Abstract: An imprint method for imprinting an imprint pattern of a mold onto a pattern formation material on a substrate so as to realize a high throughput includes the steps of bringing the imprint pattern and the pattern formation material into contact with each other; applying a first pressure between the mold and the substrate to increase a contact area between the imprint pattern and the pattern formation material; and adjusting a positional relationship between the mold and the substrate at a second pressure lower than the first pressure.

Abstract: An imprint method for imprinting an imprint pattern provided to a mold onto a pattern forming layer formed on a substrate is constituted by a first step of effecting alignment between the substrate and the mold with feedback control; a second step of bringing the mold and the pattern forming layer into contact with each other; a third step of curing the pattern forming layer; and a fourth step of increasing a gap between the substrate and the mold. The imprint method further includes a step of stopping the feedback control between the first step and the second step and/or between the second step and the third step.

Abstract: A mold for imprinting a pattern onto a resin material applied onto a substrate is constituted by a mold substrate formed of a material transparent to light in at least a part of a wavelength range of light used for alignment, an alignment structure area having an alignment structure comprising a recess portion, a pattern forming area having a pattern, and a coating layer is formed of a material having an optical characteristic different from that of the mold substrate. The coating layer is on a side wall of the recess portion.

Abstract: An imprint method in which imprinting of a pattern of a mold onto a resin material on a substrate is repeated multiple times. The imprint method includes the steps of preparing the mold including a light blocking member at a position where the pattern is not formed, forming a pattern for the first time by bringing the mold into contact with a photocurable resin material provided on the substrate, forming a first processed area by curing the photocurable resin material by light irradiation, and removing a part of the photocurable resin material extruded from the first processed area into an outside area at a periphery of the first processed area.

Abstract: A mold applicable to imprinting includes a first surface having an area of a pattern to be transferred, a second surface located opposite from the first surface, a first mark for alignment provided at the first surface, and a second mark for alignment provided at a position at which the second mark is spaced from the first surface.

Abstract: A process for producing a structure containing silicon oxide includes a step of forming a first layer of organic spin-on glass on a substrate and a step of forming a second layer of inorganic spin-on glass on the first layer. Thereafter, the first layer is etched by using a pattern formed on the second layer as a mask and then the first layer and the second layer are calcined to prepare the structure containing silicon oxide.

Abstract: A process for producing a structure containing silicon oxide includes a step of forming a first layer of organic spin-on glass on a substrate and a step of forming a second layer of inorganic spin-on glass on the first layer. Thereafter, the first layer is etched by using a pattern formed on the second layer as a mask and then the first layer and the second layer are calcined to prepare the structure containing silicon oxide.

Abstract: A scanning probe apparatus for obtaining information of a sample, recording information in the sample, or processing the sample with relative movement between the sample and the apparatus, the apparatus is constituted by a probe; and a scanning stage including a drive element for moving a sample holding table for holding the sample and a movable portion movable in a direction in which an inertial force generated during movement of the sample holding table is cancelled. The scanning stage further includes a memory for storing characteristic information of the scanning stage and is detachably or replaceably mountable to a main assembly of the apparatus.

Abstract: An imprint apparatus in which a mold having a processing surface on which a predetermined imprint is formed is provided and an uncured resin material placed on a substrate is filled and cured in a space between the mold and the substrate and is subjected to imprint of the predetermined imprint formed on the processing surface of the mold. The imprint apparatus includes an attitude control mechanism for controlling attitudes of the mold and the substrate so that a first gap between a first end of the mold and the substrate and a second gap between a second end of the mold and the substrate are different from each other, and a measuring mechanism for measuring attitudes and positions of the mold and the substrate. Also provided is a mechanism for imparting a relative movement between the substrate and the mold so that the resin material approaches the first end of the mold and enters through the first gap and fills at least a part of the space between the mold and the substrate.

Abstract: A molding apparatus for patterning a workpiece includes a first support member for supporting the mold, a second support member arranged opposite to the first support member, and a pressing mechanism for pressing the mold and the work together using the support members to pattern the workpiece. In this structure, either the surface of the first support member for supporting the mold or the surface of the second support member for supporting the workpiece is smaller in area than both surfaces of the mold and the workpiece.

Abstract: An imprint method includes the steps of preparing a substrate, placing an uncured resin material on the substrate, preparing a mold having a first end and a second end, and placing the mold to oppose the substrate at a position not sandwiching the resin material. A first gap between the first end and the substrate and a second gap between the second end and the substrate are different from each other. Additional steps include imparting a relative movement between the substrate and the mold so that the resin material approaches the first end of the mold and enters through the first gap and fills at least a part of a space between the mold and the substrate, and changing at least one of the first and second gaps in the state that the resin material is present between the mold and the substrate.

Abstract: The present invention provides an epoxy resin composition that is excellent in thermal conductivity and has improved high-temperature resistance and handleability. The epoxy resin composition comprises an epoxy compound having a mesogenic skeleton and a curing agent having a biphenylaralkyl skeleton. The biphenylaralkyl skeleton-containing curing agent preferably has a softening point of 110° C. or lower. The biphenylaralkyl skeleton-containing curing agent is preferably an amorphous curing agent.

Abstract: An epoxy prepolymer having excellent thermal conductivity is obtained by reacting an epoxy compound having a mesogenic skeleton and a trinuclear bisphenol represented by the following formula: (wherein each of R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, R11 and R12 represents a hydrogen atom or an alkyl group and each may be the same or different while at least one represents an alkyl group).

Abstract: An apparatus for pressing resin on a shot region of a substrate and a mold to each other to form a resin pattern on the shot region, including: a mold chuck; an X-Y stage including a substrate chuck, the resin held by the substrate chuck and mold held by the mold chuck being pressed to each other in a Z-axis direction; a dispenser for dispensing the resin on the shot region; a scope for measuring, in an X-Y plane, a position of a substrate mark formed in each of a plurality of shot regions of the substrate held by the substrate chuck; and a reference mark formed on the X-Y stage. The X-Y stage has a moving range allowing the dispenser to dispense the resin on all shot regions of the substrate, and the position of the reference mark can be measured within the moving range of the X-Y stage.

Abstract: A drive stage for a scanning probe apparatus includes a supporting member, a plurality of movable portions fixed to the supporting member, and a plurality of drive elements configured and positioned to drive the plurality of movable portions. The drive stage is driven in a direction in which inertial forces of the plurality of movable portions are mutually canceled during drive of the plurality of drive elements. The drive stage further includes an inertial force difference detection member configured and positioned to detect a difference in inertial force between the plurality of movable portions, and an inertial force adjustment member configured and positioned to effect inertial force adjustment so that the difference in inertial force between the plurality of movable portions is decreased on the basis of a detection output of the inertial force detection member.

Abstract: A scanning probe apparatus for obtaining information of a sample, recording information in the sample, or processing the sample with relative movement between the sample and the apparatus, the apparatus is constituted by a probe; and a scanning stage including a drive element for moving a sample holding table for holding the sample and a movable portion movable in a direction in which an inertial force generated during movement of the sample holding table is cancelled. The scanning stage further includes a drive circuit for driving the scanning stage and is detachably or replaceably mountable to a main assembly of the apparatus.

Abstract: An imprint apparatus for pressing resin and a mold to each other in a Z-axis direction to form a resin pattern on a shot region includes: a mold chuck; an X-Y stage; a reference mark formed on the stage; a first scope configured to measure a positional deviation in an x-y plane between a mold mark and the reference mark; a second scope configured to measure a position of a substrate mark in the plane not via the mold mark; and a dispenser configured to dispense resin. In the plane, the dispenser center is deviated in position from the mold chuck center by a first distance in a first direction, and the second scope center is deviated in position from the dispenser center by a distance smaller than twice the first distance in the first direction or a second direction opposite thereto.

Abstract: There is provided an imprinting apparatus that transfers a pattern of a mold to a resin on a substrate, the imprinting apparatus including a deposition mechanism configured to deposit the resin onto the substrate; a first driving mechanism configured to change a relative position, on a plane parallel to the surface of the substrate, of the substrate and the mold; a second driving mechanism configured to change the relative position, on a plane parallel to the surface of the substrate, of the substrate and the deposition mechanism; and a control unit configured to control the deposition mechanism and the driving mechanism so as to perform a resin deposition process of depositing the resin onto the substrate and an imprint process of transferring the pattern of the mold to the resin on the substrate in parallel.

Abstract: An imprinting method for depositing resins to a substrate, bringing a mold into contact with the resins, and transferring a pattern formed on the mold to the resins includes a first imprinting process for transferring the pattern to a first resin and a second imprinting process for forming the pattern on a second resin in an area adjacent to an area formed during the first imprinting process. The amount of the second resin to be deposited during the second imprinting process is different from that of the first resin used during the first imprinting process so that a gap between the area formed during the first imprinting process and an area to be formed during the second imprinting process is filled.

Abstract: A molding apparatus for patterning a workpiece includes a mold having a pattern to be transferred to the workpiece, with the pattern including recesses, a first support member for supporting the mold, and a second support member, arranged opposite to the first support member, for supporting the workpiece. A pressing mechanism brings the first and second support members close to each other and presses the mold and the workpiece together so as to transfer, to the workpiece, the pattern on the mold. Recessed portions are provided on at least one of a surface of the mold on the first support member side, a region of the first support member, and a region of the second support member. The recessed portions correspond to recesses in the pattern of the mold.