Abstract: A particular device includes a first die that includes a portion of a chip identifier structure, the portion including a first set of at least two through vias that are each connected to a corresponding external electrical contact of a first set of external electrical contacts. Each of the first set of through vias has a pad configured to be coupled to an adjacent through via of a second die in the chip identifier structure. Each external electrical contact of the first set of external electrical contacts is configured to transmit a chip select signal. The first die further includes at least a portion of a chip communication structure including a second set of at least one through via. Each via of the second set is connected to one external electrical contact of a second set of external electrical contacts.

Abstract: A particular method of making a stacked multi-die semiconductor device includes forming a stack of at least two dies. Each die includes a chip identifier structure that includes a first set of at least two through vias that are each hard wired to a set of external electrical contacts. Each die further includes chip identifier selection logic coupled to the chip identifier structure. Each die further includes a chip select structure that includes a second set of at least two through vias coupled to the chip identifier selection logic. The method further includes coupling each external electrical contact to a voltage source or ground. Each of the first set of through vias has a pad that is coupled to an adjacent through via and each of the second set of through vias is coupled to its own respective pad.

Abstract: A method of generating a non-reversible state at a bitcell having a first magnetic tunnel junction (MTJ) and a second MTJ includes applying a program voltage to the first MTJ of the bitcell without applying the program voltage to the second MTJ of the bitcell. A memory device includes a bitcell having a first MTJ and a second MTJ and programming circuitry configured to generate a non-reversible state at the bitcell by applying a program signal to a selected one of the first MTJ and the second MTJ of the bitcell.

Abstract: A vertically stackable die having a chip identifier structure is disclosed. In a particular embodiment, a semiconductor device is disclosed that includes a die comprising a first through silicon via to communicate a chip identifier and other data. The semiconductor device also includes a chip identifier structure that comprises at least two through silicon vias that are each hard wired to an external electrical contact.

Abstract: A method and apparatus for providing a clock signal to a charge pump is disclosed. In a particular embodiment, the method includes providing a first clock signal to a first charge pump unit of a charge pump. The method further includes providing a second clock signal to a second charge pump unit of the charge pump. A low-to-high transition of the first clock signal occurs substantially concurrently with a high-to-low transition of the second clock signal. Only one clock signal may be at a logic high voltage level at any given time.

Abstract: A vertically stackable die having a chip identifier structure is disclosed. In a particular embodiment, a semiconductor device is disclosed that includes a die comprising a first through via to communicate a chip identifier and other data. The semiconductor device also includes a chip identifier structure that comprises at least two through vias that are each hard wired to an external electrical contact.

Abstract: Methods and apparatus for a providing temperature-compensated reference voltage are provided. In an example, a temperature-compensated voltage reference circuit includes a current mirror portion and a temperature-compensated output portion coupled to the current mirror portion. The temperature-compensated output portion comprises a very low threshold voltage (Vt) transistor coupled in series with a negative temperature coefficient transistor. The output portion can further include a positive temperature coefficient element coupled in series with the very low Vt transistor. The positive temperature coefficient element can be an adjustable resistive element. The output portion can further include an output transistor having a gate coupled to the current mirror portion and coupled between a supply voltage and the positive temperature coefficient element. The very low Vt transistor can be a substantially zero Vt n-channel metal-oxide-semiconductor (NMOS) transistor, and can be coupled in a diode configuration.

Abstract: A system involves a first SerDes link from a first integrated circuit (IC) to a second IC and a second link from the second IC to the first IC. Power consumption settings in circuitry of the first link are adjusted to control power consumption such that the bit error rate of the first link is maintained in a range, where the lower bound of the range is substantially greater than zero. Power consumption settings in circuitry for the second link are adjusted to control power consumption such that the bit error rate of the second link is maintained in range, where the lower bound of the range is substantially greater than zero. In one example, circuitry in the second IC detects errors in the first link and reports back via the second link. The first IC uses the reported information to determine a bit error rate for the first link.

Abstract: Apparatuses and methods for low power combined self-refresh and self-correction of a Dynamic Random Access Memory (DRAM) array. During a self-refresh cycle, a first portion of a first row of the DRAM array is accessed and analyzed for one or more errors, wherein a bit width of the first portion is less than a bit width of the first row. If one or more errors are detected, the one or more errors are corrected to form a corrected first portion. The corrected first portion is selectively written back to the first row. If no errors are detected in the first portion, a write back of the first portion to the first row is prevented.

Abstract: A resistance-based memory has a two-diode access device. In a particular embodiment, a method includes biasing a bit line and a sense line to generate a current through a resistance-based memory element via a first diode or a second diode. A cathode of the first diode is coupled to the bit line and an anode of the second diode is coupled to the sense line.

Abstract: A system and method to initiate a housekeeping operation at a mobile device is disclosed. In a particular embodiment, a method at a mobile device includes modifying a scheduled housekeeping operation in response to determining that the mobile device is in a charging mode.

Abstract: A method of generating a non-reversible state at a bitcell having a first magnetic tunnel junction (MTJ) and a second MTJ includes applying a program voltage to the first MTJ of the bitcell without applying the program voltage to the second MTJ of the bitcell. A memory device includes a bitcell having a first MTJ and a second MTJ and programming circuitry configured to generate a non-reversible state at the bitcell by applying a program signal to a selected one of the first MTJ and the second MTJ of the bitcell.

Abstract: A method and apparatus for providing a clock signal to a charge pump is disclosed. In a particular embodiment, the method includes providing a first clock signal to a first charge pump unit of a charge pump. The method further includes providing a second clock signal to a second charge pump unit of the charge pump. A low-to-high transition of the first clock signal occurs substantially concurrently with a high-to-low transition of the second clock signal. Only one clock signal may be at a logic high voltage level at any given time.

Abstract: A semiconductor chip includes an array of electrical contacts and multiple vias coupling at least one circuit in the semiconductor chip to the array of electrical contacts. A first one of the electrical contacts of the array of electrical contacts is coupled to N vias, and a second one of the electrical contacts of the array of electrical contacts is coupled to M vias. M and N are positive integers of different values.

Abstract: A vertically stackable die having a chip identifier structure is disclosed. In a particular embodiment, a semiconductor device is disclosed that includes a die comprising a first through silicon via to communicate a chip identifier and other data. The semiconductor device also includes a chip identifier structure that comprises at least two through silicon vias that are each hard wired to an external electrical contact.

Abstract: A vertically stackable die having a chip identifier structure is disclosed. In a particular embodiment, a semiconductor device is disclosed that includes a die comprising a first through via to communicate a chip identifier and other data. The semiconductor device also includes a chip identifier structure that comprises at least two through vias that are each hard wired to an external electrical contact.

Abstract: Methods and devices of a capacitor in a semiconductor device having an increased capacitance are disclosed. In a particular embodiment, a method of forming a capacitor is disclosed. A section of a first insulating material between a first metal contact element and a second metal contact element is removed to form a channel. A second insulating material is deposited in the channel between the first metal contact element and the second metal contact element.

Abstract: A clock stop detector for a memory comprises a first switch that closes in response to a first logic level of a clock signal to charge a capacitor, a second switch that closes in response to a second logic level of the clock signal to discharge the capacitor, and a logic circuit that outputs a control signal based on an inverted clock signal and a charge on the capacitor.

Abstract: A circuit including a deskew circuit. The deskew circuit is configured to receive a first signal having a first edge delayed from a second edge of a second signal by a first delay and a third edge delayed from a fourth edge of the second signal by a second delay. The deskew circuit is configured to provide a third signal having a first deskewed edge delayed from the first edge by a third delay and a second deskewed edge delayed from the third edge by a fourth delay. The difference between the fourth delay and the third delay is substantially equal to the difference between the first delay and the second delay.

Abstract: A data bus structure for a dynamic random access memory (DRAM) according to the present invention includes a series of data buses, each shared by a plurality of memory banks, and a switching device to selectively couple the data buses to a global data bus to enable the memory device to provide and receive data. The data bus structure conserves space on a chip or die and prevents significant timing skews for data accessed from different memory banks.