Patents by Inventor Katsuhiko Yoshihara

Katsuhiko Yoshihara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method of manufacturing same
    Patent number: 7944042
    Abstract: A semiconductor device includes an outer resin case having a peripheral wall and terminal mounting holes formed in the peripheral wall, and a layer assembly provided in the outer resin case. The layer assembly includes a semiconductor chip, an insulating circuit board on which the semiconductor chip is mounted, and a heat-dissipating metal base. External terminals having leg portions are arranged in mounting holes of the peripheral wall, and are press-fitted into the terminal-mounting holes. Bonding wires connect the terminal leg portions and a conductive pattern of the insulating circuit board or the semiconductor chip.
    Type: Grant
    Filed: February 12, 2008
    Date of Patent: May 17, 2011
    Assignee: Fuji Electric Device Technology Co., Ltd.
    Inventors: Katsuhiko Yoshihara, Rikihiro Maruyama, Masaaki Chino, Eiji Mochizuki, Motokiyo Yokoyama, Tatsuo Nishizawa, Tomonobu Sugiyama
  • Semiconductor device and method for fabricating the same
    Publication number: 20100295187
    Abstract: A semiconductor device which can prevent a deterioration in the electrical properties by preventing sputters generated by laser welding from adhering to a circuit pattern or a semiconductor chip and a method for fabricating such a semiconductor device are provided. A connection conductor is bonded to a copper foil formed over a ceramic by a solder and resin is injected to a level lower than a top of the connection conductor. Laser welding is then performed. After that, resin is injected. This prevents sputters generated by the laser welding from adhering to a circuit pattern or a semiconductor chip. As a result, a deterioration in the electrical properties can be prevented.
    Type: Application
    Filed: June 16, 2010
    Publication date: November 25, 2010
    Applicants: Aisin AW Co., Ltd., Fuji Electric Systems Co., Ltd.
    Inventors: Junji Tsuruoka, Kazuo Aoki, Masaki Ono, Katsuhiko Yoshihara
  • Semiconductor device and method of manufacturing same
    Publication number: 20080217760
    Abstract: A semiconductor device includes an outer resin case having a peripheral wall and terminal mounting holes formed in the peripheral wall, and a layer assembly provided in the outer resin case. The layer assembly includes a semiconductor chip, an insulating circuit board on which the semiconductor chip is mounted, and a heat-dissipating metal base. External terminals having leg portions are arranged in mounting holes of the peripheral wall, and are press-fitted into the terminal-mounting holes. Bonding wires connect the terminal leg portions and a conductive pattern of the insulating circuit board or the semiconductor chip.
    Type: Application
    Filed: February 12, 2008
    Publication date: September 11, 2008
    Applicant: FUJI ELECTRIC DEVICE TECHNOLOGY CO., LTD.
    Inventors: Katsuhiko Yoshihara, Rikihiro Maruyama, Masaaki Chino, Eiji Mochizuki, Motokiyo Yokoyama, Tatsuo Nishizawa, Tomonobu Sugiyama
  • Process for preparing foamable synthetic resin granules
    Patent number: 3960787
    Abstract: In a process for preparing foamable synthetic resin granules by suspension polymerization, a fatty acid bisamide is added prior to or at an early stage of polymerization in the presence of an inorganic salt and a foaming agent is added at a later stage of polymerization or after completion thereof.
    Type: Grant
    Filed: June 6, 1974
    Date of Patent: June 1, 1976
    Assignee: Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
    Inventors: Hiroji Isukamoto, Hisashi Morikawa, Masao Nakagawa, Shinji Kato, Masaki Miyamoto, Toichiro Yoda, Katsuhiko Yoshihara