Abstract: A wearable patch system includes an electrocardiogram (ECG) sensor having electrodes configured to contact a subject. An electronic stethoscope has a diaphragm structure responsive to sounds from the subject. The ECG sensor and the electronic stethoscope are co-located to measure respective parameters concurrently from a same position. A housing is configured to support the diaphragm structure and the electrodes. The housing includes a mechanical interface configured to mount on the subject. A communications circuit is disposed on or in the housing to communicate with a remote component.

Abstract: An apparatus includes one or more memories storing computer readable code and processor(s). The processor(s), in response to loading and executing the computer readable code, cause the apparatus to perform operations including receiving electrocardiogram data from an electrocardiogram sensor. The electrocardiogram data includes data from an electrocardiogram from a person. The operations also include receiving pulse wave data from one or more pulse wave pressure sensors. The pulse wave data includes data from one or more pulse waves from the person. The operations further include determining blood pressure using the electrocardiogram data or the pulse wave data from the chest and the pulse wave data from the wrist or finger, and outputting an indication of the blood pressure. Another apparatus uses pulse wave data from two pulse wave sensors (e.g., pulse wave pressure sensor(s) and/or PPG sensor(s)) and blood pressure determinations are made using these pulse wave data.

Abstract: An apparatus includes one or more memories storing computer readable code and processor(s). The processor(s), in response to loading and executing the computer readable code, cause the apparatus to perform operations including receiving electrocardiogram data from an electrocardiogram sensor. The electrocardiogram data includes data from an electrocardiogram from a person. The operations also include receiving pulse wave data from one or more pulse wave pressure sensors. The pulse wave data includes data from one or more pulse waves from the person. The operations further include determining blood pressure using the electrocardiogram data or the pulse wave data from the chest and the pulse wave data from the wrist or finger, and outputting an indication of the blood pressure. Another apparatus uses pulse wave data from two pulse wave sensors (e.g., pulse wave pressure sensor(s) and/or PPG sensor(s)) and blood pressure determinations are made using these pulse wave data.

Abstract: A flux formulation includes an activator and a protic solvent. The activator may be glutaric acid, levulinic acid, 2-ketobutyric acid, 2-oxovaleric acid, or mixtures thereof. Suitable protic solvents include alkanediol, alkoxy propanol and alkoxy ethanol. The flux formulation may be a no-clean flux formulation that may be used in the soldering of electronic circuit board assemblies, for example, in conjunction with a support fixture having a planar back surface that minimizes vibrations during processing that might otherwise cause misalignment between a chip and a substrate prior to solder reflow.

Abstract: An approach to provide an electronic assembly process that includes receiving at least one electronic assembly after a solder reflow process using a Sn-containing solder and a water-soluble flux. The approach includes baking the at least one electronic assembly in an oxygen containing environment and, then cleaning the at least one electronic assembly in an aqueous cleaning process.

Abstract: An approach to provide an electronic assembly process that includes receiving at least one electronic assembly after a solder reflow process using a Sn-containing solder and a water-soluble flux. The approach includes baking the at least one electronic assembly in an oxygen containing environment and, then cleaning the at least one electronic assembly in an aqueous cleaning process.

Abstract: The present invention is directed to flux compositions and uses thereof. One composition comprises an activator and a solvent being a glycerol ethoxylate with a molecular weight of 200-500. Another composition comprises an activator, a solvent being a glycerol ethoxylate with a molecular weight of 200-500 and an amine. A soldering method for joining objects is also provided, comprising the steps of applying a flux composition to at least a portion of one or more of the objects, and joining the objects.

Abstract: The present invention is directed to a soldering method for joining objects is also provided, comprising the steps of applying a flux composition to at least a portion of one or more of the objects, and joining the objects.

Abstract: A stacked semiconductor apparatus and method of fabricating same are disclosed. The apparatus includes upper and lower semiconductor devices having a similar pattern of connection elements. When stacked connected the resulting plurality of semiconductor devices includes a serial connection path traversing the stack, and may also include parallel connection paths, back-side mounted large components, and vertical thermal conduits.

Abstract: An approach to provide an electronic assembly process that includes receiving at least one electronic assembly after a solder reflow process using a Sn-containing solder and a water-soluble flux. The approach includes baking the at least one electronic assembly in an oxygen containing environment and, then cleaning the at least one electronic assembly in an aqueous cleaning process.

Abstract: Provided is a method for forming a silicon film, and more particularly, to a method for forming a polycrystalline silicon film including pretreatment process in a process for forming a silicon film. According to an embodiment of the present invention, a method for forming a polycrystalline silicon film by annealing a amorphous silicon film deposited on a base, the method includes a pretreatment process of allowing a pretreatment gas including at least one of N, C, O and B to flow.

Abstract: To miniaturize metal columns. A semiconductor device includes a metal column (14) that extends in a stretching direction; a polymer layer (16) that surrounds the metal column from a direction crossing the stretching direction; and a guide (12) that surrounds the polymer layer in the crossing direction so as to be spaced from the metal column with the polymer layer interposed therebetween. A method for manufacturing semiconductor devices includes a step of filling a mixture (20) containing metal particles (22) and polymers (24) in a guide (12); and a step of subjecting the mixture to a heat treatment so that the polymers agglomerate to the guide to form a polymer layer (16) that makes contact with the guide and the metal particles agglomerate away from the guide with the polymer layer interposed therebetween to form a metal column (14) that stretches in a stretching direction of the guide from the metal particles.

Abstract: Systems and methods for monitoring body mounted/implanted sensors in combination with environmental sensors and sensors attached to person's medical/sports equipment. Data indicating a plurality of measured quantities associated with movement of a person at a time point is received. Each measured quantity within the plurality of measured quantities having been determined by a respective sensor attached to a respective location on the person or the person's environment or the person's medical/sports equipment. At least one characteristic of the person associated with the time point is determined based on analyzing the plurality of measured quantities. The at least one characteristic is stored. Recommendations for the person are determined based upon the characteristics, and a report comprising the recommendations is provided.

Abstract: There are provided a controller coupled to a semiconductor memory device and an operating method thereof. A controller having improved operation speed includes a command generation unit for generating commands to be performed by a semiconductor memory device, a command queue for storing the commands and providing at least one command among the stored commands to the semiconductor memory device, and a command removal unit for, if the semiconductor memory device fails in the performance of the at least one command output from the main command queue, removing the at least one command and related commands of the at least one command from the command queue.

Abstract: In accordance with the example embodiments of the invention there is at least a method and apparatus to perform receiving, with at least one diaphragm of a device placed on a skin of a living body of a human being or animal, acoustic data of the living body; determining digitized data from the acoustic data of the living body; and sending the digitized data towards an analytics system for a medical diagnosis associated with the living body; determining a relationship between the digitized data and health conditions of the human being or animal; and applying the relationship to a diagnosis of the health conditions of the human being or animal.

Abstract: Provided is a method for forming a silicon film, and more particularly, to a method for forming a polycrystalline silicon film including pretreatment process in a process for forming a silicon film. According to an embodiment of the present invention, a method for forming a polycrystalline silicon film by annealing a amorphous silicon film deposited on a base, the method includes a pretreatment process of allowing a pretreatment gas including at least one of N, C, O and B to flow.

Abstract: A flux formulation includes an activator and a protic solvent. The activator may be glutaric acid, levulinic acid, 2-ketobutyric acid, 2-oxovaleric acid, or mixtures thereof. Suitable protic solvents include alkanediol, alkoxy propanol and alkoxy ethanol. The flux formulation may be a no-clean flux formulation that may be used in the soldering of electronic circuit board assemblies, for example, in conjunction with a support fixture having a planar back surface that minimizes vibrations during processing that might otherwise cause misalignment between a chip and a substrate prior to solder reflow.

Abstract: An apparatus includes a wearable sensor structure that includes multiple individual sensor units placed in a row. Each individual sensor unit includes a first portion to contact a surface of skin under which arteries and/or veins are to be located, and a second portion that contacts the first portion and is configured to have a capacitance. The first and second portions are configured to create a capacitance change in response to a squeezing or bending between the first portion and a fixed part of the second portion caused by a pulse pressure and release of the pulse pressure. The apparatus includes circuitry configured to measure waveforms for the individual sensor units. Each waveform captures the capacitance change for its corresponding individual sensor unit. The apparatus includes a wireless interface configured to transmit the waveforms. A computing system is also disclosed that analyzes the waveforms and can provide alerts based thereon.

Abstract: The present invention is directed to flux compositions. One composition comprises an activator, a medium-viscosity solvent being a polymer, and a high-viscosity solvent being a copolymer containing first monomers and second monomers. Another composition comprises an activator, and a high-viscosity solvent comprising a copolymer containing first monomers and second monomers. Another composition comprises an activator of 6-12 percent by weight of glutaric acid, pimelic acid, tartaric acid, or mixtures thereof, and a medium-viscosity solvent of 88-94 percent by weight comprising a polymer with hydroxyl end groups. Another composition comprises an activator in a liquid state comprising poly(ethylene glycol)-diacid, and a medium-viscosity solvent comprising a polymer with hydroxyl end groups.

Abstract: A method and apparatus for making chip assemblies is disclosed that prevent or reduce the cracking and delamination of ultra low-k dielectrics in the back-end-of-line in Si chips that can occur during the chip assembly process. The method and apparatus apply pressure to the top and bottom surfaces of a substrate during the chip bonding process so that the bending and warping of the assembled modules are reduced. The reduced bending and warping prevent or reduce the cracking and delamination of ultra low-k dielectrics.