi, Dae Geun Yang, Jung Yu Hsieh
  • PACKAGE-ON-PACKAGE ELECTRONIC DEVICES INCLUDING SEALING LAYERS AND RELATED METHODS OF FORMING THE SAME
    Publication number: 20140273348
    Abstract: A package-on-package (POP) electronic device may include first and second packaging substrates, a solder interconnection providing electrical and mechanical coupling between the first and second packaging substrates, and first and second sealing layers between the first and second packaging substrates. The first and second sealing layers may be respective first and second epoxy sealing layers. Moreover, the second epoxy sealing layer may include a solder flux agent, and the first epoxy sealing layer may have a lower concentration of the solder flux agent than the second epoxy sealing layer.
    Type: Application
    Filed: May 28, 2014
    Publication date: September 18, 2014
    Inventors: Choongbin YIM, Hae-Jung YU, Taesung PARK
  • SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING
    Publication number: 20140264544
    Abstract: A semiconductor device includes polysilicon layer and a metal silicide layer. The polysilicon layer is doped with carbon or phosphorous. The silicide layer is formed over the polysilicon layer.
    Type: Application
    Filed: May 8, 2013
    Publication date: September 18, 2014
    Applicant: MACRONIX INTERNATIONAL CO., LTD.
    Inventors: Pei-Ci Jhang, Zong-Jie Ko, Yumin Lin, Jung-Yu Shieh, Jeng Hwa Liao
  • AIR SUPPLY APPARATUS FOR EXPERIMENTAL ANIMAL HUSBANDRY EQUIPMENT
    Publication number: 20140261221
    Abstract: An air supply apparatus for experimental husbandry equipments includes a frame having a plurality of cubicles formed by a support frame, and a container for containing and breading an experimental animal. The frame has an air supply pipeline comprising a main intake pipe and a main extraction pipe, and a branch intake pipe and a branch extraction pipe are installed between the two main pipes, wherein the branch intake pipe is interconnected with the main intake pipe, and the branch extraction pipe is interconnected to the main extraction pipe, and each branch pipe has a through hole formed at a position corresponsive to each cubicle and a joint for supplying air to the container, and the air supply pipeline has an adjusting device for adjusting the amount of supplied air, so that each container can obtain an equal amount of air.
    Type: Application
    Filed: March 5, 2014
    Publication date: September 18, 2014
    Applicant: RUNG SHIN PLASTIC INDUSTRIAL CO., LTD.
    Inventor: JUNG-YU LIN
  • SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
    Publication number: 20140239478
    Abstract: A semiconductor device includes a first semiconductor chip at least partially overlapping a second semiconductor chip. The first semiconductor chip is coupled to a substrate and has a first width, and the second semiconductor chip has a second width. The device also includes a heat sink coupled to the second semiconductor chip and having a third width different from at least one of the first width or the second width. A package molding section at least partially overlaps a first area of the heat sink and does not overlap a second area of the heat sink which includes a top surface of the heat sink.
    Type: Application
    Filed: March 14, 2013
    Publication date: August 28, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji-Seok HONG, Sang-Uk HAN, Eun-Kyoung CHOI, Jong-Youn KIM, Hae-Jung YU, Cha-Jea JO
  • METHOD OF FABRICATING SEMICONDUCTOR DEVICE
    Publication number: 20140213017
    Abstract: A method of fabricating a semiconductor device includes attaching a semiconductor substrate to a carrier using a carrier fixing layer, where the semiconductor substrate including a plurality of semiconductor chips. The method further includes forming gaps between adjacent ones of the chips. The gaps may be formed using one or more chemicals or light which act to remove portions of the semiconductor substrate to expose the carrier fixing layer. Additional portions of the carrier fixing layer are then removed to allow for removal of the chips from the carrier.
    Type: Application
    Filed: March 14, 2013
    Publication date: July 31, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jong-Youn KIM, Ji-Hwang KIM, Hae-Jung YU, Cha-Jea JO
  • Method for reducing wordline bridge rate
    Patent number: 8791022
    Abstract: The method of forming a wordline is provided in the present invention. The proposed method includes steps of: (a) etching a metal-silicide layer and a POLY layer via a hard mask, wherein the metal-silicide layer is disposed on the POLY layer; (b) forming a POLY recess in the POLY layer; and (c) forming a liner film covering the metal-silicide layer.
    Type: Grant
    Filed: November 23, 2010
    Date of Patent: July 29, 2014
    Assignee: Macronix International Co. Ltd.
    Inventors: Jeng-Hwa Liao, Jung-Yu Shieh, Ling-Wu Yang
  • CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    Publication number: 20140202747
    Abstract: A circuit board and a manufacturing method thereof are provided. The manufacturing method includes the following steps. A substrate having a first surface and a second surface opposite to each other is provided. A first circuit layer is formed on the first surface. A stress is applied to the first circuit layer and the substrate using a awl tool, such that the first circuit layer and the substrate are deformed to form a through hole. A portion of the first circuit layer is located on the sidewalls of the through hole and an end of the through hole is protruded from the second surface. A printing process is performed to form a second circuit layer on the second surface. The second circuit layer is connected to the first circuit layer located in the through hole.
    Type: Application
    Filed: January 24, 2013
    Publication date: July 24, 2014
    Applicant: ELITES ELECTRONICS CORP.
    Inventor: Jung-Yu Peng
  • Method for inhibiting cancer metastasis by administration of the extracellular domain DLK1 or a DLK1-FC fusion protein
    Patent number: 8785392
    Abstract: A recombinant expression vector, comprising extracellular soluble domain genes of DLK1 and IgG antibody Fc domain genes, is constructed, and DLK1-Fc fusion protein is expressed and purified at 293E cell. The invention confirmed the efficacy as a drug for inhibiting cancer metastasis by confirming markedly reduced migration of cancer cells by DLK1-Fc fusion protein and also computing pharmacokinetic parameters. DLK1-Fc fusion protein has relatively higher stability than non-fusion protein, significantly reduces migration of various cancer cell lines, and provides superior cancer metastasis inhibition effect even at small concentration. Accordingly, DLK1-Fc fusion protein can be used efficaciously as an effective ingredient of a composition for inhibiting cancer metastasis.
    Type: Grant
    Filed: April 13, 2010
    Date of Patent: July 22, 2014
    Assignee: Korea Research Institute of Bioscience and Biotechnology
    Inventors: Young Woo Park, Kiwon Jo, Donghee Lee, Jung Yu, Ji Hyun Park, Chan-Woong Park, Eun Jin Kim, Yun Jung Park
  • Package-on-package electronic devices including sealing layers and related methods of forming the same
    Patent number: 8779606
    Abstract: A package-on-package (POP) electronic device may include first and second packaging substrates, a solder interconnection providing electrical and mechanical coupling between the first and second packaging substrates, and first and second sealing layers between the first and second packaging substrates. The first and second sealing layers may be respective first and second epoxy sealing layers. Moreover, the second epoxy sealing layer may include a solder flux agent, and the first epoxy sealing layer may have a lower concentration of the solder flux agent than the second epoxy sealing layer.
    Type: Grant
    Filed: January 4, 2013
    Date of Patent: July 15, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Choongbin Yim, Hae-Jung Yu, Taesung Park
  • CHARGING DEVICE
    Publication number: 20140191708
    Abstract: A charging device includes a power converting unit and a power output unit. The power converting unit comprises a first conductive pin, a second conductive pin, and a converter. The first conductive pin and the second conductive pin are electrically connected to an alternating current (AC) power. The converter converts the AC power to a direct current (DC) power and outputs the DC power. The power output unit is electrically connected to the converter via a number of cables, and outputs the DC power to an electronic device. The power output unit comprises a first switch and a second switch. When the electronic device separates from the power output unit, the first switch controls the converter to stop receiving the AC power. When the electronic device is completely charged, the second switch controls the converter to stop receiving the AC power.
    Type: Application
    Filed: January 9, 2014
    Publication date: July 10, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: JUNG-YU HUANG, KUO-WEI SU, JIN-YUAN TENG
  • TOUCH PANEL AND A MANUFACTURING METHOD THEREOF
    Publication number: 20140176453
    Abstract: The present disclosure provides a method for manufacturing a touch panel, wherein the method comprises: forming a touch sensing layer on a visible region and a non-visible region of a cover substrate, wherein the non-visible region is located at periphery of the visible region forming a first opaque insulating layer on the touch sensing layer in the non-visible region; forming a wiring layer on the first opaque insulating layer: and forming a conductive layer to electrically connect the wiring layer and the touch sensing layer. Moreover, the present disclosure also provides a touch panel. Accordingly, the touch sensing accuracy is maintained, and the production rate is improved.
    Type: Application
    Filed: December 25, 2012
    Publication date: June 26, 2014
    Inventors: YUH-WEN LEE, Hsiang-Lung Hsia, Kun-Rung Lin, Minghua Ya, Xianbin Xu, Tsung-Ke Chiu, Huilin Ye, Jung Yu