Abstract: A circuit board includes a mounting surface and a number of connecting pads on the mounting surface. Each of the connecting pads defines a mounting area for mounting an element thereon. At least two of the connecting pads are substantially circular-shaped.

Abstract: An optical fiber coupler includes a male port and a female port. The male port includes a main body, the male transmission lens and the male receiving lens positioned on the main body, and a male optical wave guide assembly. The male base board includes at least one male optical wave guide. Each male optical wave guide includes a male first alignment portion and a male second alignment portion. The male first alignment portion is optically coupled with one male receiving lens; and a male second alignment portion has a greater width than that of the male first alignment portion. The structure of the female port is similar to the male port.

Abstract: An optical connector includes a printed circuit board, a photoelectric element, a lens element, and an adhesive. The photoelectric element is positioned on and electrically connected to the printed circuit board. The positioning element is an enclosing wall extending from the printed circuit board and enclosing the photoelectric element. The lens element includes a bottom surface, an internal lens formed on the bottom surface, and a supporting leg, which is an enclosing wall extending from a periphery of the bottom surface. The supporting leg is positioned on the printed circuit board and fittingly engaged with the positioning element. The adhesive is applied between the supporting leg and the printed circuit board.

Abstract: An optical coupler includes a male port and a female port. The male port includes a first main body, a first optical fiber, and a male port lens unit. The male port lens unit includes a first base body, a first male port lens coupling with the first optical fiber, and a second male port lens. The first base body includes a male port reflecting sidewall. The female port includes a second main body, a second optical fiber, and a female port lens unit. The female port lens unit includes a second base body, a first female port lens coupling with the second optical fiber, and a second female port lens coupling with the second male port lens. The second base body includes a female port reflecting surface parallel with the male port reflecting sidewall.

Abstract: An optical fiber connector includes a body, a photoelectric conversion module received in the body, a receiving member, and two L-shaped optical fibers. The photoelectric conversion module includes a base, a light emitting unit, and a light receiving unit. The light emitting unit and the light receiving unit are mounted on the base. The receiving member is disposed over the light emitting unit and the light receiving unit and defines two L-shaped receiving holes. The optical fibers are received in the respective receiving holes. One end of one of the two optical fibers is optically aligned and coupled with the light emitting unit. One end of the other optical fiber is optically aligned and coupled with the light receiving unit.

Abstract: A laser projection device includes three laser chips, a spectroscope arranged on light paths of laser beams emitted from the three laser chips, and a lens mounted between the laser chips and the spectroscope. The lens includes a main body and a bending part bent from the main body. The main body is on the light paths of two of the laser chips. The bending part is on the light path of another laser chip. The laser beams emitted from the corresponding two laser chips are refracted by the main part of the lens. The laser beams emitted from the corresponding another laser chip are refracted by the bending part. The laser beams emitted from the laser chips are converged by the lens to reach the spectroscope and then reflected by the spectroscope to be mixed together.

Abstract: A chip assembly includes a PCB and a chip positioned on the PCB. The PCB includes a number of first bonding pads. Each bonding pad includes two first soldering balls formed thereon. The chip includes a number of second bonding pads each corresponding to a first bonding pad. Each second bonding pad includes a second soldering ball. The two first soldering balls of a first bonding pad are electrically connected to the second soldering ball of a corresponding second bonding pad via two bonding wires.

Abstract: An optical communication module includes a lens unit and an optical-electrical converter. The optical-electrical converter includes a circuit board and the lens unit is fixed on the circuit board. The lens unit has an extension portion, and the extension portion extends outwards from the lens unit and is parallel to the circuit board. Glue is located between the extension portion and the circuit board to secure the lens unit on the circuit board.

Abstract: An optical element package includes an optical wave guide array, at least one optical assembly and at least one optical transmission member. The optical wave guide array has a reflection groove. The reflection groove includes a reflection surface. The at least one optical assembly is positioned on the optical wave guide array adjacent to the reflection surface. The at least one optical transmission member is positioned on the optical wave guide array, and is optically coupled with the reflection surface. The optical signals emitted by the at least one optical assembly are reflected by the reflection surface and then reaching the at least one optical transmission member for transmission.

Abstract: An optical fiber coupling assembly includes a first optical fiber connector and a second optical fiber connector. The first optical fiber connector includes a first body having a first light incident surface, first optical lenses, first plugs, and second plugs. The first optical lenses, the first plugs, and the second plugs are formed on the first light incident surface. The first optical lenses are positioned between the first plugs, and the first plugs are positioned between the second plugs. The second plugs are longer than the first plugs. The second optical fiber connector includes a second body having a second light incident surface and second optical lenses formed on the second light incident surface. First engaging holes and second engaging holes are defined in the second light incident surface. The first plugs are inserted into the first engaging holes, and the second plugs are inserted into the second engaging holes.

Abstract: An optical-electrical converting device includes a substrate, an electrical circuit layer, at least one auxiliary pad, and an optical-electrical converting lens. The electrical circuit layer includes at least one circuit portion. The optical-electrical lens includes at least one first supporting portion and at least one second supporting portion. Each of the at least one first supporting portion is positioned on a respective one of the at least one first circuit portion, and each of the at least one second supporting portion is positioned on a respective one of the at least one auxiliary pad. The electrical circuit layer and the at least one auxiliary pad are arranged on the substrate. The thickness of the at least one first circuit portion layer is substantially equal to the thickness of the at least one auxiliary pad.

Abstract: An optical connector includes a substrate, a photoelectric element, and a base. The substrate includes a bearing surface. The photoelectric element includes a base, at least one light emitter, and at least one light receiver. The base is positioned on the bearing surface and includes an installing surface substantially perpendicular to the bearing surface. The light emitters and the light receivers are positioned on the installing surface. The optical element includes at least two first lenses and at least two second lenses aligned with the first lenses. The light emitters and the light receivers are aligned with the first lenses.

Abstract: A circuit board assembly includes a circuit board, at least one pad formed on the circuit board, and at least one connection line. Each of the at least one connection line includes a connection end connected to a respective one of the at least one pad and has the same resistance value as the respective pad.

Abstract: A light source includes a base, a first bonding layer, at least two laser diodes, a second bonding layer, a substrate, and a planar waveguide. The laser diodes are fixed to and are electrically connected to the base using the first bonding layer, and each of the laser diodes includes a side surface for emitting light. The substrate is fixed to the base using the second bonding layer. The waveguide is formed on the substrate and includes an output section including an output end and at least two input branches branching off from an end of the output section opposite to the output end. Each of the input branches includes an input end opposite to the output section and aligning with a respective one of the side surfaces of the at least two laser diodes.

Abstract: A device projecting images by micro electro-mechanical system (MEMS) technology mirrors includes a base, a first substrate, a first reflective mirror, a second substrate, and a second reflective mirror. The first substrate and the second substrate are adjacently positioned on the base. The first reflective mirror is formed on the first substrate by a micro electro-mechanical system (MEMS) technology and configured for receiving a light beam and rotating in two directions under control of the MEMS for reflect the received light in two directions. The second reflective mirror is formed on the rotatable second substrate to receive the image and be rotated, thus further adjusting the range of the projected images.

Abstract: A device projecting images by micro electro-mechanical system (MEMS) technology mirrors includes a base, a rotating seat, a substrate, a reflective mirror, a driver, and a controller. The rotating seat is rotably positioned on the base. The substrate is positioned on the rotating seat. The at least one MEMS reflective mirror is formed on the substrate and configured for rotating in two directions under control of the attached driver and controller to form two-dimensional images in a range.

Abstract: A circuit board assembly includes a circuit board, a first optical transceiver electrically connected to the circuit board, a first transparent shell optically coupled with the first optical transceiver, a second optical transceiver electrically connected to the circuit board, a second transparent shell optically coupled with the second optical transceiver, and a plurality of light wave guides optically coupled with the first transparent shell and the second transparent shell. The first optical transceiver sends first light signals. The first light signals are transmitted through the first transparent shell, the light wave guides, and the second transparent shell and are received by the second optical transceiver. The second optical transceiver sends second light signals. The second light signals are transmitted through the second transparent shell, the light wave guides, and the first transparent shell and are received by first optical transceiver.

Abstract: An optical communication module includes a substrate, an optical signal receiving unit, an optical signal emitting unit and a coupler. The substrate includes a first surface and a second surface. The substrate defines through holes passing through the first and second surfaces. The optical signal receiving unit includes optical-electrical signal converters. The optical signal emitting unit includes optical signal generators. Each of the optical-electrical signal converters and the optical signal generators is mounted on the first surface and aligned with a corresponding one of the through holes. The coupler includes coupling lenses. The coupler is fixed to the second surface. Each of the optical-electrical signal converters and the optical signal generators is aligned with a corresponding coupling lens through the corresponding through hole.

Abstract: A circuit board assembly includes a substrate, a first optical connector, a second optical connector, and at least two planar light wave circuits. The first optical connector includes a first circuit board electrically connected to the substrate, at least one first laser diode, at least one first photodiode, and a first transparent shell. The second optical connector includes a second circuit board connected to the substrate, at least one second laser diode, at least one second photodiode, and a second transparent shell. The planar light wave circuits are arranged between the first and second transparent shells. Each first laser diode is optically coupled with a second photodiode through a first transparent shell, a planar light wave circuit, and a second transparent shell. Each second laser diode is optically coupled with a first photodiode through a second transparent shell, a planar light wave circuit, and a first transparent shell.

Abstract: A miniature projection device includes a rotatable bracket assembly, a rotating plate, a driving device, and a light source unit. The rotating plate is rotatably mounted to the rotatable bracket assembly. The driving device is configured to drive the rotatable bracket assembly to rotate in a first direction, and to drive the rotatable plate to rotate in a second direction. The first direction is substantially perpendicular to the second direction. The light source unit is mounted on the rotatable plate and is capable of rotating together with the rotating plate. The light source unit is configured to emit laser beams and to project the laser beams onto a screen.