Patents by Inventor Kartik Shah
Kartik Shah has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10325763Abstract: Physical vapor deposition target assemblies and methods of cooling physical vapor deposition targets are disclosed. An exemplary target assembly comprises a flow pattern including a plurality of rows and bends fluidly connected to an inlet end and an outlet end.Type: GrantFiled: January 20, 2017Date of Patent: June 18, 2019Assignee: APPLIED MATERIALS, INC.Inventors: Wei W. Wang, Kartik Shah, Vishwas Kumar Pandey
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Patent number: 10269614Abstract: Implementations of the present disclosure generally relate to a susceptor for thermal processing of semiconductor substrates. In one implementation, the susceptor includes a first rim surrounding and coupled to an inner region, and a second rim disposed between the inner rim and the first rim. The second rim includes an angled support surface having a plurality of cut-outs formed therein, and the angled support surface is inclined with respect to a top surface of the inner region.Type: GrantFiled: October 16, 2015Date of Patent: April 23, 2019Assignee: APPLIED MATERIALS, INC.Inventors: Schubert S. Chu, Kartik Shah, Anhthu Ngo, Karthik Ramanathan, Nitin Pathak, Nyi O. Myo, Paul Brillhart, Richard O. Collins, Kevin Joseph Bautista, Edric Tong, Zhepeng Cong, Anzhong Chang, Kin Pong Lo, Manish Hemkar
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Publication number: 20190105614Abstract: Gas injectors for providing uniform flow of fluid are provided herein. The gas injector includes a plenum body. The plenum body includes a recess, a protrusion adjacent to the recess and extending laterally away from the plenum body, and a plurality of nozzles extending laterally from an exterior surface of the plenum body. The plenum body has a plurality of holes in an exterior wall of the plenum body. Each nozzle is in fluid communication with an interior volume of the plenum body. By directing the flow of fluid, the gas injector provides for a uniform deposition.Type: ApplicationFiled: August 29, 2018Publication date: April 11, 2019Inventors: Vishwas Kumar PANDEY, Lara HAWRYLCHAK, Eric Kihara SHONO, Kartik SHAH, Christopher S. OLSEN, Sairaju TALLAVARJULA, Kailash PRADHAN, Rene GEORGE, Johanes S. SWENBERG, Stephen MOFFATT
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Patent number: 10232324Abstract: Embodiments of gas mixing apparatus are provided herein. In some embodiments, a gas mixing apparatus may include a container defining an interior volume, the container having a closed top and bottom and a sidewall having a circular cross section with respect to a central axis of the container passing through the top and bottom; a plurality of first inlets coupled to the container proximate the top of the container to provide a plurality of process gases to the interior volume of the container, the plurality of first inlets disposed such that a flow path of the plurality of process gases through the plurality of first inlets is substantially tangential to the sidewall of the container; and an outlet coupled to the container proximate the bottom of the container to allow the plurality of process gases to be removed from the interior volume of the container.Type: GrantFiled: June 14, 2013Date of Patent: March 19, 2019Assignee: APPLIED MATERIALS, INC.Inventors: Kartik Shah, Kalyanjit Ghosh, Scott McClelland
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Patent number: 10221483Abstract: Embodiments described herein relate to a showerhead having a reflector plate with a gas injection insert for radially distributing gas. In one embodiment, a showerhead assembly includes a reflector plate and a gas injection insert. The reflector plate includes at least one gas injection port. The gas injection insert is disposed in the reflector plate, and includes a plurality of apertures. The gas injection insert also includes a baffle plate disposed in the gas injection insert, wherein the baffle plate also includes a plurality of apertures. A first plenum is formed between a first portion of the baffle plate and the reflector plate, and a second plenum is formed between a second portion of the baffle plate and the reflector plate. The plurality of apertures of the gas injection insert and the plurality of apertures of the baffle plate are not axially aligned.Type: GrantFiled: April 20, 2015Date of Patent: March 5, 2019Assignee: APPLIED MATERIALS, INC.Inventors: Kartik Shah, Chaitanya A. Prasad, Kevin Joseph Bautista, Jeffrey Tobin, Umesh M. Kelkar, Lara Hawrylchak
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Publication number: 20190032216Abstract: A gas supply member includes a first side opposite a second side and an inner surface defining a first opening extending between the first and second sides. The gas supply member includes a third side orthogonal to the first side, the third side includes a first extension that has a face partially defining the second side, and the first extension includes a first plurality of holes extending through the first extension to the face. The gas supply member includes a fourth side opposite the third side, the fourth side includes a protrusion that has a face partially defining the second side. The gas supply member also includes a baffle disposed adjacent to the inner surface, the baffle includes a first portion extending from the inner surface and a second portion attached to the first portion, and the second portion orthogonal to the first portion and parallel to the third side.Type: ApplicationFiled: July 30, 2018Publication date: January 31, 2019Inventors: Kartik SHAH, Vishwas Kumar PANDEY, Kailash PRADHAN, Sairaju TALLAVARJULA, Rene GEORGE, Eric Kihara SHONO, Philip A. BOTTINI, Roger CURTIS
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Publication number: 20180366363Abstract: In one embodiment, a susceptor for thermal processing is provided. The susceptor includes an outer rim surrounding and coupled to an inner dish, the outer rim having an inner edge and an outer edge. The susceptor further includes one or more structures for reducing a contacting surface area between a substrate and the susceptor when the substrate is supported by the susceptor. At least one of the one or more structures is coupled to the inner dish proximate the inner edge of the outer rim.Type: ApplicationFiled: August 23, 2018Publication date: December 20, 2018Inventors: Anhthu NGO, Zuoming ZHU, Balasubramanian RAMACHANDRAN, Paul BRILLHART, Edric TONG, Anzhong CHANG, Kin Pong LO, Kartik SHAH, Schubert S. CHU, Zhepeng CONG, James Francis MACK, Nyi O. MYO, Kevin Joseph BAUTISTA, Xuebin LI, Yi-Chiau HUANG, Zhiyuan YE
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Publication number: 20180337075Abstract: Embodiments of the disclosure generally relate to a semiconductor processing chamber. In one embodiment, semiconductor processing chamber is disclosed and includes a chamber body having a bottom and a sidewall defining an interior volume, the sidewall having a substrate transfer port formed therein, and one or more absorber bodies positioned in the interior volume in a position opposite of the substrate transfer port.Type: ApplicationFiled: May 17, 2018Publication date: November 22, 2018Inventors: Dongming IU, Kartik SHAH, Norman L. TAM, Matthew SPULLER, Jau-Jiun CHEN, Kong Lung Samuel CHAN, Elizabeth NEVILLE, Preetham RAO, Abhilash J. MAYUR, Gia Pham
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Patent number: 10132003Abstract: Embodiments disclosed herein generally related to a processing chamber, and more specifically a heat modulator assembly for use in a processing chamber. The heat modulator assembly includes a heat modulator housing and a plurality of heat modulators. The heat modulator housing includes a housing member defining a housing plane, a sidewall, and an annular extension. The sidewall extends perpendicular to the housing plane. The annular extension extends outward from the sidewall. The plurality of heat modulators is positioned in the housing member.Type: GrantFiled: July 21, 2017Date of Patent: November 20, 2018Assignee: APPLIED MATERIALS, INC.Inventors: Shu-Kwan Lau, Surajit Kumar, Joseph M. Ranish, Zhiyuan Ye, Kartik Shah, Mehmet Tugrul Samir, Errol Antonio C. Sanchez
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Publication number: 20180298494Abstract: Embodiments described herein include a susceptor for semiconductor processing including an oriented graphite plate that may have a thickness of at least 1 mm. The susceptor may have a support member, and the oriented graphite plate may be disposed on the support member. The support member may have a center thermal conduit and an edge thermal conduit, and may be substantially solid between the center thermal conduit and the edge thermal conduit.Type: ApplicationFiled: June 18, 2018Publication date: October 18, 2018Inventors: Preetham RAO, Subramani IYER, Kartik SHAH, Mehran BEHDJAT
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Patent number: 10062598Abstract: In one embodiment, a susceptor for thermal processing is provided. The susceptor includes an outer rim surrounding and coupled to an inner dish, the outer rim having an inner edge and an outer edge. The susceptor further includes one or more structures for reducing a contacting surface area between a substrate and the susceptor when the substrate is supported by the susceptor. At least one of the one or more structures is coupled to the inner dish proximate the inner edge of the outer rim.Type: GrantFiled: April 28, 2015Date of Patent: August 28, 2018Assignee: APPLIED MATERIALS, INC.Inventors: Anhthu Ngo, Zuoming Zhu, Balasubramanian Ramachandran, Paul Brillhart, Edric Tong, Anzhong Chang, Kin Pong Lo, Kartik Shah, Schubert S. Chu, Zhepeng Cong, James Francis Mack, Nyi O. Myo, Kevin Joseph Bautista, Xuebin Li, Yi-Chiau Huang, Zhiyuan Ye
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Patent number: 10047457Abstract: Embodiments of the present disclosure generally relate to a process chamber having a pre-heat ring for heating the process gas. In one embodiment, the process chamber includes a chamber body defining an interior processing region, a substrate support disposed within the chamber body, the substrate support having a substrate support surface for supporting a substrate, and a pre-heat ring positioned on a ring support disposed within the chamber body, wherein a portion of the pre-heat ring is tilted downwardly by a predetermined angle towards the gas exhaust side with respect to the substrate support surface to promote the purge gas flowing more through the gas exhaust side than the gas injection side.Type: GrantFiled: August 15, 2014Date of Patent: August 14, 2018Assignee: APPLIED MATERIALS, INC.Inventors: Kartik Shah, Shu-Kwan Lau
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Publication number: 20180214440Abstract: The invention provides an oral composition comprising 4-methyl-8-phenoxy-1-(2-phenylethyl)-2,3-dihydro-1H-pyrrolo[3,2-c]quinoline or a pharmaceutically acceptable salt and/or solvate thereof and chlorhexidine or a pharmaceutically acceptable salt and/or solvate thereof, wherein the composition is in the form of a mouthwash and comprises about 0.001% w/v to about 0.06% w/v of chlorhexidine or a pharmaceutically acceptable salt and/or solvate thereof. Also provided is an oral composition comprising 4-methyl-8-phenoxy-1-(2-phenylethyl)-2,3-dihydro-1H-pyrrolo[3,2-c]quinoline or a pharmaceutically acceptable salt and/or solvate thereof, chlorhexidine or a pharmaceutically acceptable salt and/or solvate thereof, and a zinc compound.Type: ApplicationFiled: April 11, 2016Publication date: August 2, 2018Applicant: HELPERBY THERAPEUTICS LIMITEDInventors: Anthony COATES, Yanmin HU, Sanju DHAWAN, Kartik SHAH
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Publication number: 20180211826Abstract: Physical vapor deposition target assemblies and methods of cooling physical vapor deposition targets are disclosed. An exemplary target assembly comprises a flow pattern including a plurality of rows and bends fluidly connected to an inlet end and an outlet end.Type: ApplicationFiled: January 20, 2017Publication date: July 26, 2018Inventors: Wei W. Wang, Kartik Shah, Vishwas Kumar Pandey
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Patent number: 10000847Abstract: Embodiments described herein include a susceptor for semiconductor processing including an oriented graphite plate that may have a thickness of at least 1 mm. The susceptor may have a support member, and the oriented graphite plate may be disposed on the support member. The support member may have a center thermal conduit and an edge thermal conduit, and may be substantially solid between the center thermal conduit and the edge thermal conduit.Type: GrantFiled: September 23, 2015Date of Patent: June 19, 2018Assignee: APPLIED MATERIALS, INC.Inventors: Preetham Rao, Subramani Iyer, Kartik Shah, Mehran Behdjat
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Publication number: 20180142352Abstract: An apparatus and method for cooling a gas distribution assembly with a cooling plate. The cooling plate having a body having a top surface, an outer perimeter, a center, an inner zone and an outer zone. A plurality of channels formed through the top surface. The plurality of channels having a first outer channel having one or more first outer channel segments configured for flowing a first cooling fluid from a cooling fluid inlet to a cooling fluid outlet and a first inner channel disposed between the first outer channel and the center having one or more first inner channel segments configured for flowing a second cooling fluid from a cooling fluid inlet to a cooling fluid outlet wherein flow in adjacent segments is in an opposite direction.Type: ApplicationFiled: November 9, 2017Publication date: May 24, 2018Inventors: Kartik SHAH, Nisha Prakash HOLLA, Vijaykumar KRITHIVASAN, Anantha K. SUBRAMANI, Hamid NOORBAKHSH
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Publication number: 20180066382Abstract: Embodiments provided herein generally relate to an apparatus for delivering gas to a semiconductor processing chamber. An upper quartz dome of an epitaxial semiconductor processing chamber has a plurality of holes formed therein and precursor gases are provided into a processing volume of the chamber through the holes of the upper dome. Gas delivery tubes extend from the holes in the dome to a flange plate where the tubes are coupled to gas delivery lines. The gas delivery apparatus enables gases to be delivered to the processing volume above a substrate through the quartz upper dome.Type: ApplicationFiled: November 10, 2017Publication date: March 8, 2018Inventors: Paul BRILLHART, Anzhong CHANG, Edric TONG, Kin Pong LO, James Francis MACK, Zhiyuan YE, Kartik SHAH, Errol Antonio C. Sanchez, David K. CARLSON, Satheesh KUPPURAO, Joseph M. RANISH
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Publication number: 20180023214Abstract: Embodiments disclosed herein generally related to a processing chamber, and more specifically a heat modulator assembly for use in a processing chamber. The heat modulator assembly includes a heat modulator housing and a plurality of heat modulators. The heat modulator housing includes a housing member defining a housing plane, a sidewall, and an annular extension. The sidewall extends perpendicular to the housing plane. The annular extension extends outward from the sidewall. The plurality of heat modulators is positioned in the housing member.Type: ApplicationFiled: July 21, 2017Publication date: January 25, 2018Inventors: Shu-Kwan LAU, Surajit KUMAR, Joseph M. RANISH, Zhiyuan YE, Kartik SHAH, Mehmet Tugrul SAMIR, Errol Antonio C. SANCHEZ
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Patent number: 9845550Abstract: Embodiments provided herein generally relate to an apparatus for delivering gas to a semiconductor processing chamber. An upper quartz dome of an epitaxial semiconductor processing chamber has a plurality of holes formed therein and precursor gases are provided into a processing volume of the chamber through the holes of the upper dome. Gas delivery tubes extend from the holes in the dome to a flange plate where the tubes are coupled to gas delivery lines. The gas delivery apparatus enables gases to be delivered to the processing volume above a substrate through the quartz upper dome.Type: GrantFiled: February 3, 2015Date of Patent: December 19, 2017Assignee: APPLIED MATERIALS, INC.Inventors: Paul Brillhart, Anzhong Chang, Edric Tong, Kin Pong Lo, James Francis Mack, Zhiyuan Ye, Kartik Shah, Errol Antonio C. Sanchez, David K. Carlson, Satheesh Kuppurao, Joseph M. Ranish
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Publication number: 20170349994Abstract: Embodiments described herein generally relate to a processing chamber having one or more gas inlet ports located at a bottom of the processing chamber. Gas flowing into the processing chamber via the one or more gas inlet ports is directed along a lower side wall of the processing chamber by a plate located over each of the one or more gas inlet ports or by an angled opening of each of the one or more gas inlet ports. The one or more gas inlet ports and the plates may be located at one end of the processing chamber, and the gas flow is directed towards an exhaust port located at the opposite end of the processing chamber by the plates or the angled openings. Thus, more gas can be flowed into the processing chamber without dislodging particles from a lid of the processing chamber.Type: ApplicationFiled: January 26, 2017Publication date: December 7, 2017Inventors: Vishwas Kumar PANDEY, Kartik SHAH, Edric TONG, Prashanth VASUDEVA