Abstract: In the case of a metal-ceramic substrate with at least one metallization, patterned by etching, on at least one surface side of a laminar ceramic material which includes a base substrate made of an aluminum-nitride or silicon-nitride ceramic and to which the metallization is applied by active soldering before patterning, an intermediate layer made of an oxidic ceramic is provided between the at least one metallization and the base substrate.

Abstract: A heat sink designed as a heat pipe has an interior space in a body of the heat sink that is closed toward the outside. The interior space has at least one vapor channel and at least one fluid space connected with the vapor space and having a porous or capillary structure. The heat pipe is made using the DCB process to connect each end of posts within the interior space directly with one of the two opposing walls forming the interior space.

Abstract: The invention relates to a diode laser array with at least one laser bar and having at least one emitter and a heat sink array for cooling the at least one laser bar.

Abstract: The invention relates to a substrate with a metallic carrier layer, at least one insulating layer which is provided on a surface side of the carrier layer and which is produced with the aid of a polymer material or polymer component, in addition to metallization which is provided on a partial area of the insulating layer and electrically separated from the carrier layer by means thereof. The insulating layer contains at least one other component which, as a distance-maintaining component, defines the thickness of the insulating layer and is made of a dimensionally stable inorganic material.

Abstract: Disclosed herein are quinazolinone derivatives of formula I, or pharmaceutically acceptable salts or solvates thereof, wherein each of the substituents is given the definition as set forth in the specification and claims. Also disclosed are pharmaceutical compositions comprising quinazolinone or isoquinolinone according to the present invention and its use in therapy.

Abstract: The invention relates to an innovative method for manufacturing plate stacks, particularly for manufacturing coolers or cooler elements or heat sinks at least one plate stack, with at least two plate-shaped elements made of metal, for example copper, and provided with passages or openings, wherein the stacked elements are joined with each other using bonding on joining surfaces formed by surface sides of said elements by heating to a process temperature to form the stack.

Abstract: Disclosed is a metal-ceramic substrate made up of at least one ceramic layer which is provided with metallizations on both faces. In order to obtain a partial discharge resistance of less than 10 pC at a predefined measuring voltage, the thickness of the ceramic layer amounts to about one sixth of the measuring voltage.

Abstract: A method is disclosed for producing metal-ceramic substrates that are metallized on both sides by using the direct bonding process. According to the method, at least one DCB stack made from first and a second metal layer and a ceramic layer located between said metal layers is formed on a separating layer of a support by heating to a direct bonding temperature. At least one of the metal layers rests against the separating layer during the bonding process, said separating layer being composed of a porous layer or coating made of a separating layer material from the group comprising mullite, Al2O3, TiO3, ZrO2, MgO, CaO CaCO2 or a mixture of at least two of said materials.

Abstract: A method for manufacturing plate stacks for the production of coolers, cooler elements or heat sinks made of at least one plate stack for cooling electric or opto-electric components. The process includes the manufacture of plates or boards of metal, stacking the plates to form a plate stack, joining of the plates with the application of heat and pressure to form a stack, and post-treatment of the plate stack.

Abstract: A data communications system is disclosed. The data communications system comprises two clock domains. Each of the clock domains are coupled to receive a source clock signal. The first clock domain includes a first clock signal with a first frequency and the second clock domain includes a second clock signal with a second frequency, each of the first clock signal and the second clock signal are derived from the source clock signal. A ratio of the first frequency to the second frequency is N:M. The first clock domain is configured to initialize a count to N, in response to detecting N is less than 2*M; and initialize the count to M, in response to detecting N is not less than 2*M.

Abstract: The invention relates to a novel device made up of a heat source that is formed by at least one electrical or electronic component or is provided with such a component, a heat sink, and an intermediate layer which is located between the heat source and the heat sink and is made of a thermally conducting material. The thermally conducting material is made up of an organic matrix with incorporated nanofibers.

Abstract: In a method for distributing packages or similar dispatched articles, packages that are to be transported from a private and/or commercial sender to an addressee are acquired in a collecting location. In this collecting location, the packages are provided with a package code that has electronically detectable data, and subsequently, the packages are distributed and/or delivered by means of transport vehicles. According to the invention, the collected packages are supplied to a HUB center that is connected to several collecting locations and in the HUB center the respective package codes are expanded with measurement data (length, width, height, weight) of the package to a package routing code. These package routing codes of all packages are supplied to a central computer and the packages are arranged in accordance with a route planning that can be dynamically optimized by the central computer into a sequence that is sorted in accordance with distribution zones.

Abstract: At least one power semiconductor component is cooled by a flat, copper, plate-type hollow body conducting a coolant fluid. Components are fixed on one flat-sided surface of the hollow body and the other flat-sided surface includes two coolant fluid openings for introducing the coolant fluid into the hollow body and for evacuating the fluid therefrom. The other flat-sided surface is concave and elastically deformable between the coolant fluid openings. The concave other surface is attached to the even surface of a support in such a way that the concave surface and the even surface are pressed against each other by the elastically planar deformation of the concave surface and that the coolant fluid openings are sealed in a fluidproof manner by O-rings. A solid strut, which interconnects the two flat-sided surfaces is additionally configured in the hollow body. The cooling device may be used in a module or an assembly including a support and the cooling device or module.

Abstract: In one embodiment, a system comprises a source configured to provide data and a source error correction code (ECC) generated according to a source ECC scheme; a circuit comprising an ECC transform unit configured to generate a target ECC from the data, detect an error in the data responsive to the source ECC, and correct the error in the data, wherein the target ECC is generated according to a target ECC scheme different from the source ECC scheme, and wherein the ECC transform unit is configured to continuously protect the data with at least one of the source ECC and the target ECC; and a target coupled to receive the data and the target ECC from the circuit.

Abstract: The invention relates to a novel composite material, especially for applications in the field of electrical engineering. Said novel material has a thermal coefficient of expansion that is smaller than 12×10?6 K?1 in at least two axes of a three-dimensional system that are perpendicular in relation to each other.

Abstract: A device configured to recover and repeat source synchronous data. In one embodiment, the device is configured to receive source synchronous data via a first interface, recover the received data utilizing a corresponding received source synchronous clock signal, and transmit the recovered data and a corresponding clock signal in a source synchronous manner. In one embodiment, the device is configured to operate as a repeater without benefit of an internal clock signal. In addition, the device may be configured to remove data jitter and renew or restore amplitude to attenuated signals prior to retransmission.

Abstract: The invention relates to a novel method for producing a metal/ceramic substrate, which is characterized by applying at least one metal area to at least one top surface of a ceramic layer. At least one metal area is applied to at least one surface side of a ceramic layer, wherein the ceramic layer is heated in a thermal process step in an area not covered by the metal area along a separating or break-off line.

Abstract: The conductor board has at least one layer of a dielectric provided areally on two mutually opposed faces with at least one metalization on each. There is at least one through contacting in the region of an aperture. The metalizations are applied to cover at least one aperture and are electrically connected to each other through the aperture.

Abstract: A computer system including a memory controller configured to perform pre-fetch operations. A computer system includes a first system memory, a second system memory and a first and a second memory controller which are coupled to the first and second system memories, respectively. Each system memory may include at least one memory module including volatile storage. The first memory controller may be configured read data from the first system memory corresponding to an address of a current memory request. Further the second memory controller may be configured to selectively pre-fetch data from the second system memory depending upon selected address bits of the address of the current memory request.

Abstract: The invention relates to a novel design of a cooler in the form of a heat pipe, with a housing in which an interior space closed to the outside is formed to hold a liquid, vaporizable coolant or heat-transport medium.