Patents by Inventor Kartik Shah
Kartik Shah has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11978646Abstract: Embodiments of the disclosure generally relate to a semiconductor processing chamber. In one embodiment, semiconductor processing chamber is disclosed and includes a chamber body having a bottom and a sidewall defining an interior volume, the sidewall having a substrate transfer port formed therein, and one or more absorber bodies positioned in the interior volume in a position opposite of the substrate transfer port.Type: GrantFiled: May 17, 2018Date of Patent: May 7, 2024Assignee: Applied Materials, Inc.Inventors: Dongming Iu, Kartik Shah, Norman L. Tam, Matthew Spuller, Jau-Jiun Chen, Kong Lung Samuel Chan, Elizabeth Neville, Preetham Rao, Abhilash J. Mayur, Gia Pham
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Patent number: 11959169Abstract: A gas injector for processing a substrate includes a body having an inlet connectable to a gas source that is configured to provide a gas flow in a first direction into the inlet when processing a substrate on a substrate support disposed within a processing volume of a processing chamber, and an a gas injection channel formed in the body. The gas injection channel is in fluid communication with the inlet and configured to deliver the gas flow to an inlet of the processing chamber. The gas injection channel has a first interior surface and a second interior surface that are parallel to a second direction and a third direction. The second and third directions are misaligned with a center of the substrate, and are at an angle to the first direction towards a first edge of the substrate support.Type: GrantFiled: September 30, 2022Date of Patent: April 16, 2024Assignee: APPLIED MATERIALS, INC.Inventors: Eric Kihara Shono, Vishwas Kumar Pandey, Christopher S. Olsen, Kartik Shah, Hansel Lo, Tobin Kaufman-Osborn, Rene George, Lara Hawrylchak, Erika Hansen
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Publication number: 20240112945Abstract: In one embodiment, a susceptor for thermal processing is provided. The susceptor includes an outer rim surrounding and coupled to an inner dish, the outer rim having an inner edge and an outer edge. The susceptor further includes one or more structures for reducing a contacting surface area between a substrate and the susceptor when the substrate is supported by the susceptor. At least one of the one or more structures is coupled to the inner dish proximate the inner edge of the outer rim.Type: ApplicationFiled: December 14, 2023Publication date: April 4, 2024Inventors: Anhthu NGO, Zuoming ZHU, Balasubramanian RAMACHANDRAN, Paul BRILLHART, Edric TONG, Anzhong CHANG, Kin Pong LO, Kartik SHAH, Schubert S. CHU, Zhepeng CONG, James Francis MACK, Nyi O. MYO, Kevin Joseph BAUTISTA, Xuebin LI, Yi-Chiau HUANG, Zhiyuan YE
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Patent number: 11885021Abstract: A gas supply member includes a first side opposite a second side and an inner surface defining a first opening extending between the first and second sides. The gas supply member includes a third side orthogonal to the first side, the third side includes a first extension that has a face partially defining the second side, and the first extension includes a first plurality of holes extending through the first extension to the face. The gas supply member includes a fourth side opposite the third side, the fourth side includes a protrusion that has a face partially defining the second side. The gas supply member also includes a baffle disposed adjacent to the inner surface, the baffle includes a first portion extending from the inner surface and a second portion attached to the first portion, and the second portion orthogonal to the first portion and parallel to the third side.Type: GrantFiled: May 11, 2021Date of Patent: January 30, 2024Assignee: Applied Materials, Inc.Inventors: Kartik Shah, Vishwas Kumar Pandey, Kailash Pradhan, Sairaju Tallavarjula, Rene George, Eric Kihara Shono, Philip A. Bottini, Roger Curtis
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Publication number: 20230407471Abstract: The present disclosure generally provides methods of providing at least metastable radical molecular species and/or radical atomic species to a processing volume of a process chamber during an electronic device fabrication process, and apparatus related thereto. In one embodiment, the apparatus is a gas injection assembly disposed between a remote plasma source and a process chamber. The gas injection assembly includes a body, a dielectric liner disposed in the body that defines a gas mixing volume, a first flange to couple the gas injection assembly to a process chamber, and a second flange to couple the gas injection assembly to the remote plasma source. The gas injection assembly further includes one or more gas injection ports formed through the body and the liner.Type: ApplicationFiled: June 2, 2023Publication date: December 21, 2023Inventors: Vishwas Kumar PANDEY, Eric Kihara SHONO, Kartik SHAH, Christopher S. OLSEN, Agus Sofian TJANDRA, Tobin KAUFMAN-OSBORN, Taewan KIM, Hansel LO
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Patent number: 11848226Abstract: In one embodiment, a susceptor for thermal processing is provided. The susceptor includes an outer rim surrounding and coupled to an inner dish, the outer rim having an inner edge and an outer edge. The susceptor further includes one or more structures for reducing a contacting surface area between a substrate and the susceptor when the substrate is supported by the susceptor. At least one of the one or more structures is coupled to the inner dish proximate the inner edge of the outer rim.Type: GrantFiled: February 23, 2021Date of Patent: December 19, 2023Assignee: Applied Materials, Inc.Inventors: Anhthu Ngo, Zuoming Zhu, Balasubramanian Ramachandran, Paul Brillhart, Edric Tong, Anzhong Chang, Kin Pong Lo, Kartik Shah, Schubert S. Chu, Zhepeng Cong, James Francis Mack, Nyi O. Myo, Kevin Joseph Bautista, Xuebin Li, Yi-Chiau Huang, Zhiyuan Ye
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Patent number: 11818810Abstract: A heater assembly having a backside purge gap formed between a top plate and a heater of the heater assembly, the top plate having a top plate wall. The top plate wall having an upper portion, a middle portion and a lower portion, the middle portion forming an incline relative to the top portion.Type: GrantFiled: March 26, 2021Date of Patent: November 14, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Dhritiman Subha Kashyap, Amit Rajendra Sherekar, Kartik Shah, Ashutosh Agarwal, Eric J. Hoffmann, Sanjeev Baluja, Vijay D. Parkhe
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Patent number: 11810766Abstract: Embodiments of the present disclosure are directed towards a protective multilayer coating for process chamber components exposed to temperatures from about 20° C. to about 300° C. during use of the process chamber. The protective multilayer coating comprises a bond layer and a top layer, the bond layer is formed on a chamber component to reduce the stress between the top layer and the chamber component. The reduced stress decreases or prevents particle shedding from the top layer of the multilayer coating during and after use of the process chamber. The bond layer comprises titanium, titanium nitride, aluminum, or combinations thereof, and the top layer comprises tungsten nitride.Type: GrantFiled: May 2, 2019Date of Patent: November 7, 2023Assignee: Applied Materials, Inc.Inventors: Karthikeyan Balaraman, Sathyanarayana Bindiganavale, Rajasekhar Patibandla, Balamurugan Ramasamy, Kartik Shah, Umesh M. Kelkar, Mats Larsson, Kevin A. Papke, William M. Lu
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Patent number: 11807931Abstract: Embodiments described herein generally relate to apparatus for fabricating semiconductor devices. A gas injection apparatus is coupled to a first gas source and a second gas source. Gases from the first gas source and second gas source may remain separated until the gases enter a process volume in a process chamber. A coolant is flowed through a channel in the gas injection apparatus to cool the first gas and the second gas in the gas injection apparatus. The coolant functions to prevent thermal decomposition of the gases by mitigating the influence of thermal radiation from the process chamber. In one embodiment, the channel surrounds a first conduit with the first gas and a second conduit with the second gas.Type: GrantFiled: October 6, 2022Date of Patent: November 7, 2023Assignee: Applied Materials, Inc.Inventors: Shu-Kwan Lau, Lit Ping Lam, Preetham Rao, Kartik Shah, Ian Ong, Nyi O. Myo, Brian H. Burrows
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Publication number: 20230330187Abstract: The disclosure describes the use of compositions comprising ghrelin or ghrelin variant to improve dose intensity, dose frequency, duration of use, reduced toxicity, and/or patient compliance of chemotherapeutic agents.Type: ApplicationFiled: November 4, 2022Publication date: October 19, 2023Inventors: Tony REID, Kartik SHAH
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Publication number: 20230329263Abstract: The invention provides a method for making natural cheese with specific texture attributes. The method uses five streams that are accumulated to make the natural cheese. The five streams include a stream of raw milk, a stream of concentrated acidified milk, a stream of cream, a stream of homogenized cream and a stream of water.Type: ApplicationFiled: April 28, 2023Publication date: October 19, 2023Inventors: Mihir Sainani, Kartik Shah, Eva-Maria Düsterhöft, Willem Johannes Marie Engels, Daniel Bradley Clayton
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Publication number: 20230317416Abstract: Plasma showerheads with improved gas uniformity are disclosed. One or more embodiment of the disclosure provides a plasma showerhead with angled gas nozzles. Some embodiments of the disclosure have gas nozzles angled by a vertical offset angle and/or a directional offset angle. None of the gas channels and/or the gas nozzles intersect with the plasma regions of the showerhead.Type: ApplicationFiled: April 1, 2022Publication date: October 5, 2023Applicant: Applied Materials, Inc.Inventors: Chaowei Wang, Kenneth Brian Doering, Hanhong Chen, Kartik Shah, Kevin Griffin, Hao Zhang
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Publication number: 20230282454Abstract: Processing chambers, substrate supports and thermal shields are described. A thermal shield comprises a disc-shaped body having a thickness, an outer diameter with a first edge and a second edge at opposite ends of a diameter of the disc-shaped body, a front surface and a back surface defining the thickness. The front surface has a first longitudinal region comprising the first edge and a second longitudinal region comprising the second edge. Coating one or more of the first longitudinal region or the second longitudinal region with an emissivity material (i.e., emissivity) reduces side to side temperature variation. In some embodiments, processing chambers having the thermal shield described herein consume less power than comparative processing chambers that do not include a thermal shield.Type: ApplicationFiled: March 2, 2022Publication date: September 7, 2023Applicant: Applied Materials, Inc.Inventors: Youngki Chang, Muhannad Mustafa, Kartik Shah, Dhritiman Subha Kashyap, Dhivanraj Subramanian
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Patent number: 11732355Abstract: The present disclosure generally provides methods of providing at least metastable radical molecular species and/or radical atomic species to a processing volume of a process chamber during an electronic device fabrication process, and apparatus related thereto. In one embodiment, the apparatus is a gas injection assembly disposed between a remote plasma source and a process chamber. The gas injection assembly includes a body, a dielectric liner disposed in the body that defines a gas mixing volume, a first flange to couple the gas injection assembly to a process chamber, and a second flange to couple the gas injection assembly to the remote plasma source. The gas injection assembly further includes one or more gas injection ports formed through the body and the liner.Type: GrantFiled: October 24, 2019Date of Patent: August 22, 2023Assignee: Applied Materials, Inc.Inventors: Vishwas Kumar Pandey, Eric Kihara Shono, Kartik Shah, Christopher S. Olsen, Agus Sofian Tjandra, Tobin Kaufman-Osborn, Taewan Kim, Hansel Lo
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Patent number: 11735447Abstract: Embodiments disclosed herein include a processing tool for semiconductor processing. In an embodiment, the processing tool comprises a chamber, and a plurality of witness sensors integrated with the chamber. In an embodiment, the processing tool further comprises a drift detection module. In an embodiment, data from the plurality of witness sensors is provided to the drift detection module as input data. In an embodiment, the processing tool further comprises a dashboard for displaying output data from the drift detection module.Type: GrantFiled: October 20, 2020Date of Patent: August 22, 2023Assignee: Applied Materials, Inc.Inventors: Kartik Santhanam, Kartik Shah, Wolfgang Aderhold, Martin Hilkene, Stephen Moffatt
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Patent number: 11697875Abstract: The present disclosure generally provides methods of providing at least metastable radical molecular species and/or radical atomic species to a processing volume of a process chamber during an electronic device fabrication process, and apparatus related thereto. In one embodiment, the apparatus is a gas injection assembly disposed between a remote plasma source and a process chamber. The gas injection assembly includes a body, a dielectric liner disposed in the body that defines a gas mixing volume, a first flange to couple the gas injection assembly to a process chamber, and a second flange to couple the gas injection assembly to the remote plasma source. The gas injection assembly further includes one or more gas injection ports formed through the body and the liner.Type: GrantFiled: October 24, 2019Date of Patent: July 11, 2023Assignee: Applied Materials, Inc.Inventors: Vishwas Kumar Pandey, Eric Kihara Shono, Kartik Shah, Christopher S. Olsen, Agus Sofian Tjandra, Tobin Kaufman-Osborn, Taewan Kim, Hansel Lo
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Publication number: 20230167543Abstract: One embodiment of the disclosure provides a method of fabricating a chamber component with a coating layer disposed on an interface layer with desired film properties. In one embodiment, a method of fabricating a coating material includes providing a base structure comprising an aluminum or silicon containing material, forming an interface layer on the base structure, wherein the interface layer comprises one or more elements from at least one of Ta, Al, Si, Mg, Y, or combinations thereof, and forming a coating layer on the interface layer, wherein the coating layer has a molecular structure of SivYwMgxAlyOz. In another embodiment, a chamber component includes an interface layer disposed on a base structure, wherein the interface layer is selected from at least one of Ta, Al, Si, Mg, Y, or combinations thereof, and a coating layer disposed on the interface layer, wherein the coating layer has a molecular structure of SivYwMgxAlyOz.Type: ApplicationFiled: January 26, 2023Publication date: June 1, 2023Inventors: Mats LARSSON, Kevin A. PAPKE, Chirag Shaileshbhai KHAIRNAR, Rajasekhar PATIBANDLA, Karthikeyan BALARAMAN, Balamurugan RAMASAMY, Kartik SHAH, Umesh M. KELKAR
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Publication number: 20230083680Abstract: A natural pasta-filata style cheese with improved textural attributes achieved by altering various natural cheesemaking parameters.Type: ApplicationFiled: November 22, 2022Publication date: March 16, 2023Inventors: Kartik Shah, Mihir Sainani, Donald J. McMahon
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Publication number: 20230078565Abstract: A natural pasta filata style cheese with improved textural attributes achieved by altering various natural cheesemaking parameters.Type: ApplicationFiled: November 18, 2022Publication date: March 16, 2023Inventors: Kartik Shah, Mihir Sainani, Donald J. McMahon
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Patent number: 11591689Abstract: One embodiment of the disclosure provides a method of fabricating a chamber component with a coating layer disposed on an interface layer with desired film properties. In one embodiment, a method of fabricating a coating material includes providing a base structure comprising an aluminum or silicon containing material, forming an interface layer on the base structure, wherein the interface layer comprises one or more elements from at least one of Ta, Al, Si, Mg, Y, or combinations thereof, and forming a coating layer on the interface layer, wherein the coating layer has a molecular structure of SivYwMgxAlyOz. In another embodiment, a chamber component includes an interface layer disposed on a base structure, wherein the interface layer is selected from at least one of Ta, Al, Si, Mg, Y, or combinations thereof, and a coating layer disposed on the interface layer, wherein the coating layer has a molecular structure of SivYwMgxAlyOz.Type: GrantFiled: February 14, 2020Date of Patent: February 28, 2023Assignee: Applied Materials, Inc.Inventors: Mats Larsson, Kevin A. Papke, Chirag Shaileshbhai Khairnar, Rajasekhar Patibandla, Karthikeyan Balaraman, Balamurugan Ramasamy, Kartik Shah, Umesh M. Kelkar