Patents by Inventor Kang Yu
Kang Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240379259Abstract: An extreme ultra violet (EUV) light source apparatus includes an excitation laser inlet port configured to receive an excitation laser, and a first mirror configured to reflect the excitation laser that passes through a zone of excitation. A metal droplet is irradiated by the excitation laser.Type: ApplicationFiled: July 23, 2024Publication date: November 14, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Cheng Hung TSAI, Sheng-Kang YU, Shang-Chieh CHIEN, Heng-Hsin LIU, Li-Jui CHEN
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Publication number: 20240372551Abstract: The application discloses a programmable logic circuit, which comprising: a first lookup table circuit for generating and outputting a first output signal based on a received input signal; a second lookup table circuit for generating a carry propagation signal and a carry generation signal based on a received input signal, selecting one of the signals as the output; a first selection circuit for receiving a carry input signal and a carry generation signal, selecting one of the signals as the output based on the carry propagation signal; a second selection circuit for receiving a first output signal and a second output signal, selecting one of the signals as the output based on the selection output signal. The circuit provided in this application includes the addition operation of multivariate functions, which improves the configuration flexibility and logic resource utilization efficiency of programmable logic devices in addition operation mode.Type: ApplicationFiled: May 1, 2024Publication date: November 7, 2024Inventors: CHANGLONG WANG, PEIFU SHEN, KANG YU, BEIBEI LIU, HENG ZHANG, MIN ZHANG, QIPAN FU
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Publication number: 20240373615Abstract: A static random access memory (SRAM) cell includes a write port including a first inverter including a first pull-up transistor and a first pull-down transistor, and a second inverter including a second pull-up transistor and a second pull-down transistor and cross-coupled with the first inverter; and a read port including a read pass-gate transistor and a read pull-down transistor serially connected to each. A first doped concentration of impurities doped in channel regions of the second pull-down transistor and the read pull-down transistor is greater than a second doped concentration of the impurities doped in a channel region of the first pull-down transistor, or the impurities are doped in the channel regions of the second pull-down transistor and the read pull-down transistor and are not doped in the channel region of the first pull-down transistor.Type: ApplicationFiled: July 15, 2024Publication date: November 7, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Shau-Wei LU, Hao CHANG, Kun-Hsi LI, Kuo-Hung LO, Kang-Yu HSU, Yao-Chung HU
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Publication number: 20240369937Abstract: An extreme ultraviolet (EUV) photolithography system generates EUV light by irradiating droplets with a laser. The system includes a collector and a plurality of vibration sensors coupled to the collector. The vibration sensors generate sensor signals indicative of shockwaves from laser pulses and impacts from debris. The system utilizes the sensor signals to improve the quality of EUV light generation.Type: ApplicationFiled: July 15, 2024Publication date: November 7, 2024Inventors: Tai-Yu CHEN, Shang-Chieh CHIEN, Sheng-Kang YU, Li-Jui CHEN, Heng-Hsin LIU
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Publication number: 20240361701Abstract: A method of inspecting an extreme ultraviolet (EUV) radiation source includes, in an idle mode, inserting a borescope mounted on a fixture through a first opening into a chamber of the EUV radiation source. The borescope includes a connection cable attached at a first end to a camera. The EUV radiation source includes an excitation laser that generates a light beam that is configured to focus onto tin droplets to generate EUV radiation inside the chamber of the EUV radiation source. The method further includes extending the extendible section, in a direction toward the second opening of the EUV radiation source, to move the camera beyond the blocking shield, and acquiring one or more images from a region beyond the blocking shield. The method also includes analyzing the one or more acquired images to determine an amount of tin debris deposited inside the chamber of the EUV radiation source.Type: ApplicationFiled: July 9, 2024Publication date: October 31, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chiao-Hua CHENG, Sheng-Kang YU, Shang-Chieh CHIEN, Wei-Chun YEN, Heng-Hsin LIU, Ming-Hsun TSAI, Yu-Fa LO, Li-Jui CHEN, Wei-Shin CHENG, Cheng-Hsuan WU, Cheng-Hao LAI, Yu-Kuang SUN, Yu-Huan CHEN
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Publication number: 20240353765Abstract: Microwave heating of debris collecting vanes within the source vessel of a lithography apparatus is used to accomplish uniform temperature distribution in order to reduce fall-on contamination and formation of clogs on the inner and outer surfaces of the vanes.Type: ApplicationFiled: July 1, 2024Publication date: October 24, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Cheng Hung TSAI, Sheng-Kang YU, Shang-Chieh CHIEN, Heng-Hsin LIU, Li-Jui CHEN
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Publication number: 20240345491Abstract: A system for monitoring and controlling an EUV light source includes a first temperature sensor, a signal processor, and a process controller. The first temperature sensor includes a portion inserted into a space surrounded by a plurality of vanes through a vane of the plurality of vanes, and obtains an ambient temperature that decreases with time as a function of tin contamination coating on the inserted portion. The signal processor determines an excess tin debris deposition on the vane based on the obtained chamber ambient temperature. The process controller activates a vane cleaning action upon being informed of the excess tin debris deposition by the signal processor, thereby improving availability of the EUV light source tool and reducing risks of tin pollution on other tools such as a reticle.Type: ApplicationFiled: April 12, 2023Publication date: October 17, 2024Inventors: Cheng Hung TSAI, Sheng-Kang Yu, Heng-Hsin Liu, Li-Jui Chen, Shang-Chieh Chien
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Patent number: 12119129Abstract: An extreme ultra violet (EUV) light source apparatus includes a metal droplet generator, a collector mirror, an excitation laser inlet port for receiving an excitation laser, a first mirror configured to reflect the excitation laser that passes through a zone of excitation, and a second mirror configured to reflect the excitation laser reflected by the first mirror.Type: GrantFiled: March 13, 2023Date of Patent: October 15, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Cheng Hung Tsai, Sheng-Kang Yu, Shang-Chieh Chien, Heng-Hsin Liu, Li-Jui Chen
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Publication number: 20240339935Abstract: An inverter assembly is disclosed and includes a base, a contact terminal, an output copper busbar and an elastic component. The output copper busbar is disposed on the base. The output copper busbar includes an output portion configured to electrically connect with the contact terminal. The elastic component is disposed on the base and includes an abutting element, an elastic element and an accommodation seat. The accommodation seat is disposed on the base, the abutting element is connected to the accommodation seat through the elastic element along an axial direction. When the base is docked with the contact terminal, the abutting element of the elastic component abuts against the output portion to attach to the contact terminal, and the contact terminal abuts against the abutting element and the elastic element, so that a restoring force provided by the elastic element keeps the output portion abutting against the contact terminal.Type: ApplicationFiled: June 21, 2023Publication date: October 10, 2024Inventors: Kang-Yu Fan, Jhih-Yang Li, Hsing-Yu Wu
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Publication number: 20240341051Abstract: A power-module-heat-dissipation assembly is disclosed and includes plural first power modules, plural second power modules, a cooling-flow-channel inlet, a cooling-flow-channel outlet, a first housing base and a second housing base. The first housing base including a first flow channel and a first heat dissipation surface, and the second housing base including a second flow channel and a second heat dissipation surface are assembled to form a housing extended along a first direction. The first heat dissipation surface and the second heat dissipation surface are disposed on two opposite sides of the housing. The first and second power modules are arranged along the first direction and disposed on the first and second heat dissipation surfaces. The first and second flow channel are in fluid communication between the coolant flow-channel inlet and the cooling-flow-channel outlet, so as to dissipate the heat generated from the first and second power modules quickly and evenly.Type: ApplicationFiled: June 8, 2023Publication date: October 10, 2024Inventors: Kang-Yu Fan, Jhih-Yang Li, Hsing-Yu Wu
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Publication number: 20240341052Abstract: A dual-inverter assembly is disclosed and includes an elongated base, a first power module, a second power module, an input copper busbar and two output copper busbars. The elongated base includes a first elongated sidewall and a second elongated sidewall opposite to each other and extended along a first direction. The first power module and the second power module are disposed on a first side and a second side of the elongated base along the first direction, respectively. The input copper busbar is spatially corresponding to the first elongated sidewall, and electrically connected to the first power module and the second power module. The two output copper busbars are spatially corresponding to the second elongated sidewall, and electrically connected to the first power module and the second power module, respectively, so as to achieve an optimized configuration.Type: ApplicationFiled: June 14, 2023Publication date: October 10, 2024Inventors: Kang-Yu Fan, Jhih-Yang Li, Hsing-Yu Wu
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Patent number: 12096543Abstract: A method for using an extreme ultraviolet radiation source is provided. The method includes performing a lithography process using an extreme ultraviolet (EUV) radiation source; after the lithography processes, inserting an extraction tube into a vessel of the EUV radiation source; and cleaning a collector of the EUV radiation source by using the extraction tube.Type: GrantFiled: January 9, 2023Date of Patent: September 17, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chiao-Hua Cheng, Hsin-Feng Chen, Yu-Fa Lo, Yu-Kuang Sun, Wei-Shin Cheng, Yu-Huan Chen, Ming-Hsun Tsai, Cheng-Hao Lai, Cheng-Hsuan Wu, Shang-Chieh Chien, Heng-Hsin Liu, Li-Jui Chen, Sheng-Kang Yu
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Patent number: 12096544Abstract: A light source is provided capable of maintaining the temperature of a collector surface at or below a predetermined temperature. The light source in accordance with various embodiments of the present disclosure includes a processor, a droplet generator for generating a droplet to create extreme ultraviolet light, a collector for reflecting the extreme ultraviolet light into an intermediate focus point, a light generator for generating pre-pulse light and main pulse light, and a thermal image capture device for capturing a thermal image from a reflective surface of the collector.Type: GrantFiled: April 11, 2023Date of Patent: September 17, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Tai-Yu Chen, Cho-Ying Lin, Sagar Deepak Khivsara, Hsiang Chen, Chieh Hsieh, Sheng-Kang Yu, Shang-Chieh Chien, Kai Tak Lam, Li-Jui Chen, Heng-Hsin Liu, Zhiqiang Wu
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Publication number: 20240302755Abstract: A method includes: removing debris on a collector of a lithography equipment by changing physical structure of the debris with a cleaner; forming a cleaned collector by exhausting the removable debris from the collector; and forming openings in a mask layer on a substrate by removing regions of the mask layer exposed to radiation from the cleaned collector.Type: ApplicationFiled: May 15, 2024Publication date: September 12, 2024Inventors: Cho-Ying LIN, Tai-Yu CHEN, Chieh HSIEH, Sheng-Kang YU, Shang-Chieh CHIEN, Li-Jui CHEN, Heng-Hsin LIU
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Publication number: 20240295825Abstract: In an embodiment, a method includes: heating a byproduct transport ring of an extreme ultraviolet source, the byproduct transport ring disposed beneath vanes of the extreme ultraviolet source; after heating the byproduct transport ring for a first duration, heating the vanes; after heating the vanes, cooling the vanes; and after cooling the vanes for a second duration, cooling the byproduct transport ring.Type: ApplicationFiled: May 10, 2024Publication date: September 5, 2024Inventors: Wei-Chun Yen, Chi Yang, Sheng-Kang Yu, Shang-Chieh Chien, Li-Jui Chen, Heng-Hsin Liu
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Patent number: 12079952Abstract: A system is adapted to perform an image processing method. The processing method includes: obtaining input image data, a first training result, a second training result, and an interpolation lookup table; segmenting the input image data into a plurality of feature blocks according to a total quantity of area interpolations; establishing a position mapping relationship to record the feature blocks corresponding to positions of all of the area interpolations; assigning corresponding area interpolations to the feature blocks according to the position mapping relationship; obtaining an interpolation parameter for each of the feature blocks according to the first training result, the second training result, and the area interpolation; performing block convolution on each of the interpolation parameters and the corresponding feature block to obtain an output feature result; and obtaining an output image by combining the output feature results according to the position mapping relationship.Type: GrantFiled: March 14, 2022Date of Patent: September 3, 2024Assignee: REALTEK SEMICONDUCTOR CORP.Inventors: Chia-Wei Yu, Kang-Yu Liu
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Patent number: 12082388Abstract: A Static Random Access Memory (SRAM) cell includes a write port including a first inverter including a first pull-up transistor and a first pull-down transistor, and a second inverter including a second pull-up transistor and a second pull-down transistor and cross-coupled with the first inverter; and a read port including a read pass-gate transistor and a read pull-down transistor serially connected to each. A first doped concentration of impurities doped in channel regions of the second pull-down transistor and the read pull-down transistor is greater than a second doped concentration of the impurities doped in a channel region of the first pull-down transistor, or the impurities are doped in the channel regions of the second pull-down transistor and the read pull-down transistor and are not doped in the channel region of the first pull-down transistor.Type: GrantFiled: August 7, 2023Date of Patent: September 3, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Shau-Wei Lu, Hao Chang, Kun-Hsi Li, Kuo-Hung Lo, Kang-Yu Hsu, Yao-Chung Hu
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Patent number: 12078933Abstract: An extreme ultraviolet (EUV) photolithography system generates EUV light by irradiating droplets with a laser. The system includes a collector and a plurality of vibration sensors coupled to the collector. The vibration sensors generate sensor signals indicative of shockwaves from laser pulses and impacts from debris. The system utilizes the sensor signals to improve the quality of EUV light generation.Type: GrantFiled: October 14, 2021Date of Patent: September 3, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Tai-Yu Chen, Shang-Chieh Chien, Sheng-Kang Yu, Li-Jui Chen, Heng-Hsin Liu
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Patent number: 12066761Abstract: In a method of inspecting an extreme ultraviolet (EUV) radiation source, during an idle mode, a borescope mounted on a fixture is inserted through a first opening into a chamber of the EUV radiation source. The borescope includes a connection cable attached at a first end to a camera. The fixture includes an extendible section mounted from a first side on a lead screw, and the camera of the borescope is mounted on a second side, opposite to the first side, of the extendible section. The extendible section is extended to move the camera inside the chamber of the EUV radiation source. One or more images are acquired by the camera from inside the chamber of the EUV radiation source at one or more viewing positions. The one or more acquired images are analyzed to determine an amount of tin debris deposited inside the chamber of the EUV radiation source.Type: GrantFiled: August 30, 2021Date of Patent: August 20, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chiao-Hua Cheng, Sheng-Kang Yu, Shang-Chieh Chien, Wei-Chun Yen, Heng-Hsin Liu, Ming-Hsun Tsai, Yu-Fa Lo, Li-Jui Chen, Wei-Shin Cheng, Cheng-Hsuan Wu, Cheng-Hao Lai, Yu-Kuang Sun, Yu-Huan Chen
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Patent number: 12061423Abstract: Microwave heating of debris collecting vanes within the source vessel of a lithography apparatus is used to accomplish uniform temperature distribution in order to reduce fall-on contamination and formation of clogs on the inner and outer surfaces of the vanes.Type: GrantFiled: September 28, 2021Date of Patent: August 13, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Cheng Hung Tsai, Sheng-Kang Yu, Shang-Chieh Chien, Heng-Hsin Liu, Li-Jui Chen