Abstract: An exemplary laser projection device includes a substrate, three laser chips mounted on the substrate, and a spectroscope arranged on laser beams paths of the laser chips. Each laser chip is a laser diode. The spectroscope includes a first group of splitters, and a second group of splitters spaced from the first group of splitters. Laser beams emitted from the laser chips are adjusted into the second group of splitters by the first group of splitters. And then, the laser beams adjusted into the second group of splitters are adjusted to be oriented toward the same direction and mixed together to obtain light of a predetermined color.

Abstract: A laser projection device includes three laser chips, a spectroscope arranged on light paths of laser beams emitted from the three laser chips, and a lens mounted between the laser chips and the spectroscope. The lens includes a main body and a bending part bent from the main body. The main body is on the light paths of two of the laser chips. The bending part is on the light path of another laser chip. The laser beams emitted from the corresponding two laser chips are refracted by the main part of the lens. The laser beams emitted from the corresponding another laser chip are refracted by the bending part. The laser beams emitted from the laser chips are converged by the lens to reach the spectroscope and then reflected by the spectroscope to be mixed together.

Abstract: A laser projection device includes a blue laser chip, a red laser chip and a green laser chip and a spectroscope arranged on light paths of laser beams emitted from the laser chips. The laser projection device further includes a substrate. The laser chips are mounted on the substrate. The laser beams emitted from the laser chips are converged by a lens to reach the spectroscope and then reflected by the spectroscope to mix together.

Abstract: An optical adapter includes a loading plate and a coupling lens. The coupling lens includes a main body, a first optical reflector, and a second optical reflector. The first optical reflector is positioned on the loading plate. The main body includes a top plate made of transparent material and spaced a predetermined distance from the loading plate. The second optical reflector is positioned on the first top plate. The first loading plate loads a portion of a planar optical waveguide of an optical printed circuit board. An optical signal from the planar optical waveguide is reflected by the first optical reflector to the second optical reflector, then is reflected by the second optical reflector to the outside of the optical adapter.

Abstract: An optical communication module includes a lens unit and an optical-electrical converter. The optical-electrical converter includes a circuit board and the lens unit is fixed on the circuit board. The lens unit has an extension portion, and the extension portion extends outwards from the lens unit and is parallel to the circuit board. Glue is located between the extension portion and the circuit board to secure the lens unit on the circuit board.

Abstract: A high-frequency transmission module includes a first chip, a second chip, and a conductive wire. The first chip includes a first top surface and a number of pads arranged along a periphery of the first top surface. The pads include a first bonding pad. The second chip includes a second top surface and a second bonding pad on the second top surface. The second chip is positioned on the first top surface such that the pads are uncovered by the second chip and the second bonding pad is mostly closed to the first bonding pad. The conductive wire bonds to the first bonding pad and the second bonding pad to electrically connect the second chip to the first chip and is configured to transmit high-frequency signals between the first chip and the second chip.

Abstract: A chip package includes a PCB, a connecting pad fixed on a surface of the PCB and a chip fixed on the connecting pad. The connecting pad includes a first metal film on its surface facing away from the PCB. The chip includes a second metal film formed on its surface opposite to the PCB. The first and the second metal are connected to each other via a eutectic manner.

Abstract: A circuit board includes a dielectric layer and a signal routing layer on the dielectric layer. The signal routing layer includes chip traces, connector traces, and signal traces connected with the chip traces and the connector traces. The dielectric layer includes a signal trace area for arraying the signal traces, a chip trace area for arraying the chip traces, and a connector trace area for arraying the connector traces. The dielectric coefficient of the signal trace area is smaller than the dielectric coefficient of the chip trace area and greater than the dielectric coefficient of the connector trace area.

Abstract: A circuit board includes a mounting surface and a number of connecting pads on the mounting surface. Each of the connecting pads defines a mounting area for mounting an element thereon. At least two of the connecting pads are substantially circular-shaped.

Abstract: A light source includes a base, a first bonding layer, at least two laser diodes, a second bonding layer, a substrate, and a planer waveguide. The laser diodes are fixed to and are electrically connected to the base using the first bonding layer, and each of the laser diodes includes a side surface for emitting light. The substrate is fixed to the base using the second bonding layer. The waveguide is formed on the substrate and includes an output section including an output end and at least two input branches branching off from an end of the output section opposite to the output end. Each of the input branches includes an input end opposite to the output section and aligning with a respective one of the side surfaces of the at least two laser diodes.

Abstract: A circuit board assembly includes a first circuit board, and a second circuit board, a first optical transceiver, a number of first light wave guides, a second optical transceiver, and a number of second light wave guides. The first circuit board defines a number of first through holes. The second circuit board defines a number of second and third through holes. Each of the third through holes is aligned with a respective first though hole. The first optical transceiver is optically coupled with the second through holes. The first light wave guides are mounted on one surface of the first circuit board and optically coupled with the second through holes. The second optical transceiver is optically coupled with the third through holes. The second light wave guides are mounted on another surface of the first circuit board and are optically coupled with the first through holes.

Abstract: An optical fiber connector assembly includes a first, and second plug connectors, and a socket connector. The first plug connector includes a first main portion and a first plate with a first front surface defining alignment holes. A first distance is defined between the first front surface and the first main portion. The second plug connector includes a second main portion and a second plate with a second front surface. A second distance is defined between the second front surface and the second main portion. The socket connector includes a side surface defining a recess with a bottom surface. A third distance is defined between the side surface and the bottom surface. Alignment pins extend from the bottom surface. The length of each alignment pin is defined as a fourth distance. The third distance is equal to the first distance and greater than sum of the second and fourth distances.

Abstract: A light source module includes a laser light source, and an optical lens facing the laser light source. The optical lens includes a first light reflecting face, a second light reflecting face facing the first light reflecting face, a light incident face connecting the first light reflecting face and the second light reflecting face, and a light emitting face opposite to the light incident face. Light emitted from the laser light source is firstly reflected to the second reflecting face by the first reflecting face, then reflected to the light incident face by the second reflecting face, and then entered into the optical lens from the light incident face, and transmitted in the optical lens, finally exited from the light emitting face.

Abstract: A light transmission system includes a light guide support, a first convex lens, an optical waveguide member, and two second convex lenses. The light guide support includes a first surface, a second surface, a hollow space formed between the first surface and the second surface, and an inner reflecting surface forming an angle of 45 degrees relative to the first surface. The first convex lens is formed at the first surface, and configured for converging light to the inner reflecting surface. The optical waveguide member is located at the hollow space, and includes a main section parallel with the first surface, two first branch sections extending from and forming equal angles relative to the main section, and two second branch sections extending from the respective first branch sections. The two second convex lenses are formed at the second surface and aligned with the respective second branch sections.

Abstract: A chip package includes a substrate, a pad, a double-sided adhesive tape, a chip, and a sealing member. The pad is arranged on the substrate and has a top surface facing away from the substrate. The double-sided adhesive tape includes a first paste surface and an opposing second paste surface. The first paste surface is attached to the top surface. The chip is attached onto the second paste surface and includes a light emitting surface or a light receiving surface facing away from the second paste surface. The sealing member is formed on the pad and tightly surrounds the chip and the double-sided adhesive.

Abstract: An optical connector includes a substrate, a number of light emitters, a number of light receivers, and a lens module. The light emitters and the light receivers are positioned on the substrate. The lens module is positioned on the substrate, and the light emitters and the light receivers are received in the lens module. The lens module includes a reflection surface, a number of first lenses, and a number of second lenses. Optical axes of the first lenses cross optical axes of the second lenses on the reflection surface. The first lenses are aligned with the light emitters and the light receivers.

Abstract: An optical fiber connector adapter for coupling a first optical fiber connector to a second optical fiber connector includes a lens body. The lens body includes a first surface and an opposite second surface. A positioning hole is defined in the first surface. A lens hole is defined in the first surface and a first lens is formed on a bottom in the lens hole. The first lens is beneath the first surface and adjacent to the positioning hole. A positioning post and a second lens protrude from the second surface. The second lens is aligned with the first lens. An optical fiber connector assembly having the optical fiber connector adapter is also provided.

Abstract: An optical PCB includes a substrate, conductive traces, a solder resist layer, and a light waveguide. The substrate includes a surface. The surface includes a flat area. The conductive traces are formed on the surface of the substrate and only positioned outside of the flat area. The solder resist layer is formed on the substrate and covers the conductive traces. The light waveguide is positioned on the solder resist layer. An orthogonal projection of the light waveguide on the surface of the substrate coincides with the flat area.

Abstract: An optical-electrical converting device includes a substrate, an electrical circuit layer, at least one auxiliary pad, and an optical-electrical converting lens. The electrical circuit layer includes at least one circuit portion. The optical-electrical lens includes at least one first supporting portion and at least one second supporting portion. Each of the at least one first supporting portion is positioned on a respective one of the at least one first circuit portion, and each of the at least one second supporting portion is positioned on a respective one of the at least one auxiliary pad. The electrical circuit layer and the at least one auxiliary pad are arranged on the substrate. The thickness of the at least one first circuit portion layer is substantially equal to the thickness of the at least one auxiliary pad.

Abstract: A light transmission system includes a light guide support, a first convex lens, an optical waveguide member, and two second convex lenses. The light guide support includes a first surface, a second surface, a hollow space formed between the first surface and the second surface, and an inner reflecting surface forming an angle of 45 degrees relative to the first surface. The first convex lens is formed at the first surface, and configured for converging light to the inner reflecting surface. The optical waveguide member is located at the hollow space, and includes a main section parallel with the first surface, two first branch sections extending from and forming equal angles relative to the main section, and two second branch sections extending from the respective first branch sections. The two second convex lenses are formed at the second surface and aligned with the respective second branch sections.