Abstract: In one embodiment of the invention, source and drain regions are formed as well as source and drain contact regions. Thereafter source and drain extension regions are formed. In another embodiment, elevated source and drain regions are formed as well as source and drain extension regions. Thereafter source and drain contact regions are formed at a temperature up to about 600° C. and an annealing time of up to about one minute.

Abstract: The invention relates to a magnetic recording head comprising: a bottom shield; a top shield; and AMR device with MR and SAL separated by a thin insulating layer; a first insulting gap layer between said bottom shield and said AMR; a second insulating gap layer between said AMR and said top shield; a conductive layer contact at one end region of said MR and SAL. Furthermore, magnetic recording heads with GMR device free of electric-pop noise also are disclosed.

Abstract: In one embodiment of the invention, source and drain regions are formed as well as source and drain contact regions. Thereafter source and drain extension regions are formed. In another embodiment, elevated source and drain regions are formed as well as source and drain extension regions. Thereafter source and drain contact regions are formed at a temperature up to about 600° C. and an annealing time of up to about one minute.

Abstract: A method and circuit are provided for color space conversion of Y (luminance) and UV (chrominance) components from a planar YUV 4:2:0 format to an interleaved, or packed YUV 4:2:2 format, and from an interleaved, or packed YUV 4:2:2 format to a planar YUV 4:2:0 format. The method for both conversions includes reading source data, interpolating the sampled YUV component values, and performing a pass to thereby write the converted YUV component values in three passes, one pass for all values of the respective YUV components.

Abstract: A process for making abrupt, e.g. <20 nm/decade, PN junctions and haloes in, e.g., CMOSFETs having gate lengths of, e.g. <50 nm, uses a mask, e.g., sidewall spacers, during ion implantation of gate, source, and drain regions. The mask is removed after source-drain activation by annealing and source and drain extension regions are then implanted. Then the extension regions are activated. Thereafter halo regions are implanted and activated preferably using spike annealing to prevent their diffusion. The process can also be used to make diodes, bipolar transistors, etc. The activation annealing steps can be combined into a single step near the end of the process.

Abstract: A machine readable storage media containing executable program instructions which when executed cause a digital processing system to seta plurality of operands and operators. A plurality of texture maps are sent to a processor for texture compositing. Operands are selected for a texture operation. A first logic is used wherein if the circulation of blend stages is equal to a number of blend stages, then a color saturation is performed, and a second logic that if the circulation number of blend stages does not equal the number of blend stages then at least one operand is selected for another texture compositing operation.

Abstract: A complementary metal oxide semiconductor (CMOS) device having silicide contacts that are self-aligned to deep junction edges formed within a surface of a semiconductor substrate as well as a method of manufacturing the same are disclosed. Specifically, the CMOS device includes a plurality of patterned gate stack regions formed on a surface of a semiconductor substrate. Each plurality of patterned gate stack regions includes an L-shaped nitride spacer formed on exposed vertical sidewalls thereof, the L-shaped nitride spacer having a vertical element and a horizontal element, wherein the horizontal element is formed on a portion of the substrate that abuts each patterned gate stack region. Silicide contacts are located on other portions of the semiconductor substrate between adjacent patterned gate stack regions not containing the horizontal element of the L-shaped nitride spacer.

Abstract: A method and circuit are provided for color space conversion of Y (luminance) and UV (chrominance) components from a planar YUV 4:2:0 format to an interleaved, or packed YUV 4:2:2 format, and from an interleaved, or packed YUV 4:2:2 format to a planar YUV 4:2:0 format. The method for both conversions includes reading source data, interpolating the sampled YUV component values, and performing a pass to thereby write the converted YUV component values in three passes, one pass for all values of the respective YUV components.

Abstract: In one embodiment of the invention, source and drain regions are formed as well as source and drain contact regions. Thereafter source and drain extension regions are formed. In another embodiment, elevated source and drain regions are formed as well as source and drain extension regions. Thereafter source and drain contact regions are formed at a temperature up to about 600° C. and an annealing time of up to about one minute.

Abstract: A complementary metal oxide semiconductor (CMOS) device having silicide contacts that are self-aligned to deep junction edges formed within a surface of a semiconductor substrate as well as a method of manufacturing the same are disclosed. Specifically, the CMOS device includes a plurality of patterned gate stack regions formed on a surface of a semiconductor substrate. Each plurality of patterned gate stack regions includes an L-shaped nitride spacer formed on exposed vertical sidewalls thereof, the L-shaped nitride spacer having a vertical element and a horizontal element, wherein the horizontal element is formed on a portion of the substrate that abuts each patterned gate stack region. Silicide contacts are located on other portions of the semiconductor substrate between adjacent patterned gate stack regions not containing the horizontal element of the L-shaped nitride spacer.

Abstract: A complementary metal oxide semiconductor (CMOS) device having silicide contacts that are self-aligned to deep junction edges formed within a surface of a semiconductor substrate as well as a method of manufacturing the same are disclosed. Specifically, the CMOS device includes a plurality of patterned gate stack regions formed on a surface of a semiconductor substrate. Each plurality of patterned gate stack regions includes an L-shaped nitride spacer formed on exposed vertical sidewalls thereof, the L-shaped nitride spacer having a vertical element and a horizontal element, wherein the horizontal element is formed on a portion of the substrate that abuts each patterned gate stack region. Silicide contacts are located on other portions of the semiconductor substrate between adjacent patterned gate stack regions not containing the horizontal element of the L-shaped nitride spacer.

Abstract: A method and system for processing data arriving from a bit-stream to perform numerical computations in a temporal order independent fashion. According to one embodiment, the method is applied to IDCT computations to allow processing of IDCT coefficients in the same order they are received from an MPEG bit stream. The coefficients are not required to be converted from scan order to array order before processing. This provides significant advantages in that it imposes minimal storage requirements for the coefficients and the coefficients are processed in scan order.

Abstract: The invention relates to a magnetoresistive device comprising: a bottom shield; a top shield; an AMR/GMR device; a first insulating gap layer between said bottom shield and said AMR/GMR; a second insulating gap layer between said AMR/GMR and said top shield; and conductive layer contacting electrically both said AMR.GMR device to siaid bottom shield. Furthermore, similar active devices free of electric-pop noise also be disclosed.

Abstract: The present invention provides an algorithm and hardware structure for numerical operations on signals that is reconfigurable to operate in a downsampling or non-downsampling mode. According to one embodiment, a plurality of adders and multipliers are reconfigurable via a switching fabric to operate as a plurality of MAAC kernels (described in detail below), when operating in a non-downsampling mode and a plurality of MAAC kernels and AMAAC kernels (described in detail below), when operating in a downsampling mode.

Abstract: The invention relates to a magnetoresistive device comprising: a bottom shield; a top shield; an AMR/GMR device; a first insulating gap layer between said bottom shield and said AMR/GMR; a second insulating gap layer between said AMR/GMR and said top shield; and conductive layer contacting electrically both said AMR/GMR device to said bottom shield. Furthermore, similar active devices free of electric-pop noise also be disclosed.

Abstract: In particular, the present invention relates to a method and system for improving the efficiency of computational processes and specifically multiply and accumulate (“MAC”) processes such as the DCT (“Discrete Cosine Transform”) and/or IDCT (“Inverse Discrete Cosine Transform”) using a performance optimized method and associated hardware apparatus.

Abstract: A method for fabricating an ultra-shallow semiconductor junction using a high energy co-implantation step; a low energy dopant implantation step, and a fast isothermal annealing step is provided. Microelectronics devices such as FET and CMOS devices containing said ultra-shallow semiconductor junction is also provided herein.

Abstract: A process for making abrupt, e.g. <20 nm/decade, PN junctions and haloes in, e.g., CMOSFETs having gate lengths of, e.g. <50 nm, uses a mask, e.g., sidewall spacers, during ion implantation of gate, source, and drain regions. The mask is removed after source-drain activation by annealing and source and drain extension regions are then implanted. Then the extension regions are activated. Thereafter halo regions are implanted and activated preferably using spike annealing to prevent their diffusion. The process can also be used to make diodes, bipolar transistors, etc. The activation annealing steps can be combined into a single step near the end of the process.

Abstract: A complementary metal oxide semiconductor (CMOS) device having silicide contacts that are self-aligned to deep junction edges formed within a surface of a semiconductor substrate as well as a method of manufacturing the same are disclosed. Specifically, the CMOS device includes a plurality of patterned gate stack regions formed on a surface of a semiconductor substrate. Each plurality of patterned gate stack regions includes an L-shaped nitride spacer formed on exposed vertical sidewalls thereof, the L-shaped nitride spacer having a vertical element and a horizontal element, wherein the horizontal element is formed on a portion of the substrate that abuts each patterned gate stack region. Silicide contacts are located on other portions of the semiconductor substrate between adjacent patterned gate stack regions not containing the horizontal element of the L-shaped nitride spacer.

Abstract: A process for making abrupt, e.g. <20 nm/decade, PN junctions and haloes in, e.g., CMOSFETs having gate lengths of, e.g. <50 nm, uses a mask, e.g., sidewall spacers, during ion implantation of gate, source, and drain regions. The mask is removed after source-drain activation by annealing and source and drain extension regions are then implanted. Then the extension regions are activated. Thereafter halo regions are implanted and activated preferably using spike annealing to prevent their diffusion. The process can also be used to make diodes, bipolar transistors, etc. The activation annealing steps can be combined into a single step near the end of the process.