Abstract: The conductor board has at least one layer of a dielectric provided areally on two mutually opposed faces with at least one metalization on each. There is at least one through contacting in the region of an aperture. The metalizations are applied to cover at least one aperture and are electrically connected to each other through the aperture.

Abstract: In a process for the manufacture of metal-ceramic compound material, especially metal-ceramic substrates, bonding components in the form of a plate-shaped ceramic substrate and an oxidized metal foil are bonded together by means of heating to a processing temperature in a protective gas atmosphere. For this purpose, the bonding components are placed in a reaction space formed within a capsule, which (space) is separated from the outer protective gas atmosphere by the capsule or in connection with the outer protective gas atmosphere only by means of a small opening.

Abstract: The invention relates to a novel ceramic/metal substrate, especially to a multiple substrate with a ceramic plate or ceramic layer.

Abstract: The invention pertains to a new type of process for the manufacture of substrates with textured metalizations and holding and fastening elements for use in this process.

Abstract: A mirror for laser application and a method for manufacturing the mirror is disclosed herein. The mirror comprises several layers including a top layer used as the mirror surface. A cooling structure including a plurality of cooler layers are providing between the top layer, several intermediate layers and a bottom layer. Connections are provided for allowing a coolant to flow within the mirror. The mirror is constructed by stacking the layers on top of one another and connecting adjacent layers together by direct copper bonding or active soldering.

Abstract: A cooler has a plurality of layers arranged in a stack and connected to one another along their surfaces. Each layer has openings allowing for three-dimensional flow of the coolant between an intake and an outlet. The flow resistance or the gradient of flow resistance increases from the intake to the outlet so that the coolant is increasingly forced to concentrate at the cooling surface as coolant flows from the intake to the outlet.

Abstract: A process for manufacturing a metal ceramic substratum for use as a substrate in electrical or electronic circuits or components which includes utilizing an unique form mold process. At least one blank ceramic plate is shaped in a form mold through a desired set of process steps. The steps include heating and cooling to desired temperatures at desired heat and cool rates.

Abstract: The invention pertains to a new type of cooling system for cooling of heat sources, especially for cooling of electric components, with a cooler comprising, on a housing through which a coolant can flow, at least one first cooling surface that can be splashed with the coolant and at least one second cooling surface for flange-mounting of the heat source.

Abstract: The invention relates to a novel process for producing a metal-ceramic substrate in which at least one surface side of the ceramic layer is provided with at least one first structured metal layer and at least one second metal layer is applied to the first by electroless chemical deposition, and in which at least one depression or hole, or a plurality of depressions or holes are formed in the ceramic layer by laser machining to form a scored line.

Abstract: The invention relates to a novel process for producing a ceramic-metal substrate for electrical circuits in which a first or second metal coating is applied to a ceramic layer on both sides, specifically first metal coating in the form of a copper foil using the DCB process.

Abstract: A process is provided in which an initial substrate has a ceramic layer with metal layers on either side. At least one of the metal layers projects above one edge of the ceramic layer. The projecting sub-area is deformed so that the metal layer on the edge is disposed a distance from the surface of the ceramic layer, and along the edge in one border area with a stipulated width is separated from the ceramic layer.

Abstract: The invention relates to a novel process for producing a copper ceramic substrate with at least one through-plated hole, with a ceramic layer which has at least one opening for the through-plating, on one surface side is provided with a first metal coating and on the opposite surface side with a second metal coating which extends into at least one opening and is connected to the first metal coating, for formation of the first metal coating a copper foil being applied by DCB technique to one surface side of the ceramic layer.

Abstract: The invention relates to a novel ceramic substrate with at least one layer essentially of aluminum nitride which is provided on at least one surface side with an intermediate or auxiliary layer which contains aluminum oxide and which has a thickness in the range of 0.5-10 microns, and to a process for its production.

Abstract: The invention relates to a cooler for use as a heat sink for electrical components or circuits consisting of several cooler layers which are joined flat to one another, which are stacked on top of one another, which form between channels through which coolant flows and which each discharge into at least one first collection space for supply of the coolant and into a second collection space for draining the coolant, the collection spaces being formed by openings in the cooler layers and the cooling channels by structuring at least one area of the coolant layers with openings, the area being between the openings.

Abstract: A microcooler with channels through which coolant flows. The channels are formed by individual cooler layers having a region which is structured in the manner of a screen and having a plurality of openings with edge lines closed and with material bridges or material regions remaining between these openings. None of the openings on any of the cooler layers form a continuous channel which extends from a collection space for feed of the coolant to a collection space for drainage of the coolant. The individual breaches, and the material bridges or material regions, provided between them are offset from cooler layer to cooler layer such that flow of the coolant through the cooler is possible only with continuous changing of the layers. Using the breaches within the cooler results in a highly branched labyrinth through which coolant flows.

Abstract: An arched metal-ceramic substrate with one ceramic layer and with a metal coating provided on the top and bottom of the ceramic layer which is curved around at least one axis parallel to the plane of the substrate such that it forms a convexly curved surface on the bottom. The thickness of the metal coatings on the top and bottom of the arched ceramic layer is the same.

Abstract: A method of producing a ceramic-metal substrate, in which a cooper foil is superficially attached on at least one surface side of a ceramic layer a first metal layer formed by a metal foil, preferably a copper foil. The ceramic layer is then slit after applying the first metal layer, by removing the material of the ceramic layer down to first metal layer. At least one slit at a time is then made in the ceramic layer along at least two edges of the ceramic layer and at a distance from these edges, and extends over the entire length of the edge so that on either side of each slit there is a first ceramic layer section which has the respective adjacent edge and another ceramic layer section. The width of the slit is at least equal to twice the thickness of the ceramic layer. The metal layer is bent 180.degree.

Abstract: A multiple substrate is provided having a large area individual base layer with multiple substrates, for electrical circuits formed thereon. Individual substrates are defined by score lines in the base layer, and include a fragment of the base layer and at least one metal coating is provided on at least one surface of the fragment and has areas which stabilize the multiple substrates against unwanted breaking. Several individual substrates are preformed along peripheral sides of the base layer, and at least one metal coating on each individual substrate projects over the peripheral side.

Abstract: A process for producing a metal coated substrate with an improved resistivity to cyclic temperature stress is provided. The substrate is provided with at least one insulating layer and at least one metal layer attached to at least one side of the insulating layer. The metal layer is made at least 0.2 millimeters thick, and is weakened in places by openings formed in at least one border area.

Abstract: A metal coated substrate with improved resistivity to cyclic temperature stress is provided. A metal layers is attached to an insulating layer having a thickness of 0.2 mm. The metal layer is formed in a border area and is weakened by openings disposed in two rows. The depth of the openings nearer the border are greater than the depth of the openings in the tow farther from the border. The distance between the bottoms of the openings in the first row and the insulating layer is less than 1/3 of the thickness of the metal layer, and the distance between the bottom of the second row of openings and the surface of the insulating layer is 1/3 to 1/2 the thickness of the metal layer.