Abstract: A dynamic random access memory device is capable of converting from a full density memory device to a reduced density memory device. The reduced density memory device compensates for cell failures in a plurality of cell blocks, regardless of the location of the cell failures. The memory device includes a row address mapping fuse for selectively determining row address combinations capable of storing data bits. A row address mapping logic is coupled to the row address mapping fuse and is capable of routing data bits to the address combinations capable of storing data bits.

Abstract: A voltage down converter for a semiconductor memory device to convert an external voltage to a lower value internal voltage for the device, has a voltage generator that produces a reference voltage corresponding to the value of the internal voltage, a comparator having opposite polarity inputs for producing an amplified output control signal, and a pull-up device operating from the external voltage that receives the control signal from the comparator to produce the internal voltage as an input. A dual source follower is located between the reference voltage generator and comparator and has two sections having cross-coupled inputs which respectively receive the internal reference voltage and the internal voltage to produce output voltages moving in opposite directions, each of which is applied to one input of the comparator, thereby translating the difference between Vintref and Vint to a level in a range that can be better amplified by the comparator.

Abstract: A memory comprising 2n dynamic random access memory (DRAM) banks, wherein n is an integer greater than or equal to 2, 2n refresh row address counter circuits configured to generate 2n sets of refresh row address signals in response to 2n refresh enable signals, a multiplexer circuit configured to provide the 2n sets of refresh row address signals to the 2n DRAM banks in response to the 2n refresh enable signals, and a bank select circuit configured to provide 2n bank enable signals to the 2n DRAM banks in response to at least (n+1) external address signals and in response to the 2n refresh enable signals is provided. The 2n bank enable signals cause at least two but less than all of the 2n DRAM banks to be refreshed using at least two of the 2n sets of refresh row address signals in response to the 2n refresh enable signals.

Abstract: A circuit to operate a semiconductor integrated circuit memory device having memory cells in a deep power down mode. The power down circuit includes a transistor switch connected between an external voltage source and the device memory cells and peripheral circuits, a generator for providing a control voltage of a first level different from the value of the external voltage, and a multiplexer that receives as one input the control voltage and as a second input the external voltage. The multiplexer has a selected output of one of the control voltage and external voltage that is applied to a control electrode of the transistor switch. When deep power down mode operation is required, the multiplexer responds to a power down control flag signal to apply the external voltage to the transistor control electrode to turn off the transistor and block application of the external voltage to the memory cells and peripheral circuits.

Abstract: The present invention relates to a memory cell having a quasi-folded bit line sensing arrangement with an open bit line cell array. The memory cell array noise is negligible compared to the conventional open bit line. Also, the twisted bit line structure can be applied for the invention to reduce the inter-bit line coupling noise. The embodiments of the present invention reduce the size of the edge array, reduce the sensing power requirements, and provide a simple bit line layout. According to one embodiment of the present invention, a memory device comprises a plurality of sense amplifiers, each sense amplifier enabling access to data associated with arrays of cells; a bit line pair being coupled to each sense amplifier and comprising a bit line and a complementary bit line; a plurality of word lines associated with an array of cells; and a plurality of switches is employed to enable access to memory cells of the memory device.

Abstract: A voltage down converter for a semiconductor memory device to convert an external voltage to a lower value internal voltage for the device, has a voltage generator that produces a reference voltage corresponding to the value of the internal voltage, a comparator having opposite polarity inputs for producing an amplified output control signal, and a pull-up device operating from the external voltage that receives the control signal from the comparator to produce the internal voltage as an input. A dual source follower is located between the reference voltage generator and comparator and has two sections having cross-coupled inputs which respectively receive the internal reference voltage and the internal voltage to produce output voltages moving in opposite directions, each of which is applied to one input of the comparator, thereby translating the difference between Vintref and Vint to a level in a range that can be better amplified by the comparator.