Abstract: A chip assembly includes a PCB, a connecting pad fixed on the PCB, and a chip. The connecting pad defines a through hole. The chip is received in the through hole and fixed on the PCB by an adhesive distributed in the through hole. A thickness of the adhesive is less than that of the connecting pad.

Abstract: A circuit board assembly includes a circuit board, at least one pad formed on the circuit board, and at least one connection line. Each of the at least one connection line includes a connection end connected to a respective one of the at least one pad and has the same resistance value as the respective pad.

Abstract: An LED module includes a circuit board with circuit arranged thereon and an LED package mounted on the circuit board via flip-chip mounting. The LED package includes a substrate, a pin structure and a reflector arranged on the substrate, an LED chip disposed on the pin structure and an encapsulation layer covering the LED chip and received in the reflector. A top surface of the encapsulation layer adjacent to the circuit board acts as a light outputting surface. The pin structure extends from the substrate to a top surface of the reflector near the light outputting surface. The pin structure electrically connects the circuit board by conductive adhesive arranged therebetween. The light outputting surface faces a through hole defined in the circuit board. Light emitted from the LED chip travels through the light outputting surface and the through hole in sequence to illuminate.

Abstract: Optical connector includes a circuit board, a photoelectric element, a driver chip, a coupler, and a holder. The circuit board includes a substrate including a first surface and a second surface opposite to the first surface and a circuit portion formed on the substrate. The substrate defines a receiving groove in the second surface and a through hole passing through a bottom surface of the receiving groove and the first surface. The photoelectric element and the driver chip are positioned on the bottom surface of the receiving groove, and the photoelectric element is aligned with the through hole. The coupler is positioned on the first surface of the substrate and is aligned with the photoelectric element through the through hole. The holder holds an optical fiber. The holder is supported on the first surface and connected to the coupler. The coupler optically couples the optical fiber with the photoelectric element.

Abstract: A circuit board includes a first circuit substrate configured for mounting a driving chip and a second circuit substrate positioned on and electrical connected to the first circuit substrate. The second circuit substrate comprises two first top pads, and each of the first top pads can be configured for mounting a light emitter. The second circuit substrate is arranged on the first circuit substrate and can be employed to mount the light emitters, which can improve the precision in the process of mounting the light emitters.

Abstract: A laser projection device includes a substrate, three laser diodes mounted on the substrate, and a spectroscope located on light paths of the laser diodes. The laser diodes are arranged along an arc-shaped curve. A sector-shaped region is defined by the three laser diodes and two intersected sides of the substrate. The spectroscope is located at the sector-shaped region. Light emitted from the laser diodes is adjusted by the spectroscope to transmit along a common direction and be mixed with each other.

Abstract: A circuit board includes a dielectric layer and a signal routing layer on the dielectric layer. The signal routing layer includes chip traces, connector traces, and signal traces connected with the chip traces and the connector traces. The dielectric layer includes a signal trace area for arraying the signal traces, a chip trace area for arraying the chip traces, and a connector trace area for arraying the connector traces. The dielectric coefficient of the signal trace area is smaller than the dielectric coefficient of the chip trace area and greater than the dielectric coefficient of the connector trace area.

Abstract: A chip assembly includes a PCB and a chip positioned on the PCB. The PCB includes a number of first bonding pads. Each bonding pad includes two soldering balls formed thereon. The chip includes a number of second bonding pads, and each second bonding pad corresponds to a respective first bonding pad. The two soldering balls of each first bonding pad are electrically connected to a corresponding second bonding pad via two bonding wires, and the bonding wires are bonded to the second corresponding bonding pad by a wedge bonding manner.

Abstract: An optical-electrical module includes a base board, a laser diode, an integrated circuit, and a lens unit. The laser diode and the integrated circuit are both fixed on the base board. The lens unit and the base board cooperatively define a receiving space to receive the laser diode and the integrated circuit. The laser diode has a transmitting window at an end of the laser diode away from the base board. The integrated circuit drives the laser diode to transmit optical signals. The lens unit has an inner surface facing the base board, and the inner surface of the lens unit has a light transmitting area. The lens unit includes a metal film formed on the inner surface of the lens unit except on the light transmitting area.

Abstract: A circuit board includes a dielectric layer and a signal routing layer on the dielectric layer. The signal routing layer includes connector traces, chip traces, and signal traces connecting the two. A width of the signal traces is greater than a width of the chip traces, which is less than a width of the connector traces. The dielectric layer includes trace areas of different depths for each type of trace to achieve a uniform impedance throughout all traces.

Abstract: An optical communication module includes a substrate, an optical signal receiving unit, an optical signal emitting unit and a coupler. The substrate includes a first surface and a second surface. The substrate defines through holes passing through the first and second surfaces. The optical signal receiving unit includes optical-electrical signal converters. The optical signal emitting unit includes optical signal generators. Each of the optical-electrical signal converters and the optical signal generators is mounted on the first surface and aligned with a corresponding one of the through holes. The coupler includes coupling lenses. The coupler is fixed to the second surface. Each of the optical-electrical signal converters and the optical signal generators is aligned with a corresponding coupling lens through the corresponding through hole.

Abstract: An optical fiber coupling assembly includes a first optical fiber connector, a second optical fiber connector, and a cable. The first optical fiber connector defines a number of first blind holes receiving first focus lenses, and first through holes respectively communicating with the first blind holes. The second optical fiber connector defines a number of second blind holes receiving second focus lenses, and second through holes respectively communicating with the second blind holes. The cable includes a number of optical fibers. Each optical fiber includes a first end and a second end, and the first end is received in a corresponding one of the first through holes and aligned with the a corresponding one of the first focus lenses, and the second end is received in a corresponding one of the second through holes and aligned with a corresponding one of the second focus lenses.

Abstract: An optical fiber connector is positioned on a printed circuit board (PCB) and includes a main body, a number of slots, and a number of optical fibers. The main body includes a number of light transceivers. Each of the light transceivers includes a light transmitting module and a light receiving module adjacent to the light transmitting module. One end of each of the optical fibers is optically coupled to a respective one of the light emitting modules and the light receiving modules, and the other end of each of the optical fibers is mounted on a respective one of the slots.

Abstract: A photoelectric coupling module includes a substrate, a photoelectric unit, and a lens module. The substrate carries at least two alignment marks for correct and absolute positioning of the lens module on the substrate. The photoelectric unit is positioned on the substrate. The lens module defines at least two through holes aligned with the alignment marks.

Abstract: A photoelectric coupling module includes a substrate, a photoelectric unit, and a lens module. The substrate defines a positioning recess. The photoelectric unit is positioned on the substrate. The lens module includes a reflection surface, a plurality of first lenses, and a plurality of second lens. Optical axes of the first lenses cross optical axes of the second lenses on the reflection surface. The lens module further includes a positioning portion extending downward from a bottom surface, and the positioning portion is received in the positioning recess. The first lenses are aligned with the photoelectric unit.

Abstract: An optical connector includes a substrate, a photoelectric element, and a base. The substrate includes a bearing surface. The photoelectric element includes a base, at least one light emitter, and at least one light receiver. The base is positioned on the bearing surface and includes an installing surface substantially perpendicular to the bearing surface. The light emitters and the light receivers are positioned on the installing surface. The optical element includes at least two first lenses and at least two second lenses aligned with the first lenses. The light emitters and the light receivers are aligned with the first lenses.

Abstract: An optical connector includes a printed circuit board, a photoelectric element, a lens element, and an adhesive. The photoelectric element is positioned on and electrically connected to the printed circuit board. The positioning element is an enclosing wall extending from the printed circuit board and enclosing the photoelectric element. The lens element includes a bottom surface, an internal lens formed on the bottom surface, and a supporting leg, which is an enclosing wall extending from a periphery of the bottom surface. The supporting leg is positioned on the printed circuit boar and fittingly engaged with the positioning element. The adhesive is applied between the supporting leg and the printed circuit board.

Abstract: A double-sided PCB includes a circuit plate, a first chip, and a second chip. The circuit plate includes a spacer layer having a first surface and an opposing second surface, a first multilayer structure, and a second multilayer structure. The first multilayer structure includes a first wire layer, a first middle layer, and a second wire layer having a first grounding portion and first conductive pattern portions, that are stacked on each other on the first surface. The second multilayer structure on the second surface is either a mirror image of the first multilayer structure, or is very similar thereto. The first and second chips are each arranged on a grounding portion and are each electrically connected to their respective conductive pattern portions.

Abstract: A circuit board comprises a signal routing layer, a first dielectric layer, a second dielectric layer, a third dielectric layer, a first ground layer, a second ground layer, and a third ground layer. The signal routing layer includes chip traces, connector traces, and signal traces connected to components. The first dielectric layer, the first ground layer, the second dielectric layer, the second ground layer, the third dielectric layer, and the third ground layer, in that order, are located at gradually increasing distances from the signal routing layer. The first ground layer corresponds to the chip traces, the second ground layer corresponds to the signal traces, and the third ground layer corresponds to the connector traces.

Abstract: A circuit board assembly includes a printed circuit board (PCB), at least two laser diodes, a number of first bonding wires, at least two photo diodes and a number of second bonding wires. The PCB includes a mounting surface, a first connecting pad, and a second connecting pad, both the first connecting pad and the second connecting pad are positioned on the mounting surface. The at least two laser diodes and the driving chip mounted on the first connecting pad. The first bonding wires each electrically connects the laser diodes to the driving chip. The photo diodes and the transimpedance amplifier mounted on the second connecting pad. The second bonding wires each electrically connects the photo diodes to the transimpedance amplifier.