Patents by Inventor Katsuaki Suganuma

Katsuaki Suganuma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210167264
    Abstract: An object of the present invention is to provide a method for producing a conductive material that allows a low electric resistance to be generated, and that is obtained by using an inexpensive and stable conductive material composition containing no adhesive. The conductive material can be provided by a producing method that includes the step of sintering a first conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 ?m to 15 ?m, and a metal oxide, so as to obtain a conductive material. The conductive material can be provided also by a method that includes the step of sintering a second conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 ?m to 15 ?m in an atmosphere of oxygen or ozone, or ambient atmosphere, at a temperature in a range of 150° C. to 320° C., so as to obtain a conductive material.
    Type: Application
    Filed: February 9, 2021
    Publication date: June 3, 2021
    Applicant: NICHIA CORPORATION
    Inventors: Masafumi KURAMOTO, Satoru OGAWA, Katsuaki SUGANUMA, Keun-Soo KIM
  • Patent number: 10950770
    Abstract: An object of the present invention is to provide a method for producing a conductive material that allows a low electric resistance to be generated, and that is obtained by using an inexpensive and stable conductive material composition containing no adhesive. The conductive material can be provided by a producing method that includes the step of sintering a first conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 ?m to 15 ?m, and a metal oxide, so as to obtain a conductive material. The conductive material can be provided also by a method that includes the step of sintering a second conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 ?m to 15 ?m in an atmosphere of oxygen or ozone, or ambient atmosphere, at a temperature in a range of 150° C. to 320° C., so as to obtain a conductive material.
    Type: Grant
    Filed: June 25, 2019
    Date of Patent: March 16, 2021
    Assignee: NICHIA CORPORATION
    Inventors: Masafumi Kuramoto, Satoru Ogawa, Katsuaki Suganuma, Keun-Soo Kim
  • Publication number: 20210008670
    Abstract: A solder joint which is used in power devices and the like and which can withstand a high current density without developing electromigration is formed of a Sn—Ag—Bi—In based alloy. The solder joint is formed of a solder alloy consisting essentially of 2-4 mass % of Ag, 2-4 mass % of Bi, 2-5 mass % of In, and a remainder of Sn. The solder alloy may further contain at least one of Ni, Co, and Fe.
    Type: Application
    Filed: September 3, 2020
    Publication date: January 14, 2021
    Inventors: Hans-Jurgen Albrecht, Klaus Wilke, Katsuaki Suganuma, Minoru Ueshima
  • Patent number: 10875097
    Abstract: First, a liquid mixture is obtained by mixing at least a silver compound, a reductant, and a dispersant (S1). Then, the liquid mixture is heated to cause reaction between the silver compound and the reductant and generate first silver particles each having a sheet-like or plate-like shape and second silver particles each having a spherical shape or a shape closer to a sphere than the first silver particles and a particle diameter smaller than a maximum value of a length of a side of each of the first silver particles (S2).
    Type: Grant
    Filed: July 22, 2016
    Date of Patent: December 29, 2020
    Assignee: OSAKA UNIVERSITY
    Inventors: Katsuaki Suganuma, Jinting Jiu
  • Publication number: 20200381136
    Abstract: A method for synthesizing a copper-silver alloy includes an ink preparation step, a coating step, a crystal nucleus formation step and a crystal nucleus synthesis step. In the ink preparation step, a copper salt particle, an amine-based solvent, and a silver salt particle are mixed, thereby preparing a copper-silver ink. In the coating step, a member to be coated is coated with the copper-silver ink. In the crystal nucleus formation step, at least one of a crystal nucleus of copper having a crystal grain diameter of 0.2 ?m or less and a crystal nucleus of silver having a crystal grain diameter of 0.2 ?m or less is formed from the copper-silver ink. In the crystal nucleus synthesis step, the crystal nucleus of copper and the crystal nucleus of silver are synthesized.
    Type: Application
    Filed: July 24, 2018
    Publication date: December 3, 2020
    Applicants: SENJU METAL INDUSTRY CO., LTD., OSAKA UNIVERSITY
    Inventors: Jinting JIU, Minoru UESHIMA, Katsuaki SUGANUMA, Wanli LI
  • Publication number: 20200378912
    Abstract: A substrate evaluation chip is used to perform a test for evaluating a thermal characteristic of a mounting substrate that is mountable a power semiconductor. The substrate evaluation chip includes an insulating substrate bonded with the mounting substrate, and a heating pattern that is formed on a surface of the insulating substrate by a metallic film and is arranged by having a predetermined shape that is optimized to beat the insulating substrate more uniformly. The insulating substrate is a substrate in which an insulating film is formed on a surface of a single crystal substrate having a thermal conductivity of 250 [W/mK] or more.
    Type: Application
    Filed: August 20, 2020
    Publication date: December 3, 2020
    Applicants: OSAKA UNIVERSITY, YAMATO SCIENTIFIC CO., LTD.
    Inventors: Katsuaki Suganuma, Shijo Nagao, Akio Shimoyama, Dongjin Kim, Kazutaka Takeshita, Naoki Wakasugi
  • Patent number: 10651143
    Abstract: Provided is an electrode like a protruding electrode that is self-standing on a substrate. A conductive paste (202) contains a conductive powder, an alcoholic liquid component, and no adhesives. The conductive powder contains conductive particles having a thickness of 0.05 ?m or more and 0.1 ?m or less and a representative length of 5 ?m or more and 10 ?m or less, the representative length being a maximum diameter in a plane perpendicular to the direction of the thickness. The weight percentage of the alcoholic liquid component relative to the conductive paste is 8% or more and 20% or less.
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: May 12, 2020
    Assignees: SHARP KABUSHIKI KAISHA, OSAKA UNIVERSITY
    Inventors: Tomotoshi Satoh, Hiroya Sato, Katsuaki Suganuma, Aiji Suetake, Shijo Nagao, Jinting Jiu, Seiichiro Kihara
  • Patent number: 10625344
    Abstract: A method for producing copper particles includes a preparation step and a heating step. In the preparation step, a copper compound, a salt of a main group metal, and a polyhydric alcohol are prepared. In the heating step, a mixture of the copper compound, the salt of the main group metal, and the polyhydric alcohol is heated. Preferably, the main group metal is at least one selected from the group consisting of lithium, beryllium, sodium, magnesium, aluminum, potassium, calcium, zinc, gallium, germanium, rubidium, strontium, cadmium, indium, tin, antimony, cesium, and barium.
    Type: Grant
    Filed: March 4, 2016
    Date of Patent: April 21, 2020
    Assignee: OSAKA UNIVERSITY
    Inventors: Katsuaki Suganuma, Jinting Jiu
  • Publication number: 20200086391
    Abstract: First, a liquid mixture is obtained by mixing at least a silver compound, a reductant, and a dispersant (S1). Then, the liquid mixture is heated to cause reaction between the silver compound and the reductant and generate first silver particles each having a sheet-like or plate-like shape and second silver particles each having a spherical shape or a shape closer to a sphere than the first silver particles and a particle diameter smaller than a maximum value of a length of a side of each of the first silver particles (S2).
    Type: Application
    Filed: July 22, 2016
    Publication date: March 19, 2020
    Applicant: OSAKA UNIVERSITY
    Inventors: Katsuaki SUGANUMA, Jinting JIU
  • Patent number: 10573795
    Abstract: An object of the present invention is to provide a method for producing a conductive material that allows a low electric resistance to be generated, and that is obtained by using an inexpensive and stable conductive material composition containing no adhesive. The conductive material can be provided by a producing method that includes the step of sintering a first conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 ?m to 15 ?m, and a metal oxide, so as to obtain a conductive material. The conductive material can be provided also by a method that includes the step of sintering a second conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 ?m to 15 ?m in an atmosphere of oxygen or ozone, or ambient atmosphere, at a temperature in a range of 150° C. to 320° C., so as to obtain a conductive material.
    Type: Grant
    Filed: September 19, 2017
    Date of Patent: February 25, 2020
    Assignee: NICHIA CORPORATION
    Inventors: Masafumi Kuramoto, Satoru Ogawa, Katsuaki Suganuma, Keun-Soo Kim
  • Publication number: 20200039007
    Abstract: A bonding member (10) includes surface-processed silver surfaces (11a, 11b).
    Type: Application
    Filed: February 23, 2018
    Publication date: February 6, 2020
    Applicant: OSAKA UNIVERSITY
    Inventors: Katsuaki SUGANUMA, Chuantong CHEN, Toshiyuki ISHINA, Seungjun NOH, Chanyang CHOE
  • Publication number: 20190326493
    Abstract: An object of the present invention is to provide a method for producing a conductive material that allows a low electric resistance to be generated, and that is obtained by using an inexpensive and stable conductive material composition containing no adhesive. The conductive material can be provided by a producing method that includes the step of sintering a first conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 ?m to 15 ?m, and a metal oxide, so as to obtain a conductive material. The conductive material can be provided also by a method that includes the step of sintering a second conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 ?m to 15 ?m in an atmosphere of oxygen or ozone, or ambient atmosphere, at a temperature in a range of 150° C. to 320° C., so as to obtain a conductive material.
    Type: Application
    Filed: June 25, 2019
    Publication date: October 24, 2019
    Applicant: NICHIA CORPORATION
    Inventors: Masafumi KURAMOTO, Satoru OGAWA, Katsuaki SUGANUMA, Keun-Soo KIM
  • Patent number: 10332853
    Abstract: A bonding structure (100) of the present invention includes a substrate (110), a metal film (120), a semiconductor element (130). The substrate (110), the metal film (120), and the semiconductor element (130) are laminated in order just mentioned. The metal film (120) contains a metal diffused through stress migration, and the substrate (110) and the semiconductor element (130) are bonded together with the metal film (120) therebetween.
    Type: Grant
    Filed: February 3, 2015
    Date of Patent: June 25, 2019
    Assignee: OSAKA UNIVERSITY
    Inventors: Katsuaki Suganuma, Shijo Nagao, Chulmin Oh
  • Publication number: 20190189587
    Abstract: A bonding device (100) bonds at least one component (C) to a substrate (B) using a metal material (M). The bonding device (100) includes a wall section (20), at least one pressing section (40), and a rotational shaft (30). The rotational shaft (30) is fixed to the wall section (20). Each pressing section (40) has an arm (42) and a presser (43) or a substrate supporting member (90). The arm (42) extends from the rotational shaft (30). The arm (42) pivots about the rotational shaft (30). The presser (43) presses the component (C). The substrate supporting member (90) is disposed on a reference surface (142). The substrate supporting member (90) supports the substrate (B). The component (C) is bonded to the substrate (B) through point contact of the presser (43) with the component (C) or point contact of the substrate supporting member (90) with the reference surface (142).
    Type: Application
    Filed: June 16, 2017
    Publication date: June 20, 2019
    Applicant: OSAKA UNIVERSITY
    Inventors: Katsuaki SUGANUMA, Shijo NAGAO, Akio SHIMOYAMA, Shinya SEKI
  • Publication number: 20190157229
    Abstract: Provided is an electrode like a protruding electrode that is self-standing on a substrate. A conductive paste (202) contains a conductive powder, an alcoholic liquid component, and no adhesives. The conductive powder contains conductive particles having a thickness of 0.05 ?m or more and 0.1 ?m or less and a representative length of 5 ?m or more and 10 ?m or less, the representative length being a maximum diameter in a plane perpendicular to the direction of the thickness. The weight percentage of the alcoholic liquid component relative to the conductive paste is 8% or more and 20% or less.
    Type: Application
    Filed: April 28, 2017
    Publication date: May 23, 2019
    Applicants: Sharp Kabushiki Kaisha, Osaka University
    Inventors: Tomotoshi SATOH, Hiroya SATO, Katsuaki SUGANUMA, Aiji SUETAKE, Shijo NAGAO, Jinting JIU, Seiichiro KIHARA
  • Publication number: 20190047093
    Abstract: A bonding material (10) of the present invention includes an amorphous silver film (12).
    Type: Application
    Filed: February 10, 2017
    Publication date: February 14, 2019
    Applicants: OSAKA UNIVERSITY, National Cheng Kung University
    Inventors: Katsuaki SUGANUMA, Shijo NAGAO, Shih-kang LIN
  • Patent number: 10201852
    Abstract: A silver particle synthesizing method includes reducing a dispersant from first silver particles each covered with the dispersant to obtain second silver particles. The method further includes synthesizing third silver particles each having a larger particle diameter than the second silver particles by causing a reaction between a silver compound and a reductant in a liquid phase containing the second silver particles.
    Type: Grant
    Filed: June 16, 2015
    Date of Patent: February 12, 2019
    Assignee: OSAKA UNIVERSITY
    Inventors: Katsuaki Suganuma, Jinting Jiu
  • Patent number: 10099291
    Abstract: Provided are a metal nanowire production method capable of producing long and thin metal nanowires, and metal nanowires produced thereby. A metal nanowire production method comprising, a step for preparing a solution containing a metal salt, a polymer, at least one selected from a group consisting of halides, sulfides, carbonates, and sulfates, and an aliphatic alcohol, and a step for heating and reacting the solution at the temperature of 100° C. to 250° C. for 10 minutes or more while maintaining a practical shear stress applied to the solution at 10 mPa·m or less, wherein, during the heating and reacting step, ultraviolet-visible absorption spectrum change of the solution is measured, and a reaction time is controlled on the basis of the ultraviolet-visible absorption spectrum information.
    Type: Grant
    Filed: May 26, 2014
    Date of Patent: October 16, 2018
    Assignees: SHOWA DENKO K.K., OSAKA UNIVERSITY
    Inventors: Katsuaki Suganuma, Jinting Jiu, Masaya Nogi, Tohru Sugahara, Teppei Araki, Hiroshi Uchida, Hideki Ohata, Masanao Hara, Eri Okazaki
  • Publication number: 20180104747
    Abstract: A method for producing copper particles includes a preparation step and a heating step. In the preparation step, a copper compound, a salt of a main group metal, and a polyhydric alcohol are prepared. In the heating step, a mixture of the copper compound, the salt of the main group metal, and the polyhydric alcohol is heated. Preferably, the main group metal is at least one selected from the group consisting of lithium, beryllium, sodium, magnesium, aluminum, potassium, calcium, zinc, gallium, germanium, rubidium, strontium, cadmium, indium, tin, antimony, cesium, and barium.
    Type: Application
    Filed: March 4, 2016
    Publication date: April 19, 2018
    Applicant: OSAKA UNIVERSITY
    Inventors: Katsuaki SUGANUMA, Jinting JIU
  • Publication number: 20180013045
    Abstract: An object of the present invention is to provide a method for producing a conductive material that allows a low electric resistance to be generated, and that is obtained by using an inexpensive and stable conductive material composition containing no adhesive. The conductive material can be provided by a producing method that includes the step of sintering a first conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 ?m to 15 ?m, and a metal oxide, so as to obtain a conductive material. The conductive material can be provided also by a method that includes the step of sintering a second conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 ?m to 15 ?m in an atmosphere of oxygen or ozone, or ambient atmosphere, at a temperature in a range of 150° C. to 320° C., so as to obtain a conductive material.
    Type: Application
    Filed: September 19, 2017
    Publication date: January 11, 2018
    Applicant: NICHIA CORPORATION
    Inventors: Masafumi KURAMOTO, Satoru OGAWA, Katsuaki SUGANUMA, Keun-Soo KIM