Patents by Inventor Kai Lu

Kai Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11453776
    Abstract: The present invention relates to a polylactic acid 3D printing material and a preparation method thereof, which belong to the technical field of polymer materials. The polylactic acid 3D printing material of the present invention comprises the following preparation raw materials in parts by weight: (a) 40-95 parts of crystalline or semi-crystalline polylactic acid, (b) 5-60 parts of noncrystalline polylactic acid, and (c) 0-1.0 parts of a processing aid. In the polylactic acid 3D printing material, a weight of dextral polylactic acid represents 0.5%-8% of a total weight of the polylactic acid. According to the present invention, a polylactic acid 3D printing material with a good aging resistance property can be obtained, by selecting and using two kinds of polylactic acids with different optical purities as raw materials, rationally distributing the proportional relationship between the two, and defining the content of dextral polylactic acid.
    Type: Grant
    Filed: May 28, 2019
    Date of Patent: September 27, 2022
    Assignee: KINGFA SCI. & TECH. CO., LTD.
    Inventors: Kai Xiong, Zhimin Yuan, Tongmin Cai, Xianbo Huang, Xiangbin Zeng, Jian Jiao, Changli Lu, Hui Yang, Kaijin Mai, Xueteng Dong, Weida Ou
  • Patent number: 11450700
    Abstract: In some embodiments, the present disclosure relates to an image sensor structure. The image sensor structure includes a substrate. The substrate includes a first side and a second side opposite the first side. A photodetector extends into the first side of the substrate. An isolation structure comprises a first isolation segment and a second isolation segment that extend through the substrate. The first isolation segment and the second isolation segment are respectively on opposite sides of the photodetector and comprise a dielectric. A first metal line is on the first side of the substrate. A dummy contact structure comprises a first dummy segment and a second dummy segment. Both the first dummy segment and the second dummy segment comprise metal and extend from the first metal line to the first isolation segment and the second isolation segment, respectively.
    Type: Grant
    Filed: July 29, 2020
    Date of Patent: September 20, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tsun-Kai Tsao, Jiech-Fun Lu
  • Publication number: 20220289740
    Abstract: The present invention provides an RET selective inhibitor and preparation method and use thereof; the present invention provides a compound of formula (1) and a pharmaceutically accepted salt, solvate, polymorph, or tautomer thereof, a composition comprising these compounds, and use of these compounds in the treatment of diseases related to RET.
    Type: Application
    Filed: July 10, 2020
    Publication date: September 15, 2022
    Inventors: Zhihua LIU, Dechuang YUAN, Kuncheng CHEN, Baokun YUAN, Ren REN, Wangyang MIN, Xijie LIU, Kai ZHANG, Yongliang SUN, Chang LU, Yinghui SUN
  • Patent number: 11444177
    Abstract: Improved inner spacers for semiconductor devices and methods of forming the same are disclosed.
    Type: Grant
    Filed: July 27, 2020
    Date of Patent: September 13, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Wen-Kai Lin, Che-Hao Chang, Chi On Chui, Yung-Cheng Lu
  • Patent number: 11442210
    Abstract: A polarizer substrate includes a substrate, a reflective layer, and a metal pattern layer. The reflective layer is located on the substrate and has a transmission area and a reflective area. The metal pattern layer is located on the reflective layer and the substrate. The metal pattern layer includes a polarizer structure and a microstructure. The polarizer structure includes a plurality of grid lines overlapping the transmission area. A thickness of each of the grid lines is 200 nm to 500 nm, a width of each of the grid lines is 30 nm to 70 nm, and a distance between each adjacent two of the grid lines is 30 nm to 70 nm. The microstructure overlaps the reflective area, and a thickness of the microstructure is 20 nm to 500 nm.
    Type: Grant
    Filed: July 20, 2020
    Date of Patent: September 13, 2022
    Assignee: Au Optronics Corporation
    Inventors: Sheng-Kai Lin, Chia-Hsin Chung, Tsai-Sheng Lo, Sheng-Ming Huang, Ming-Jui Wang, Chih-Chiang Chen, Hui-Ku Chang, Cheng-Chan Wang, Chia-Po Lin, Jen-Kuei Lu
  • Patent number: 11442742
    Abstract: A method and system for constructing a lightweight container-based user environment (CUE), and a medium, the method including: preparing, by a main process, for communication, cloning a child process, and then becoming a parent process; elevating, by the child process, permission, executing namespace isolation, and cloning a grandchild process, and setting, by the parent process, cgroups for the grandchild process; and setting, by the grandchild process, permission of the grandchild process to execute a command and a file, preparing an overlay file system, setting a hostname, restricting permission, and executing an initialization script to start the container. Multiple users are allowed to customize their own environments, enabling the users to customize their environments more flexibly, achieving privacy isolation, and making it easier and more secure to update a system. Therefore, it is particularly applicable to a high-performance computing cluster.
    Type: Grant
    Filed: July 12, 2020
    Date of Patent: September 13, 2022
    Assignee: National University of Defense Technology, People's Liberation Army of China
    Inventors: Kai Lu, Wenzhe Zhang, Ruibo Wang, Yinghui Gao, Wanqing Chi, Enqiang Zhou, Min Xie, Yong Dong, Wei Zhang, Jiaxin Li, Mingtian Shao
  • Publication number: 20220285529
    Abstract: A method includes forming a first and a second dummy gate stack crossing over a semiconductor region, forming an ILD to embed the first and the second dummy gate stacks therein, replacing the first and the second dummy gate stacks with a first and a second replacement gate stack, respectively, performing a first etching process to form a first opening. A portion of the first replacement gate stack and a portion of the second replacement gate stack are removed. The method further includes filling the first opening to form a dielectric isolation region, performing a second etching process to form a second opening, with the ILD being etched, and the dielectric isolation region being exposed to the second opening, forming a contact spacer in the second opening, and filling a contact plug in the second opening. The contact plug is between opposite portions of the contact spacer.
    Type: Application
    Filed: May 23, 2022
    Publication date: September 8, 2022
    Inventors: Ting-Gang Chen, Tai-Chun Huang, Ming-Chang Wen, Shu-Yuan Ku, Fu-Kai Yang, Tze-Liang Lee, Yung-Cheng Lu, Yi-Ting Fu
  • Patent number: 11435797
    Abstract: A power module and a manufacturing method thereof are disclosed. The power module includes a substrate, a power device, a leading component and a molding component. The substrate includes a first side, a second side and a conductive wire. The power device is disposed on the substrate and electrically connected with the conductive wire. The leading component is disposed on the substrate and includes a first horizontal portion and a vertical portion connected with each other. The vertical portion is electrically connected with the conductive wire. The leading component includes a first contact surface and a second contact surface, which are non-coplanar. The molding component is disposed on the substrate and covers at least portion of the substrate and at least portion of the leading component. The first contact surface and the second contact surface are uncovered by the molding component.
    Type: Grant
    Filed: March 11, 2021
    Date of Patent: September 6, 2022
    Assignee: DELTA ELECTRONICS (SHANGHAI) CO., LTD.
    Inventors: Shouyu Hong, Yiqing Ye, Kai Lu, Qingdong Chen, Le Liang, Jianhong Zeng
  • Publication number: 20220266791
    Abstract: A safety belt retractor, comprising a frame (8) and a belt retracting cylinder (1), the retracting cylinder (1) being rotatably supported in the frame (8) and being composed to be used for winding a woven belt (2). The frame (8) comprises: a back plate (8h), which has a first side and a second side which are opposite to each other, and a first opening (20); a plurality of first supporting legs (8a,8b), extending from the first side of the back plate (8h); a first support plate (11), which is provided with a second opening (21) and is connected to free end regions of the first supporting legs (8a, 8b); a plurality of second supporting legs (8c, 8d, 8e, 8f), extending from the second side of the back plate (8h); and a second supporting plate (9), connected to the free end regions of the second supporting legs (8c, 8d, 8e, 8f). The first opening (20) and the second opening (21) receive the belt retracting cylinder (1). The safety belt retractor is simple in structure and easy to assembly.
    Type: Application
    Filed: July 22, 2020
    Publication date: August 25, 2022
    Applicant: Yanfeng Automotive Safety Systems Co., Ltd.
    Inventors: Lijun ZHANG, Kai LU
  • Publication number: 20220272166
    Abstract: A system for implementing service function deployment includes an active apparatus and a standby apparatus for a first service, such as an active main processing unit (MPU) and a standby MPU. The active apparatus is configured to process the first service and deploy a first function module (such as a feature extraction module or an inference module) for a second service (such as an artificial intelligence (AI) service) on the standby apparatus. The standby apparatus is configured to process data of the second service by using the first function module. The second service may be implemented by using an idle resource of the standby apparatus for the first service.
    Type: Application
    Filed: May 10, 2022
    Publication date: August 25, 2022
    Inventors: Hao Wu, Chuntao Wang, Kai Lu, Jianbing Wang
  • Publication number: 20220263580
    Abstract: Systems and methods for optical communication are provided. For instance, a method for optical communication can include receiving, by a first coupling module, a power-on signal from a first electronic device coupled to the first coupling module. The method can also include relaying, by the first coupling module, a first optical signal to a second coupling module coupled to a second electronic device. The method can also include relaying, by the second coupling module, in response to receipt of the first optical signal, a second optical signal to the first coupling module. The method can also include activating, by the first coupling module, in response to receipt of the second optical signal, a data transfer circuit for relaying data via an optical communication interface between the first coupling module and the second coupling module.
    Type: Application
    Filed: May 9, 2022
    Publication date: August 18, 2022
    Inventors: Shih-Tai Chuang, Shih-Jie Wu, Li-Gang Lai, Yien-Tien Chou, Shao-Chien Chang, Kai-Wei Chiu, Shu-Lu Chen
  • Publication number: 20220259037
    Abstract: A method includes bonding a supporting substrate to a semiconductor substrate of a wafer. A bonding layer is between, and is bonded to both of, the supporting substrate and the semiconductor substrate. A first etching process is performed to etch the supporting substrate and to form an opening, which penetrates through the supporting substrate and stops on the bonding layer. The opening has substantially straight edges. The bonding layer is then etched. A second etching process is performed to extend the opening down into the semiconductor substrate. A bottom portion of the opening is curved.
    Type: Application
    Filed: May 18, 2021
    Publication date: August 18, 2022
    Inventors: Jhao-Yi Wang, Chin-Yu Ku, Wen-Hsiung Lu, Lung-Kai Mao, Ming-Da Cheng
  • Publication number: 20220254971
    Abstract: An inorganic ultraviolet LED device, includes a bracket, a curved lens, a press ring, a wire and an ultraviolet chip. A “T”-shaped recess is formed on the upper end of the bracket. The ultraviolet chip is fixed within the recess and connected to a welding layer at the lower end of the bracket through the wire. The curved lens is placed on a step of the recess. An inclined surface is formed on a contact surface of the step contacting with the curved lens. One end of the press ring is connected to the bracket, and the other end thereof presses against the curved lens. Deformation of the press ring is implemented under a pressure action of a pressure head, thereby implementing high-strength bonding of the device. Self-positioning is achieved through a curved surface of the lens and the contact with the inclined surface of the bracket.
    Type: Application
    Filed: July 10, 2020
    Publication date: August 11, 2022
    Inventors: Zongtao LI, Xinrui DING, Hanguang LU, Yong TANG, Kai CAO, Longshi RAO, Hong WANG
  • Publication number: 20220255636
    Abstract: A frequency combination corresponding to target data to be transmitted is determined. The frequency combination includes at least two different frequencies. Ultrasonic waves of frequencies in the frequency combination are sent within a predetermined duration.
    Type: Application
    Filed: June 28, 2021
    Publication date: August 11, 2022
    Applicant: BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
    Inventors: Runyu SHI, Naichao GUO, Song MEI, Yuqing HUA, Lin ZHANG, Wei LU, Kai WANG
  • Publication number: 20220252722
    Abstract: A method, apparatus, and a non-transitory computer-readable storage medium for event detection are provided. The method may be applied to an electronic device. The electronic device may transmit a detection signal. The electronic device may receive an echo signal of the detection signal. The electronic device may acquire a feature value of the echo signal. The electronic device may calculate a decision parameter based on the feature value, and may determine, based on the decision parameter, that the electronic device is moving towards or away from a target object.
    Type: Application
    Filed: June 30, 2021
    Publication date: August 11, 2022
    Applicant: BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
    Inventors: Kai WANG, Runyu SHI, Wei LU, Chenchen BAO, Xudong YIN
  • Patent number: 11403546
    Abstract: The invention discloses a sewage treatment process fault monitoring method based on fuzzy width adaptive learning model. Including “offline modeling” and “online monitoring” two stages. “Offline modeling” first uses a batch of normal data and 4 batches of fault data as training samples to train the network offline and label the data. After the network training is completed, the weight parameters are obtained for online monitoring. “Online monitoring” includes: using newly collected data as test data, using the same steps as offline training networks for online monitoring. The output result of online monitoring adopts one-hot encoding to realize zero-one discrimination of the output result of online monitoring, so as to realize fault monitoring. The present invention only needs to increase the number of enhanced nodes, reconstruct in an incremental manner, and does not need to retrain the entire network from the beginning.
    Type: Grant
    Filed: October 22, 2021
    Date of Patent: August 2, 2022
    Assignee: BEIJING UNIVERSITY OF TECHNOLOGY
    Inventors: Peng Chang, Chunhao Ding, Ruiwei Lu, Zeyu Li, Kai Wang
  • Publication number: 20220238575
    Abstract: Various embodiments of the present disclosure are directed towards a method for forming an image sensor, the method includes forming a photodetector in a substrate. A first vertical gate electrode is formed extending into a first surface of the substrate. The first vertical gate electrode is adjacent to a first side of the photodetector. A second vertical gate electrode is formed extending into the first surface of the substrate. The second vertical gate electrode is adjacent to a second side of the photodetector opposite the first side.
    Type: Application
    Filed: April 12, 2022
    Publication date: July 28, 2022
    Inventors: Tsun-Kai Tsao, Jiech-Fun Lu, Shih-Pei Chou
  • Publication number: 20220238353
    Abstract: A method includes forming a first package component, which formation process includes forming a first plurality of openings in a first dielectric layer, depositing a first metallic material into the first plurality of openings, performing a planarization process on the first metallic material and the first dielectric layer to form a plurality of metal pads in the first dielectric layer, and selectively depositing a second metallic material on the plurality of metal pads to form a plurality of bond pads. The first plurality of bond pads comprise the plurality of metal pads and corresponding parts of the second metallic material. The first package component is bonded to a second package component.
    Type: Application
    Filed: April 1, 2021
    Publication date: July 28, 2022
    Inventors: Mirng-Ji Lii, Chen-Shien Chen, Lung-Kai Mao, Ming-Da Cheng, Wen-Hsiung Lu
  • Publication number: 20220238697
    Abstract: A method includes performing an atomic layer deposition (ALD) process to form a dielectric layer on a wafer. The ALD process comprises an ALD cycle includes pulsing calypso ((SiCl3)2CH2), purging the calypso, pulsing ammonia, and purging the ammonia. The method further includes performing a wet anneal process on the dielectric layer, and performing a dry anneal process on the dielectric layer.
    Type: Application
    Filed: May 28, 2021
    Publication date: July 28, 2022
    Inventors: Wen-Kai Lin, Che-Hao Chang, Chi On Chui, Yung-Cheng Lu, Szu-Ying Chen
  • Patent number: 11397453
    Abstract: A heat dissipation system includes a single fan, first and second heat sources, first, second, and third heat pipes, and first and second heat dissipation arrays. The first heat pipe is thermally coupled with the first heat source. The second heat pipe is thermally coupled with the second heat source. The third heat pipe has a first position thermally coupled with the first heat pipe and a second position thermally coupled with the second heat pipe. The first heat dissipation array is arranged around the first position and thermally coupled with the third heat pipe. The second heat dissipation array is arranged around the second position and thermally coupled with the third heat pipe. The single fan is between the first and second heat sources, and configured to blow airflows towards the first and second heat sources, the first and second heat dissipation arrays.
    Type: Grant
    Filed: June 8, 2020
    Date of Patent: July 26, 2022
    Assignees: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATION
    Inventors: Jyun-Ji Lu, Sheng-Chieh Hsu, Chih-Kai Yang