Abstract: The invention relates to a novel process for producing a metal ceramic substrate, especially a copper-ceramic substrate, in which at least one metal foil at a time is applied to the surface sides of a ceramic layer or a ceramic substrate using a high temperature bonding process and the metal foil is structured on at least one surface side for forming conductive tracks, contact surfaces, and the like.

Abstract: A heat sink for cooling parts, subassemblies, modules, or similar components, for cooling electrical or electronic components. The heat sink includes at least one cooling element which forms at least one cooling area for connecting the component that is to be cooled and which is made of a metallic material in the cooling area.

Abstract: A package for holding metal-ceramic substrates, the package includes a tray manufactured from a flat material with at least one holder adapted to a format of the metal-ceramic substrates for holding the metal-ceramic substrates, an interior of the at least one holder of the tray being defined by a bottom and circumferentially by an edge and by at least one covering completely accommodating the tray, and the tray is sealed vacuum-tight by the covering and the covering has an interior accommodating the tray, and the tray is impinged with a vacuum so that the metal-ceramic substrates are fixed in the at least one holder by clamping on an edge-side of the tray by forces (F) exerted on the edge resulting from the ambient pressure.

Abstract: The invention relates to a method for producing Peltier modules, each of which comprises several Peltier elements that are arranged between at least two substrates. The substrates are made of an electrically insulating material at least on the sides facing the Peltier elements while being provided with contact areas on said surfaces. The contact areas, to which the Peltier elements are connected by means of terminal sure during the production process, are formed by metallic areas.

Abstract: In the case of a metal-ceramic substrate with a multilayered ceramic material in sheet form, and with at least one metallization that is provided on one surface side of the ceramic material and is joined to be ceramic material by direct bonding or active soldering, the ceramic material has at least one inner layer or base layer of a silicon nitride ceramic. The surface side of the ceramic material that is provided with the at least one metallization is formed by an intermediate layer of an oxidic ceramic applied to the base layer.

Abstract: A method is disclosed for producing metal-ceramic substrates that are metallized on both sides by using the direct bonding process. According to the method, at least one DCB stack made from first and a second metal layer and a ceramic layer located between said metal layers is formed on a separating layer of a support by heating to a direct bonding temperature. At least one of the metal layers rests against the separating layer during the bonding process, said separating layer being composed of a porous layer or coating made of a separating layer material from the group comprising mullite, Al2O3, TiO3, ZrO2, MgO, CaO CaCO2 or a mixture of at least two of said materials.

Abstract: A heating device for single cylindrical laboratory vessels (e.g., laboratory test tubes), the heating device including a clamp-like element using a force-fit to encompass at least a part of each cylindrical laboratory vessel, one or more electrical resistance heating circuits located at the interior of the clamp-like element, and grab handles to open and close the clamp-like element, thereby to insert or release the cylindrical laboratory vessel from the heating device.

Abstract: The invention relates to a novel process for producing a metal ceramic substrate, especially a copper-ceramic substrate, in which at least one metal foil at a time is applied to the surface sides of a ceramic layer or a ceramic substrate using a high temperature bonding process and the metal foil is structured on at least one surface side for forming conductive tracks, contact surfaces, and the like.

Abstract: An electromagnetic hydraulic valve (1) is provided having a valve housing (2) with a pressurized hydraulic medium inlet channel (24), a pressurized hydraulic medium outlet channel (25), a magnet coil (3), and a valve seat (23), with a magnet armature (9) that can be excited by the magnet coil and a valve tappet (10, 10?) fixed on this armature. A valve-closing element (13) is activated by the valve tappet and that blocks the connection between the pressurized hydraulic medium channels for contact on the valve seat. The magnet armature with the valve tappet and the valve-closing element are guided so that they can move longitudinally in the valve housing and the valve tappet and the valve-closing element contact each other with facing longitudinal end sides (26, 27) in a way that is free from tensile forces.

Abstract: A method and associated device for enrichment of Neél-magnetic particles from a dispersion of Brown-magnetic particles and Neél-magnetic particles. The device and method use ferromagnetic separation particles having a mean diameter of 100 to 250 ?m located in a alternating magnetic field. The ferromagnetic separation particles have a magnetically and chemically inert coating.

Abstract: The present invention relates to tetrahydroquinoline derivatives having general formula I: or a pharmaceutically acceptable salt thereof, wherein R1 is formyl, (1-6C)alkylcarbonyl or (1-6C)alkylsulfonyl; R2 and R3 are H or (1-4C)alkyl; R4 is phenyl; R5 is (1-4C)alkyl; Y—X is C(O)—O, S(O)2-O, NHC(O)—O, NHC(S)—O, OC(O)—O, bond-O, C(O)—NH, S(O)2-NH, NHC(O)—NH, NHC(S)—NH, OC(O)—NH, bond-NH, NH—C(O), O—C(O), NH—S(O)2, or O—S(O)2 or Y—X is a bond; R6 is H, trifluoromethyl, (1-6C)alkyl, 1- or 2-adamantyl(1-4C)alkyl, (2-6C)alkenyl, (2-6C)alkynyl, (3-9C)heteroaryl, (3-6C)cycloalkyl, (2-6C)heterocycloalkyl, (1-4C)alkylthio(1-4C)alkyl, (6-10C)aryl(1-4C)alkyl, (3-9C)heteroaryl(1-4C)alkyl, (3-6C)cycloalkyl(1-4C)alkyl, (2-6C)heterocycloalkyl(1-4C)alkyl, R8,R9-aminocarbonyl(1-4C)alkyl, R8,R9-amino(1-4C)alkyl, R8-oxycarbonyl(1-4C)alkyl, R8-oxy(1-4C)alkyl, R8-carbonyl(1-4C)alkyl or (6-10C)aryl; R7 is H, (1-4C)alkyl, (1-4C)alkoxy, halogen, trifluoromethyl, cyano, nitro, hydroxyl; and R8 and/or R9 is H, (1-4C)alkyl, (2-4C

Abstract: The present invention relates to tetrahydroquinoline derivatives having general formula I: or a pharmaceutically acceptable salt thereof, wherein R1 is formyl, (1-6C)alkylcarbonyl or (1-6C)alkylsulfonyl; R2 and R3 are H or (1-4C)alkyl; R4 is phenyl; R5 is (1-4C)alkyl; Y—X is C(O)—O, S(O)2-O, NHC(O)—O, NHC(S)—O, OC(O)—O, bond-O, C(O)—NH, S(O)2-NH, NHC(O)—NH, NHC(S)—NH, OC(O)—NH, bond-NH, NH—C(O), O—C(O), NH—S(O)2, or O—S(O)2 or Y—X is a bond; R6 is H, trifluoromethyl, (1-6C)alkyl, 1- or 2-adamantyl(1-4C)alkyl, (2-6C)alkenyl, (2-6C)alkynyl, (3-9C)heteroaryl, (3-6C)cycloalkyl, (2-6C)heterocycloalkyl, (1-4C)alkylthio(1-4C)alkyl, (6-10C)aryl(1-4C)alkyl, (3-9C)heteroaryl(1-4C)alkyl, (3-6C)cycloalkyl(1-4C)alkyl, (2-6C)heterocycloalkyl(1-4C)alkyl, R8,R9-aminocarbonyl(1-4C)alkyl, R8,R9-amino(1-4C)alkyl, R8-oxycarbonyl(1-4C)alkyl, R8-oxy(1-4C)alkyl, R8-carbonyl(1-4C)alkyl or (6-10C)aryl; R7 is H, (1-4C)alkyl, (1-4C)alkoxy, halogen, trifluoromethyl, cyano, nitro, hydroxyl; and R8 and/or R9 is H, (1-4C)alkyl, (2-4C

Abstract: The invention relates to a novel process for producing a metal ceramic substrate, especially a copper-ceramic substrate, in which at least one metal foil at a time is applied to the surface sides of a ceramic layer or a ceramic substrate using a high temperature bonding process and the metal foil is structured on at least one surface side for forming conductive tracks, contact surfaces, and the like.

Abstract: An electric device with an insulating substrate consisting of an insulating layer and at least one metallization on a surface side of the insulating layer, the metallization being structured and having an electric component on the metallization. The metallization has a layer thickness that is stepped and is greater in an area adjoining the component.

Abstract: A metal-ceramic substrate for electrical circuits or modules includes at least one first outer metal layer forming one first surface side of the metal-ceramic substrate and at least one second outer metal layer forming one second surface side of the metal-ceramic substrate. The outer metal layers are bonded respectively by two-dimensional bonding with the surface sides of a plate-like substrate body.

Abstract: An electric unit, having at least one cooler structure and at least one electric module with at least one electric element on a metal-ceramic substrate.

Abstract: The invention relates to a blood plasma collecting flask made of plastic for the storage of blood plasma in the frozen state, comprising a flask body (1) which in the horizontal section has a cross-section with a rectangular basic shape and has on its upper side a flask neck (2), wherein the lateral faces of the flask body (2) respectively define a flat or slightly inwardly curved area (3) adjoining which are areas rounded towards the face surfaces.

Abstract: The invention relates to a diode laser array with at least one laser bar and having at least one emitter and a heat sink array for cooling the at least one laser bar.

Abstract: A metal/ceramic substrate made up of a multilayer, plate-shaped ceramic material and at least one metallization provided on a surface side of the ceramic material. The at least one metallization is bonded to the ceramic material by direct copper bonding or reactive brazing and the ceramic material is made of a base layer made of silicon nitride ceramic. The at least one metallization is formed from at least one intermediate layer of an oxidic ceramic applied to the at least one base layer.

Abstract: A method for manufacturing a metal-ceramic substrate with at least one metallization, patterned by etching, on at least one surface side of a laminar ceramic material. The metal-ceramic substrate includes a base substrate made of an aluminum-nitride or silicon-nitride ceramic. The metallization is applied by active soldering before patterning. An intermediate layer made of an oxidic ceramic is provided between the at least one metallization and the base substrate.