Abstract: In a process for the manufacture of metal-ceramic compound material, especially metal-ceramic substrates, bonding components in the form of a plate-shaped ceramic substrate and an oxidized metal foil are bonded together by means of heating to a processing temperature in a protective gas atmosphere. For this purpose, the bonding components are placed in a reaction space formed within a capsule, which (space) is separated from the outer protective gas atmosphere by the capsule or in connection with the outer protective gas atmosphere only by means of a small opening.

Abstract: A module and a corresponding connector that include multiple rows of contacts is described. In one embodiment, the module may include a channel formed in a bottom edge of the module. A plurality of contacts may be disposed on the inner surface of the channel and the outer surface of the module. A complementary connector is also described.

Abstract: The invention relates to a novel ceramic/metal substrate, especially to a multiple substrate with a ceramic plate or ceramic layer.

Abstract: A device configured to recover and repeat source synchronous data. In one embodiment, the device is configured to receive source synchronous data via a first interface, recover the received data utilizing a corresponding received source synchronous clock signal, and transmit the recovered data and a corresponding clock signal in a source synchronous manner. In one embodiment, the device is configured to operate as a repeater without benefit of an internal clock signal. In addition, the device may be configured to remove data jitter and renew or restore amplitude to attenuated signals prior to retransmission.

Abstract: A method and mechanism for testing communication links. A transmitter contact, or transmission point, is assigned a unique identifier. During a given test, the transmitter conveys a test pattern to a receiver via a link. Following this test pattern, the transmitter transmits a bit of its unique identifier to the receiver. The receiver receives both the test pattern and the identifier bit, and determines whether the received test pattern matches an expected value. If the test pattern was correctly received by the receiver, the receiver transmits the received identifier bit back to the transmitter. However, if the received test pattern is not correct, the receiver complements the received identifier bit and transmits the complemented bit back to the transmitter. The transmitter receives the identifier bit from the receiver and determines whether it matches the identifier bit which was originally transmitted by the transmitter.

Abstract: A module and a corresponding connector that include multiple rows of contacts is described. In one embodiment, the module may include a channel formed in a bottom edge of the module. A plurality of contacts may be disposed on the inner surface of the channel and the outer surface of the module. A complementary connector is also described.

Abstract: The invention pertains to a new type of process for the manufacture of substrates with textured metalizations and holding and fastening elements for use in this process.

Abstract: A mirror for laser application and a method for manufacturing the mirror is disclosed herein. The mirror comprises several layers including a top layer used as the mirror surface. A cooling structure including a plurality of cooler layers are providing between the top layer, several intermediate layers and a bottom layer. Connections are provided for allowing a coolant to flow within the mirror. The mirror is constructed by stacking the layers on top of one another and connecting adjacent layers together by direct copper bonding or active soldering.

Abstract: Disclosed is a nozzle arrangement for the coextrusion of a product with at least two layers, whereby a distributor portion 14 adjacent to the extruder is provided through which an extruding mass is delivered to the extruder and whereby a nozzle portion 12 for the extrusion of the extrusion mass is connected to the distributor portion, whereby in accordance with the invention a mounting and connecting base is provided between the distributor portion and the nozzle portion.

Abstract: A cooler has a plurality of layers arranged in a stack and connected to one another along their surfaces. Each layer has openings allowing for three-dimensional flow of the coolant between an intake and an outlet. The flow resistance or the gradient of flow resistance increases from the intake to the outlet so that the coolant is increasingly forced to concentrate at the cooling surface as coolant flows from the intake to the outlet.

Abstract: A housing for a telecommunications system is described. The housing contains a housing base for accommodating modules and module frames, and a covering shroud connected releasably to the housing base and, with the housing base, encloses the modules and the module frames. The covering shroud has a casing plate forming at least part of the covering shroud, and plastic moldings connected, in part, to the casing plate and/or the housing base. Some of the plastic moldings can be lined up in a row one beside another to form a wall surface of the covering shroud.

Abstract: An elevator with an elevator cage guided in a shaft between a shaft head and a shaft pit, having an elevator cage roof and an elevator cage base and a drive, which is connected by at least one hauling cable with the elevator cage, whereby in particular for performing maintenance work the elevator cage roof is designed to be accessible, whereby the drive is arranged at least partly in the shaft head over a first region of the elevator cage roof and the accessibility of the elevator cage roof is restricted to a second region.

Abstract: A process for manufacturing a metal ceramic substratum for use as a substrate in electrical or electronic circuits or components which includes utilizing an unique form mold process. At least one blank ceramic plate is shaped in a form mold through a desired set of process steps. The steps include heating and cooling to desired temperatures at desired heat and cool rates.

Abstract: The invention pertains to a new type of cooling system for cooling of heat sources, especially for cooling of electric components, with a cooler comprising, on a housing through which a coolant can flow, at least one first cooling surface that can be splashed with the coolant and at least one second cooling surface for flange-mounting of the heat source.

Abstract: The invention relates to a novel process for producing a metal-ceramic substrate in which at least one surface side of the ceramic layer is provided with at least one first structured metal layer and at least one second metal layer is applied to the first by electroless chemical deposition, and in which at least one depression or hole, or a plurality of depressions or holes are formed in the ceramic layer by laser machining to form a scored line.

Abstract: The invention relates to a novel process for producing a ceramic-metal substrate for electrical circuits in which a first or second metal coating is applied to a ceramic layer on both sides, specifically first metal coating in the form of a copper foil using the DCB process.

Abstract: A process is provided in which an initial substrate has a ceramic layer with metal layers on either side. At least one of the metal layers projects above one edge of the ceramic layer. The projecting sub-area is deformed so that the metal layer on the edge is disposed a distance from the surface of the ceramic layer, and along the edge in one border area with a stipulated width is separated from the ceramic layer.

Abstract: The invention relates to a novel process for producing a copper ceramic substrate with at least one through-plated hole, with a ceramic layer which has at least one opening for the through-plating, on one surface side is provided with a first metal coating and on the opposite surface side with a second metal coating which extends into at least one opening and is connected to the first metal coating, for formation of the first metal coating a copper foil being applied by DCB technique to one surface side of the ceramic layer.

Abstract: The invention relates to a novel ceramic substrate with at least one layer essentially of aluminum nitride which is provided on at least one surface side with an intermediate or auxiliary layer which contains aluminum oxide and which has a thickness in the range of 0.5-10 microns, and to a process for its production.

Abstract: The invention relates to a cooler for use as a heat sink for electrical components or circuits consisting of several cooler layers which are joined flat to one another, which are stacked on top of one another, which form between channels through which coolant flows and which each discharge into at least one first collection space for supply of the coolant and into a second collection space for draining the coolant, the collection spaces being formed by openings in the cooler layers and the cooling channels by structuring at least one area of the coolant layers with openings, the area being between the openings.