Abstract: The invention relates to a substrate with a metallic carrier layer, at least one insulating layer which is provided on a surface side of the carrier layer and which is produced with the aid of a polymer material or polymer component, in addition to metallization which is provided on a partial area of the insulating layer and electrically separated from the carrier layer by means thereof. The insulating layer contains at least one other component which, as a distance-maintaining component, defines the thickness of the insulating layer and is made of a dimensionally stable inorganic material.

Abstract: The invention relates to an innovative method for manufacturing plate stacks, particularly for manufacturing coolers or cooler elements or heat sinks at least one plate stack, with at least two plate-shaped elements made of metal, for example copper, and provided with passages or openings, wherein the stacked elements are joined with each other using bonding on joining surfaces formed by surface sides of said elements by heating to a process temperature to form the stack.

Abstract: Disclosed is a metal-ceramic substrate made up of at least one ceramic layer which is provided with metallizations on both faces. In order to obtain a partial discharge resistance of less than 10 pC at a predefined measuring voltage, the thickness of the ceramic layer amounts to about one sixth of the measuring voltage.

Abstract: A method is disclosed for producing metal-ceramic substrates that are metallized on both sides by using the direct bonding process. According to the method, at least one DCB stack made from first and a second metal layer and a ceramic layer located between said metal layers is formed on a separating layer of a support by heating to a direct bonding temperature. At least one of the metal layers rests against the separating layer during the bonding process, said separating layer being composed of a porous layer or coating made of a separating layer material from the group comprising mullite, Al2O3, TiO3, ZrO2, MgO, CaO CaCO2 or a mixture of at least two of said materials.

Abstract: A method for manufacturing plate stacks for the production of coolers, cooler elements or heat sinks made of at least one plate stack for cooling electric or opto-electric components. The process includes the manufacture of plates or boards of metal, stacking the plates to form a plate stack, joining of the plates with the application of heat and pressure to form a stack, and post-treatment of the plate stack.

Abstract: The invention relates to a novel device made up of a heat source that is formed by at least one electrical or electronic component or is provided with such a component, a heat sink, and an intermediate layer which is located between the heat source and the heat sink and is made of a thermally conducting material. The thermally conducting material is made up of an organic matrix with incorporated nanofibers.

Abstract: At least one power semiconductor component is cooled by a flat, copper, plate-type hollow body conducting a coolant fluid. Components are fixed on one flat-sided surface of the hollow body and the other flat-sided surface includes two coolant fluid openings for introducing the coolant fluid into the hollow body and for evacuating the fluid therefrom. The other flat-sided surface is concave and elastically deformable between the coolant fluid openings. The concave other surface is attached to the even surface of a support in such a way that the concave surface and the even surface are pressed against each other by the elastically planar deformation of the concave surface and that the coolant fluid openings are sealed in a fluidproof manner by O-rings. A solid strut, which interconnects the two flat-sided surfaces is additionally configured in the hollow body. The cooling device may be used in a module or an assembly including a support and the cooling device or module.

Abstract: The invention relates to a novel composite material, especially for applications in the field of electrical engineering. Said novel material has a thermal coefficient of expansion that is smaller than 12×10?6 K?1 in at least two axes of a three-dimensional system that are perpendicular in relation to each other.

Abstract: The invention relates to a novel method for producing a metal/ceramic substrate, which is characterized by applying at least one metal area to at least one top surface of a ceramic layer. At least one metal area is applied to at least one surface side of a ceramic layer, wherein the ceramic layer is heated in a thermal process step in an area not covered by the metal area along a separating or break-off line.

Abstract: The conductor board has at least one layer of a dielectric provided areally on two mutually opposed faces with at least one metalization on each. There is at least one through contacting in the region of an aperture. The metalizations are applied to cover at least one aperture and are electrically connected to each other through the aperture.

Abstract: The invention relates to a novel design of a cooler in the form of a heat pipe, with a housing in which an interior space closed to the outside is formed to hold a liquid, vaporizable coolant or heat-transport medium.

Abstract: The invention relates to a metal-ceramic substrate for electric circuits or modules, said substrate comprising a ceramic layer which is provided with at least one metallic layer of a first type applied to a surface of said ceramic layer in a plane manner. An insulating layer consisting of a glass-containing material is applied to at least one partial region of a surface of the metallic layer of the first type, said surface opposing the ceramic layer, and a metallic layer of a second type is applied to the insulating layer, the insulating layer and the metallic layer of a second type respectively being thinner then the ceramic layer and the metallic layer of the first type.

Abstract: In a process for the manufacture of metal-ceramic compound material, especially metal-ceramic substrates, bonding compounds in the form of a plate-shaped ceramic substrate and an oxidized metal foil are bonded together by means of heating to a processing temperature in a protective gas atmosphere. For this purpose, the bonding components are placed in a reaction space formed within a capsule, which (space) is separated from the outer protective gas atmosphere by the capsule or in connection with the outer protective gas atmosphere only by means of a small opening.

Abstract: The conductor board has at least one layer of a dielectric provided areally on two mutually opposed faces with at least one metalization on each. There is at least one through contacting in the region of an aperture. The metalizations are applied to cover at least one aperture and are electrically connected to each other through the aperture.

Abstract: The invention relates to a novel process for producing a metal ceramic substrate, especially a copper-ceramic substrate, in which at least one metal foil at a time is applied to the surface sides of a ceramic layer or a ceramic substrate using a high temperature bonding process and the metal foil is structured on at least one surface side for forming conductive tracks, contact surfaces, and the like.

Abstract: At least one power semiconductor component is cooled by a flat, copper, plate-type hollow body conducting a coolant fluid. Components are fixed on one flat-sided surface of the hollow body and the other flat-sided surface includes two coolant fluid openings for introducing the coolant fluid into the hollow body and for evacuating the fluid therefrom. The other flat-sided surface is concave and elastically deformable between the coolant fluid openings. The concave other surface is attached to the even surface of a support in such a way that the concave surface and the even surface are pressed against each other by the elastically planar deformation of the concave surface and that the coolant fluid openings are sealed in a fluidproof manner by O-rings. A solid strut, which interconnects the two flat-sided surfaces is additionally configured in the hollow body. The cooling device may be used in a module or an assembly including a support and the cooling device or module.

Abstract: The invention relates to an innovative method for manufacturing plate stacks, particularly for manufacturing coolers or cooler elements or heat sinks at least one plate stack, with at least two plate-shaped elements made of metal, for example copper, and provided with passages or openings, wherein the stacked elements are joined with each other using bonding on joining surfaces formed by surface sides of said elements by heating to a process temperature to form the stack.

Abstract: In a heat sink designed as a heat pipe, there is an interior space in a body of the heat sink that is closed toward the outside with at least one vapor channel or vapor space and at least one fluid space that is connected with the vapor space and has a porous or capillary structure.

Abstract: The invention relates to a method for the selective surface treatment of a planar workpiece, whereby, on at least one of two metallic surface sides, two similar workpieces are detachably connected to eah other at least in a partial region, on teh first surface side thereof, such as to be sealed to the outside.

Abstract: A mirror for laser application and a method for manufacturing the mirror is disclosed herein. The mirror comprises several layers including a top layer used as the mirror surface. A cooling structure including a plurality of cooler layers are providing between the top layer, several intermediate layers and a bottom layer. Connections are provided for allowing a coolant to flow within the mirror. The mirror is constructed by stacking the layers on top of one another and connecting adjacent layers together by direct copper bonding or active soldering.