Abstract: A portable data carrier includes a card-shaped body having a recess for receiving a chip module. The chip module includes at least one semiconductor chip on a first main side of a chip carrier connected to the card-shaped body, and a metallization layer disposed on a second main side of the chip carrier and having contact lugs. The chip carrier has desired bending points which, upon the occurrence of bending stresses, reduce forces on the semiconductor chip and wire connections.

Abstract: A carrier element for a semiconductor chip and in particular for incorporation into smart cards. The carrier element has an encapsulation composition protecting the semiconductor chip. The carrier element connections are disposed on one of the main surfaces of the encapsulation composition along only two opposite edges. They are made of a conductive material and have a reduced thickness at the ends facing one another, the cross section having a step only on one side. The semiconductor chip is disposed on the connections in a region of the section of reduced thickness and is mechanically connected to the connections.

Abstract: A damp mop for plane surfaces having two mop plates 1, 2 that are coupled to a handle 13 and that have a mop pad 35 provided thereon. The two mop plates 1,2 are joined by a double joint 3, and can be pressed against one another by pressure arms 19, 20 disposed on a slide sleeve. The handle 13 is secured pivotably to the double joint 3 via a cardan joint 8.

Abstract: An optimized CO2 air-conditioning system for a vehicle has individual components designed and/or matched to one another in such a way that if the high pressures in the high-pressure section deviate by up to ±30% from the optimum high pressures, the associated optimum performance figures are reduced by no more than 20%. The individual components include a controllable compressor, a gas cooler, an internal heat exchanger, an evaporator and an accumulator. As a result, a fixed throttle expansion member can be used between the high-pressure and low-pressure sections of the system.

Abstract: Flip-chip bumps (solder bumps) are applied on the contact-connection points of a semiconductor chip. These bumps extend from there through a covering compound (mold) that is applied as a protective layer. The end of each one of the bumps that is remote from the semiconductor chip forms a pad. This pad lies approximately plane-parallel in the surface of the covering compound that is remote from the semiconductor chip. At least during the encapsulation process, the chips are preferably arranged on a carrier element, in particular a carrier strip.

Abstract: A portable data carrier includes a card-shaped body having a recess for receiving a chip module. The chip module includes at least one semiconductor chip on a first main side of a chip carrier connected to the card-shaped body, and a metallization layer disposed on a second main side of the chip carrier and having contact lugs. The chip carrier has desired bending points which, upon the occurrence of bending stresses, reduce forces on the semiconductor chip and wire connections.

Abstract: An optimized CO2 air-conditioning system for a vehicle has individual components designed and/or matched to one another in such a way that if the high pressures in the high-pressure section deviate by up to ±30% from the optimum high pressures, the associated optimum performance figures are reduced by no more than 20%. The individual components include a controllable compressor, a gas cooler, an internal heat exchanger, an evaporator and an accumulator. As a result, a fixed throttle expansion member can be used between the high-pressure and low-pressure sections of the system.

Abstract: A method for producing a chip module includes punching a chip carrier to form a chip carrier fixing section and chip carrier contact sections spaced apart from the chip carrier fixing section by slots defining a given distance. The given distance is subsequently reduced to a dimension preventing a flow through of a sealing mass by a swaging operation carried out at least in a region close to the slots.

Abstract: Flip-chip bumps (solder bumps) are applied on the contact-connection points of a semiconductor chip. These bumps extend from there through a covering compound (mold) that is applied as a protective layer. The end of each one of the bumps that is remote from the semiconductor chip forms a pad. This pad lies approximately plane-parallel in the surface of the covering compound that is remote from the semiconductor chip. At least during the encapsulation process, the chips are preferably arranged on a carrier element, in particular a carrier strip.

Abstract: A damp mop for plane surfaces, having two mop plates 1, 2 with a mop pad 35 that are secured to a handle 13, are joined with the interposition of a double joint 3, and can be pressed against one another by means of pressure arms 19, 20 disposed on a slide sleeve, the handle 13 being secured pivotably to the double joint 3 via a cardan joint 8.

Abstract: A smart card with a card carrier on which a data processing circuit and also a connection assembly for the contactless communication of data between the data processing circuit and an external data processing station are provided. In the course of producing a prior art smart card, an integrated circuit is applied to a card carrier made of plastic. Afterwards, a transmitting/receiving coil connected to corresponding terminals of the integrated circuit is applied along the outer edges of the prior art smart card. In the case of the prior art smart card, the fact that defective prior art smart cards have to be destroyed is disadvantageous. According to the invention, the data processing circuit and the connection assembly are provided in a region of at least one module carrier and the card carrier has a region for accommodating the module carrier. This makes it possible firstly to test the completed module carrier in respect of its proper functioning before it is incorporated into a card carrier.

Abstract: A separable pipe joint has two pipe segments that can be inserted one into the another, a gasket-seal arranged between the pipe segments, and a collet which is arranged so as to be adjustable between a separated position and a clamped position, and which is provided with latching means for axially fixing the pipe segments. To indicate a wear-resistant separable pipe joint, which permits a variable assembly of pipe segments adjoining each other, provision is made that as latching means for fixing at least two axially spaced latching members, radially extending to the inside, are arranged on the collet, the latching members in the clamped position of the collet gripping from behind, in each case, a radially elevated clamping step on the external surface of each pipe segment.

Abstract: A separable pipe joint has two pipe segments that can be inserted one into the another, a gasket-seal arranged between the pipe segments, and a collet which is arranged so as to be adjustable between a separated position and a clamped position, and which is provided with latching means for axially fixing the pipe segments.

Abstract: A chip module has a contact area disposed on its outer side formed of a plurality of essentially flat contact elements of electrically conductive material insulated from one another. At least one semiconductor chip having one or more integrated semiconductor circuits that are electrically connected to the contact elements of the contact area via bonding wires. The contact elements of the chip module are formed by a prefabricated lead frame for supporting the at least one semiconductor chip and have on two opposing sides of the chip module outwardly offset terminals arranged in rows next to one another. The outwardly offset terminals are provided for surface mounting the chip module on the mounting surface of an external printed circuit board or an external circuit board substrate.

Abstract: A smart card with a card carrier on which a data processing circuit and also a connection assembly for the contactless communication of data between the data processing circuit and an external data processing station are provided. In the course of producing a prior art smart card, an integrated circuit is applied to a card carrier made of plastic. Afterwards, a transmitting/receiving coil connected to corresponding terminals of the integrated circuit is applied along the outer edges of the prior art smart card. In the case of the prior art smart card, the fact that defective prior art smart cards have to be destroyed is disadvantageous. According to the invention, the data processing circuit and the connection assembly are provided in a region of at least one module carrier and the card carrier has a region for accommodating the module carrier. This makes it possible firstly to test the completed module carrier in respect of its proper functioning before it is incorporated into a card carrier.

Abstract: A carrier element for a semiconductor chip, in particular to be built into smart cards. The carrier element has a substrate that carries the chip and a stiffening sheet which also carries the chip and has a recess for receiving the chip and its connection leads therein. An edge of the recess is provided with a frame formed integrally from the sheet.

Abstract: A chip card includes a plastic card. A plastic body is disposed in the plastic card and a semiconductor chip is surrounded by the plastic body. Contact strips are electrically connected with the semiconductor chip and are connected to the plastic card. The contact strips have a flexible region near and outside of the plastic body and are advantageously parts of a lead frame. An adhesive which joins the contact strips to the plastic card has at least three layers including a middle layer of flexible material.

Abstract: For the digital data communication between a vehicle (transponder) and a beacon, an automatic gain control wherein the path attenuation between the transponder and the brake increases disproportionately with the distance. A two-stage automatic gain control is included for the gain control. After the first amplifier stage, the output signal is measured and supplied, together with a setpoint value contained in a setpoint memory, to a control amplifier. The output signal of the control amplifier is used both for automatically controlling the first amplifier stage, as well as the second amplifier stage. The automatic control makes it possible to cover only one single lane when automatically debiting highway tolls for a motor vehicle, for example. Influences caused by other motor vehicles on a nearby lane are eliminated.