Patents by Inventor Jurgen Schulz-Harder

Jurgen Schulz-Harder has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multiple substrate and process for its production
    Patent number: 5508089
    Abstract: A metal coated substrate with improved resistivity to cyclic temperature stress is provided. A substrate has at least one insulating layer and at least metal layer attached to at least one side of the insulating layer. The metal layer is at least 0.2 millimeters thick, and is weakened in places by openings formed in at least one border area.
    Type: Grant
    Filed: June 3, 1994
    Date of Patent: April 16, 1996
    Inventor: Jurgen Schulz-Harder
  • Process for producing a metal-ceramic substrate
    Patent number: 5465898
    Abstract: A process is provided where a ceramic metal substrate is produced by attaching metal foils on either side a ceramic layer to form metal layers and for producing a through connection by placing metal in an opening to form a bridge so that the metal layers are electrically connected together by direct bonding, and a metal body is inserted into the opening to almost fill it, while a surface of the metal body is provided with a layer with chemical compound of metal and reactive gas.
    Type: Grant
    Filed: May 31, 1994
    Date of Patent: November 14, 1995
    Inventors: Jurgen Schulz-Harder, Peter H. Maier
  • Semiconductor module with multi-plane conductive path
    Patent number: 5382830
    Abstract: For the manufacture of a power semiconductor module, one proceeds from a ceramic base board on which copper plates and copper conductor paths are fastened by a suitable method. The ceramic base plate is then scratched and broken. As a result, ceramic side boards are produced which are connected to the base board via conductive paths. The side boards are then swung up, as a result of which the conductive paths fastened on the side boards come into a plane above the base plane. By means of suitable, possibly multiple, breaking and folding of the side boards and suitable development of the ends of the conductive paths, the connecting poles of the power semiconductor chips can be directly contacted. Electronic circuits can be arranged on the side boards.
    Type: Grant
    Filed: December 18, 1991
    Date of Patent: January 17, 1995
    Inventors: Altan Akyurek, Peter Maier, Jurgen Schulz-Harder
  • Substrate, consisting of copper and ceramic layers, for printed circuit boards of electrical circuits
    Patent number: 5087505
    Abstract: A multilayered substrate for printed circuit boards of electrical circuits, said substrate consisting of copper and ceramic layers which are joined together by the DBC method into said multilayered substrate, with each copper layer being formed by a copper sheet and each ceramic layer being formed by a ceramic plate, at least two of said layers forming a layer sequence having a hollow section or core, said at least two layers being arranged essentially parallel to each other, said at least two layers being spaced apart from one another by an intermediate spacing layer.
    Type: Grant
    Filed: April 18, 1990
    Date of Patent: February 11, 1992
    Inventor: Jurgen Schulz-Harder