Patents by Inventor Kang An

Kang An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240177464
    Abstract: An active learning device and an active learning method are provided. The active learning device includes an input device configured to receive an input image, and a controller configured to extract a first feature from the input image, extract a second feature from a segmentation image corresponding to the input image, and extract a third feature from a depth image corresponding to the input image. The active learning device is also configured to determine the input image as a training image based on cosine distances among the first feature, the second feature and the third feature, and labels the training image.
    Type: Application
    Filed: May 1, 2023
    Publication date: May 30, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Jung Gee Kim, Geon Kang, Yu Jin Yun, Jin Sol Kim
  • Publication number: 20240176423
    Abstract: A display apparatus is provided, and the display apparatus includes a display member having a plurality of pixels configured to display an image, and a vibration apparatus configured to vibrate the display member based on a haptic driving signal. The haptic driving signal includes a texture signal and an ultrasonic signal. Accordingly, the display apparatus can provide a user with a tactile feedback including a virtual texture.
    Type: Application
    Filed: October 19, 2023
    Publication date: May 30, 2024
    Applicant: LG Display Co., Ltd.
    Inventors: Saewon KANG, SeungRyull PARK, YuSeon KHO
  • Publication number: 20240177367
    Abstract: According to an embodiment, a processor of a wearable device may identify a first visual object among a plurality of visual objects in a first image frame displayed through the display. The processor may identify, based on identifying the first visual object, a second visual object associated with the first visual object. The processor may obtain, after the second visual object is identified, a second image frame via the camera. The processor may modify at least a portion of the second image frame in which at least one of other visual objects of the plurality of visual objects different from the first visual object and the second visual object is removed. The processor may display, via the display, the second image frame including the modified portion.
    Type: Application
    Filed: December 15, 2023
    Publication date: May 30, 2024
    Inventors: Yoonjung CHOI, Jiyoung KANG, Chaekyung LEE, Seungyong LEE
  • Publication number: 20240176410
    Abstract: An operating method of the display device includes detecting, through at least one sensor, at least one sensing value corresponding to the at least one sensor, identifying a touch area on the display device that is touched by a mobile device, based on the at least one sensing value, receiving status information about an operation that is being executed by the mobile device, from the mobile device, and performing a function corresponding to the identified touch area, based on the received status information.
    Type: Application
    Filed: February 8, 2024
    Publication date: May 30, 2024
    Applicant: SAMSUNG ELECTRONICS CO. LTD.
    Inventors: Suhwan JIN, Kunsok KANG, Daeyeon YUN, Seungil YOON, Eungsik YOON, Taedon HWANG
  • Publication number: 20240177982
    Abstract: An uncertainty weighted average of the equalized amounts of two or more quantifier ions is calculated from a quantitation experiment itself. n known i ions of a compound are mass analyzed over time in each of m different samples, producing n XIC peaks for each of the m samples. A reference ion j is selected that is a j ion of the n i ions or a hypothetical ion j. A ratio r(j,i) of a peak area of the j ion to a peak area of each ion of the n i ions is calculated for each of the m samples, producing m r(j,i) ratios for each of the n i ions. An expected ratio rq(j,i) is calculated for each ion of the n i ions from the m r(j,i) ratios for each of the n i ions. For each sample, the uncertainty weighted average is calculated using rq(j,i).
    Type: Application
    Filed: March 14, 2022
    Publication date: May 30, 2024
    Inventors: Gordana Ivosev, Stephen A. Tate, Yang Kang, Nic G. Bloomfield
  • Publication number: 20240176759
    Abstract: Disclosed herein are a method for machine-learning parallelization using host CPUs of a multi-socket structure and an apparatus therefor. The method, performed by the apparatus for machine-learning parallelization using host CPUs of a multi-socket structure, includes a compile phase in which a learning model is split at a layer level for respective pipeline stages and allocated to Non-Uniform Memory Access (NUMA) nodes for respective CPU sockets and a runtime phase in which parameters required for learning are initialized and multiple threads generated in consideration of a policy of each parallelism algorithm are executed by being allocated to respective cores included in the NUMA node.
    Type: Application
    Filed: November 28, 2023
    Publication date: May 30, 2024
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Baik-Song AN, Ki-Dong KANG, Hong-Yeon KIM, Myung-Hoon CHA
  • Publication number: 20240177921
    Abstract: A coil component includes a body, a support member disposed within the body, a first coil disposed on one surface of the support member, a second coil disposed on the other surface of the support member, a first pad connected to one end of the first coil, a second pad connected to one end of the second coil, a plurality of conductive vias connecting the first pad and the second pad, a first external electrode disposed on the body and connected to the other end of the first coil, and a second external electrode disposed on the body and connected to the other end of the second coil.
    Type: Application
    Filed: November 20, 2023
    Publication date: May 30, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Woo Jin Lee, Dong Hwan Lee, In Young Kang, Boum Seock Kim
  • Publication number: 20240176756
    Abstract: Disclosed herein is a method for distributed training of an AI model in a channel-sharing network environment. The method includes determining whether data parallel processing is applied, calculating a computation time and a communication time when input data is evenly distributed across multiple computation devices, and unevenly distributing the input data across the multiple computation devices based on the computation time and the communication time.
    Type: Application
    Filed: June 30, 2023
    Publication date: May 30, 2024
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Ki-Dong KANG, Hong-Yeon KIM, Baik-Song AN, Myung-Hoon CHA
  • Publication number: 20240177928
    Abstract: A multilayer electronic component includes: a body including dielectric layers and having first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; side margin portions disposed on the fifth and sixth surfaces, respectively; and external electrodes disposed on the third and fourth surfaces, respectively. The body includes an active portion including internal electrodes disposed alternately with the dielectric layers in the first direction, one of the internal electrodes includes a central portion and an interface portion disposed between the central portion and one of the dielectric layers, and the interface portion and one of the side margin portions include Sn.
    Type: Application
    Filed: February 7, 2024
    Publication date: May 30, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Jun Jung, Yun Kim, Hyun Kim, Sim Chung Kang, Eun Jung Lee
  • Publication number: 20240177971
    Abstract: Provided is a matching network module including a plurality of housings individualized to reduce cross radio frequency (RF) interference, a plurality of matching networks respectively mounted in the plurality of housings to separately perform impedance matching between a plurality of RF generators and a plasma chamber, and a common output rod connecting output terminals of the plurality of matching networks to each other.
    Type: Application
    Filed: November 13, 2023
    Publication date: May 30, 2024
    Inventors: Sung Suk WI, Yoon Seok CHOI, Hanlim KANG
  • Publication number: 20240178120
    Abstract: An integrated fan-out package includes a first redistribution structure, a die, conductive structures, an encapsulant, and a second redistribution structure. The first redistribution structure has first regions and a second region surrounding the first regions. A metal density in the first regions is smaller than a metal density in the second region. The die is disposed over the first redistribution structure. The conductive structures are disposed on the first redistribution structure to surround the die. Vertical projections of the conductive structures onto the first redistribution structure fall within the first regions of the first redistribution structure. The encapsulant encapsulates the die and the conductive structures. The second redistribution structure is disposed on the encapsulant, the die, and the conductive structures.
    Type: Application
    Filed: February 8, 2023
    Publication date: May 30, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Ming Weng, Tzu-Sung Huang, Wei-Kang Hsieh, Hao-Yi Tsai, Ming-Hung Tseng, Tsung-Hsien Chiang, Yen-Liang Lin, Chu-Chun Chueh
  • Publication number: 20240176809
    Abstract: The present disclosure relates to an annotation data determination method and apparatus, and a readable medium and an electronic device. By means of the present disclosure, high-quality data to be annotated is obtained for model performance evaluation.
    Type: Application
    Filed: March 17, 2022
    Publication date: May 30, 2024
    Inventors: Ling CHANG, Heng KANG, Xin LIAO, Ke SHEN, Leizhen SUN, Tengfei BAO
  • Publication number: 20240178475
    Abstract: A battery module includes at least one cell group, and a heat dissipating member coupled to one side of the at least one cell group to externally dissipate heat generated in the at least one cell group, wherein the at least one cell group includes at least one battery cell stack, a flame retardant cover coupled to the battery cell stack to encase both side surfaces and an upper portion of the battery cell stack, and a flame retardant member disposed between an upper surface of the battery cell stack and the flame retardant cover and formed of a porous material.
    Type: Application
    Filed: February 7, 2024
    Publication date: May 30, 2024
    Inventors: Hae Ryong JEON, Ho Yeon KIM, Kang Gu LEE, Seo Roh RHEE
  • Publication number: 20240179462
    Abstract: Various implementations include audio devices configured to mitigate electrostatic discharge (ESD) events, or strikes. In certain implementations, an audio device includes: a microphone mounted on a first side of a printed wiring board (PWB); and an electrostatic discharge (ESD) protection element coupled to a second side of the PWB directly opposite the microphone, wherein the ESD protection element is positioned to divert an ESD strike away from the microphone.
    Type: Application
    Filed: April 1, 2022
    Publication date: May 30, 2024
    Inventors: Donna Marie SULLIVAN, Thomas Aquinas NILSEN, James Joung-Mo KANG, Scott C. PERZANOSKI, Mark MCCAULEY, Richmond Andrew REAL
  • Publication number: 20240178188
    Abstract: Semiconductor packages and methods of fabricating the same are provided. The semiconductor package includes a first package substrate including a first area, a first semiconductor chip mounted on the first area, a second package substrate disposed on an upper surface of the first semiconductor chip and including a second area and a first hole penetrating through the second area, a second semiconductor chip mounted on the second area, a connection member electrically connecting the first package substrate and the second package substrate and between the first package substrate and the second package substrate, and a mold film covering the second semiconductor chip on the second package substrate, filling the first hole, and covering the first semiconductor chip and the connection member on the first package substrate.
    Type: Application
    Filed: August 1, 2023
    Publication date: May 30, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Myung-Sung KANG, Kyong Hwan KOH, Jin-Woo PARK, Chung Sun LEE, Hyeon Jun JIN
  • Publication number: 20240177142
    Abstract: The present disclosure relates to a mobile gift certificate transaction method applying NFT technology. The method includes NFT-tokenizing a gift certificate code stored in a gift certificate storage unit; receiving a buying signal of a gift certificate from a gift certificate buyer terminal; updating an NFT-tokenized gift certificate code corresponding to the received buying signal; transmitting an access address of the NFT-tokenized gift certificate code corresponding to the received buying signal to a gift certificate receiving terminal; receiving a closure request to close the access address of the gift certificate code from the gift certificate receiving terminal when the gift certificate receiving terminal rejects receiving the gift certificate; and restoring the updated NFT-tokenized gift certificate code, in response to receiving the closure request.
    Type: Application
    Filed: November 30, 2022
    Publication date: May 30, 2024
    Applicant: TWOUZ Inc.
    Inventors: Hanjik RYU, Woo-Cheol LEE, Myoung-Gyun KANG
  • Publication number: 20240178191
    Abstract: A semiconductor chip including a semiconductor substrate having an active surface and a non-active surface opposite to each other, a plurality of through electrodes passing through the semiconductor substrate, a plurality of wiring structures on the active surface and electrically connected to the plurality of through electrodes, an inter-wire insulating layer surrounding the plurality of wiring structures, a plurality of front chip connection pads electrically connected to the plurality of wiring structures, a front insulating layer surrounding the plurality of front chip connection pads, on the inter-wire insulating layer, a plurality of rear chip connection pads disposed on the non-active surface and electrically connected to the plurality of through electrodes, and a rear insulating layer surrounding the plurality of rear chip connection pads, on the non-active surface, wherein the front insulating layer includes a cover insulating portion covering a side surface of the inter-wire insulating layer may be
    Type: Application
    Filed: September 14, 2023
    Publication date: May 30, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jihun JUNG, Unbyoung KANG, Yeongkwon KO, Seunghun SHIN
  • Publication number: 20240177450
    Abstract: Disclosed is a data processing method including obtaining deviation information indicating a degree of deviation of target data from reference data, and displaying, on the target data, information corresponding to the deviation information, wherein the obtaining of the deviation information includes obtaining the deviation information by comparing data other than data that deteriorates reliability of the deviation information from among the target data with the reference data.
    Type: Application
    Filed: March 21, 2022
    Publication date: May 30, 2024
    Applicant: MEDIT CORP.
    Inventors: Kang Hoon CHUNG, Ho Taik LEE
  • Publication number: 20240177408
    Abstract: An electronic device includes: one or more processors configured to: extract, using an implicit neural representation (INR) model, a global geometry feature and information indicating whether a point is on a surface from a viewpoint and a view direction corresponding to an image pixel corresponding to a two-dimensional (2D) scene at the viewpoint within a field of view (FOV); determine an object surface position corresponding to the viewpoint and the view direction and normal information of the object surface position based on the information indicating whether the point is on the surface; estimate, using an albedo estimation model, albedo information independent of the view direction from the global geometry feature, the object surface position, and the normal information; and estimate, using a specular estimation model, specular information dependent on the view direction from the global geometry feature, the object surface position, the normal information, and the view direction.
    Type: Application
    Filed: June 1, 2023
    Publication date: May 30, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jinwoo PARK, Nahyup KANG, Jiyeon KIM
  • Publication number: 20240177932
    Abstract: A multilayer electronic component includes a body including a capacitance formation portion including dielectric layers and internal electrodes alternately disposed in a first direction, and a cover portion disposed on both end surfaces of the capacitance formation portion, facing each other in the first direction, and having a first surface and a second surface opposing each other in the first direction, a third surface and a fourth surface connected to the first and second surfaces and opposing each other in a second direction, and a fifth surface and a sixth surface connected to the first to fourth surfaces and opposing each other in a third direction, and external electrodes disposed on the third and fourth surfaces. The internal electrodes and the dielectric layers protrude more outwardly than the cover portion in the second direction, and a groove is disposed at an end of the dielectric layer in the second direction.
    Type: Application
    Filed: February 27, 2023
    Publication date: May 30, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sun Hwa KIM, Hoe Chul JUNG, Yun Sung KANG, Byeong Gyu PARK, Won Jun NA