Abstract: A method and apparatus for inspecting pattern defects emitting a laser beam, adjusting a light-amount of the laser beam, converting the light-amount adjusted laser beam into a slit-like laser light flux, lowering coherency of the slit-like laser light flux, and irradiating a sample with the coherence reduced slit-like laser light flux. An image of reflection light from the sample is obtained, and a detector is provided which includes the image sensor for receiving the image of the reflection light and for converting it into a detected image signal. An image processor is provided for detecting defects on patterns formed on the sample in accordance with the detected image signal.

Abstract: In a pattern inspection apparatus for comparing images of corresponding areas of two patterns, which are formed so as to be identical, so as to judge that a non-coincident part of the images is a defect, the influence of unevenness in brightness of patterns caused by a difference of thickness or the like is reduced, whereby highly sensitive pattern inspection is realized. In addition, high-speed pattern inspection can be carried out without changing the image comparison algorithm. For this purpose, the pattern inspection apparatus operates to perform comparison processing of images in parallel in plural areas. Further, the pattern inspection apparatus operates to convert gradation of an image signal among compared images using different plural processing units such that, even in the case in which a difference of brightness occurs in an identical pattern among images, a defect can be detected correctly.

Abstract: By using an image signal acquired by picking up a sample to be inspected by a color video camera, penetrant inspection and magnetic-particle inspection which are non-destructive inspections are carried out so that deficiency candidates including a pseudo deficiency are automatically detected and are displayed on a screen. A real deficiency can be detected from the deficiency candidates displayed on the screen. As image data is stored in memory means, information of a deficiency can be repeatedly reproduced on the screen. In the penetrant inspection, the chromaticity at each position on an image is acquired, a deficiency candidate is extracted based on the chrominance, and the deficiency is distinguished from a pseudo deficiency based on the differential value of the chrominance.

Abstract: In an inspection subject substrate, there is a problem that a defect signal is overlooked due to scattered light from a pattern and sensitivity decreases in an irregular circuit pattern part. The inventors propose a defect inspection method, characterized by comprising: an illumination step of guiding light emitted from a light source to a predetermined area on an inspection subject substrate under a plurality of predetermined optical conditions; a detection step of obtaining an electric signal by guiding scattered light components propagating in a predetermined range of azimuthal angle and in a predetermined range of elevation angle to a detector for each of a plurality of scattered light distributions occurred correspondingly to the plurality of optical conditions in the predetermined area; and a defect determination step of determining a defect based on the plurality of electric signals obtained in the detection step.

Abstract: In a pattern inspection apparatus for comparing images of areas corresponding to patterns each formed so as to be the same pattern and determining a non-coincident portion of the image as a defect, an image comparison processing unit configured with a processing system mounting a plurality of CPUs operating in parallel is provided, whereby an effect of brightness irregularity between the comparison images generated from a difference of a film thickness, a difference of a pattern thickness, and the like can be reduced, and a highly sensitive pattern inspection can be performed without setting parameters. Further, a feature amount of each pixel is calculated between the comparison images, and a plurality of feature amounts are compared, so that distinction between a defect and a noise, which is impossible by a luminance value, can be performed with high accuracy.

Abstract: In a pattern inspection apparatus for comparing images of corresponding areas of two patterns, which are formed so as to be identical, so as to judge that a non-coincident part of the images is a defect, the influence of unevenness in brightness of patterns caused by a difference of thickness or the like is reduced, whereby highly sensitive pattern inspection is realized. In addition, high-speed pattern inspection can be carried out without changing the image comparison algorithm. For this purpose, the pattern inspection apparatus operates to perform comparison processing of images in parallel in plural areas. Further, the pattern inspection apparatus operates to convert gradation of an image signal among compared images using different plural processing units such that, even in the case in which a difference of brightness occurs in an identical pattern among images, a defect can be detected correctly.

Abstract: An apparatus for inspecting pattern defects, the apparatus including: a defect candidate extraction unit configured to perform a defect candidate extraction process by comparing a detected image signal with a reference image signal; and a defect detection unit configured to perform a defect detection process and a defect classification process based on a partial image containing a defect candidate that is extracted by the defect candidate extraction unit, wherein the processes performed by the defect candidate extraction unit and/or the defect detection unit are performed asynchronously with an image acquisition process.

Abstract: The present invention relates to a pattern defect inspection method and apparatus that reveal ultramicroscopic defects on an inspection target in which ultramicroscopic circuit patterns are formed, and inspect the defects with high sensitivity and at a high speed. The present invention provides a pattern inspection apparatus for comparing the images of corresponding areas of two formed patterns that should be identical with each other, and judging any mismatched image area as a defect. The pattern inspection apparatus includes means for performing an image comparison process on a plurality of areas in a parallel manner. Further, the pattern inspection apparatus also includes means for converting the gradation of the image signals of compared images in each of a plurality of different processes. Therefore, the present invention can properly detect defects even if the same patterns of compared images differ in brightness.

Abstract: The present invention provides a high-precision alignment method, device and code for inspections that compare an inspection image with a reference image and detect defects from their differences. In one embodiment an inspection image and a reference image are divided into multiple regions. An offset is calculated for each pair of sub-images. Out of these multiple offsets, only the offsets with high reliability are used to determine an offset for the entire image. This allows high-precision alignment with little or no dependency on pattern density or shape, differences in luminance between images, and uneven luminance within individual images. Also, detection sensitivity is adjusted as necessary by monitoring alignment precision.

Abstract: In a defect inspecting apparatus, having contrast, brightness and appearance of a target for inspection and detection sensitivity of a defect changed depending on optical system conditions, and adapted to perform inspection by selecting an optimal test condition, even an unskilled user can easily select an optimal optical condition by quantitatively displaying evaluation values side by side when optical system conditions are changed. Moreover, by selecting an evaluation item having highest satisfaction based on a result of a series of test inspection, an optimal test condition can be automatically selected.

Abstract: A pattern inspection method including: sequentially imaging plural chips formed on a substrate; selecting a pattern which is suitable for calculating position gap between an inspection image of a subject chip and reference image stored in memory from an image of a firstly imaged chip among said sequentially imaged plural chips formed on the substrate; computing position gap between an inspection image of a chip obtained by the sequential imaging and reference image stored in a memory by using a positional information of a pattern image included in the inspection image and a reference pattern image included in the reference image which are both corresponding to the pattern selected at the selecting; aligning the inspection image and the reference image by using information of the calculated position gap; and comparing the aligned inspection image with the reference image and extracting a difference as a defect candidate.

Abstract: A pattern inspection apparatus which compares images of regions, corresponding to each other, of patterns that are formed so as to be identical and judges that non-coincident portions in the images are defects. The pattern inspection apparatus is equipped with an image comparing section which plots individual pixels of an inspection subject image in a feature space and detects excessively deviated points in the feature space as defects. Defects can be detected correctly even when the same patterns in images have a brightness difference due to a difference in the thickness of a film formed on a wafer.

Abstract: It is an object of the present invention to provide a nerve growth factor production inhibitor having a function to inhibit the production of the nerve growth factor deeply involved with the extension of C fiber to epidermis, as well as a high safety, and an external preparation for the skin, a cosmetic, a quasi drug, a preventive and remedy for itching and a remedy for atopic dermatitis containing the nerve growth factor production inhibitor. The nerve growth factor production inhibitor is characterized in that an acerola seed extract is combined.

Abstract: A fault inspection method and apparatus in which the scattergram is separated or objects of comparison are combined in such a manner as to reduce the difference between an inspection object image and a reference image. As a result, the difference between images caused by the thickness difference in the wafer can be tolerated and the false information generation prevented without adversely affecting the sensitivity.

Abstract: The present invention provides a high-precision alignment method, device and code for inspections that compare an inspection image with a reference image and detect defects from their differences. In one embodiment an inspection image and a reference image are divided into multiple regions. An offset is calculated for each pair of sub-images. Out of these multiple offsets, only the offsets with high reliability are used to determine an offset for the entire image. This allows high-precision alignment with little or no dependency on pattern density or shape, differences in luminance between images, and uneven luminance within individual images. Also, detection sensitivity is adjusted as necessary by monitoring alignment precision.

Abstract: The present invention relates to a method for inspecting a crack in a metal surface or the like, and, particularly, to an inspection method and apparatus for nondestructive inspection such as liquid penetrant inspection and magnetic particle testing. The present invention provides a flaw inspection method that essentially comprises the steps of illuminating a surface of a sample to be inspected, obtaining an image of the surface, characterizing a potential flaw on the inspected surface by processing the obtained image, displaying an image of the potential flaw, verifying that the potential flaw is a true flaw, and storing an image of the verified flaw in memory.

Abstract: The present invention provides a high-precision alignment method, device and code for inspections that compare an inspection image with a reference image and detect defects from their differences. In one embodiment an inspection image and a reference image are divided into multiple regions. An offset is calculated for each pair of sub-images. Out of these multiple offsets, only the offsets with high reliability are used to determine an offset for the entire image. This allows high-precision alignment with little or no dependency on pattern density or shape, differences in luminance between images, and uneven luminance within individual images. Also, detection sensitivity is adjusted as necessary by monitoring alignment precision.

Abstract: A method and apparatus for inspecting pattern defects emitting a laser beam, adjusting a light-amount of the laser beam, converting the light-amount adjusted laser beam into a slit-like laser light flux, lowering coherency of the slit-like laser light flux, and irradiating a sample with the coherence reduced slit-like laser light flux. An image of reflection light from the sample is obtained, and a detector is provided which includes the image sensor for receiving the image of the reflection light and for converting it into a detected image signal. An image processor is provided for detecting defects on patterns formed on the sample in accordance with the detected image signal.

Abstract: An object of the present invention is to provide a defect detection method and its apparatus which can adjust sensitivity easily by managing both reduction in the number of false reports and highly-sensitive detection of a defect using single threshold value setting in comparison inspection that compares an image to be inspected with a reference image to detect a defect judging from a difference between the images. According to the present invention, adjusting the brightness before inspection so that a difference becomes small at the edges of a high-contrast pattern in a target image enables reduction in the number of false reports caused by an alignment error, and achievement of highly-sensitive defect inspection using a low threshold value, without increasing the threshold value.

Abstract: The present invention provides a high-precision alignment method, device and code for inspections that compare an inspection image with a reference image and detect defects from their differences. In one embodiment an inspection image and a reference image are divided into multiple regions. An offset is calculated for each pair of sub-images. Out of these multiple offsets, only the offsets with high reliability are used to determine an offset for the entire image. This allows high-precision alignment with little or no dependency on pattern density or shape, differences in luminance between images, and uneven luminance within individual images. Also, detection sensitivity is adjusted as necessary by monitoring alignment precision.