Abstract: A thermoplastic composition includes an aromatic poly(ketone), a poly(etherimide), and a reactive additive, wherein each component is present in a particular amount as defined herein. The thermoplastic composition can be useful in an insulating layer disposed over a conductor wire to form an electrical wire. Articles including the thermoplastic composition can be particularly useful in applications including an electrical device component, a railway vehicle component, an auto-mobile component, a marine vehicle component, a construction component, construction component, a building component, or an aircraft component.

Abstract: A cutting tool may include a circular columnar body extending from a first end to a second end along a rotation axis. At least a part of the columnar body may correspond to an insert including a cutting edge at the first end. The insert may include therein a flow path extending from a side of the first end toward a side of the second end. A width of the flow path along a radial direction of the circular columnar body may be smaller than a width of the flow path along a circumferential direction of the circular columnar body in a cross section orthogonal to the rotation axis.

Abstract: A drill tip may include a first part and a second part. The first part includes a cutting edge located at a side of a first end, and a recess located at a side of a second end, where the first end is one side of a central axis and the second end is another side of the central axis. The second part includes a shank portion extending along the central axis, and an engaging portion which connects to the shank portion at a side of the first end and includes a diameter greater than the shank portion. The engaging portion is located in the recess.

Abstract: A drill tip may include a first part and a second part. The first part includes a cutting edge located at a side of a first end, and a recess located at a side of a second end, where the first end is one side of a central axis and the second end is another side of the central axis. The second part includes a shank portion extending along the central axis, and an engaging portion which connects to the shank portion at a side of the first end and includes a diameter greater than the shank portion. The engaging portion is located in the recess.

Abstract: A cutting tool may include a circular columnar body extending from a first end to a second end along a rotation axis. At least a part of the columnar body may correspond to an insert including a cutting edge at the first end. The insert may include therein a flow path extending from a side of the first end toward a side of the second end. A width of the flow path along a radial direction of the circular columnar body may be smaller than a width of the flow path along a circumferential direction of the circular columnar body in a cross section orthogonal to the rotation axis.

Abstract: A cutting tool tip may include a first region and a second region. The second region may differ from the first region in material and may include a cutting edge in at least a part of a ridge line part of surfaces adjacent to each other. A boundary surface between the first region and the second region may include a curved surface portion projecting from a side of the second region toward a side of the first region.

Abstract: A wiring board is provided which includes an insulating layer; and a frame body disposed on the insulating layer. The frame body is provided with a through-hole. The insulating layer has a concave portion in one main surface on a frame body side. In a plan view of the wiring board, the concave portion has a first portion positioned at the through-hole, and a second portion which is positioned at the frame body and is continuous with the first portion. An air gap is formed between the frame body and the insulating layer in the second portion.

Abstract: A wiring board includes a first electrically-conductive layer; and a first resin layer covering the first electrically-conductive layer, the first resin layer including a resin portion and inorganic insulating particles dispersed in the resin portion. The first resin layer has a first layer region which is in contact with one main surface and side surfaces of the first electrically-conductive layer, and a second layer region which is located on a side of the first layer region which side is opposite to the first electrically-conductive layer. The inorganic insulating particles include a plurality of first inorganic insulating particles contained in the first layer region, and a plurality of second inorganic insulating particles contained in the second layer region. A content rate of the first inorganic insulating particles in the first layer region is lower than a content rate of the second inorganic insulating particles in the second layer region.

Abstract: A wiring substrate for improving connection reliability with an electronic component, a component embedded substrate that incorporates an embedded component into the wiring substrate, and a package structure including an electronic component mounted on the wiring substrate or the component embedded substrate. The wiring substrate includes a metal plate, and a wiring layer including a plurality of insulating layers and a conductive layer arranged on the plurality of insulating layers arranged on at least one principal surface of the metal plate. The plurality of insulating layers includes a first insulating layer to contact the principal surface of the metal plate and has a larger thermal expansion rate in the planar direction than the metal plate and a second insulating layer which is laminated on the first insulating layer to contact the first insulating layer and has smaller thermal expansion rate in the planar direction than the metal plate.

Abstract: A wiring board (3) according to an embodiment of the present invention includes an inorganic insulating layer (11A); a first resin layer (12A) on one main surface of the inorganic insulating layer (11A); a second resin layer (13A) on another main surface of the inorganic insulating layer (11A); and a conductive layer (8) partially on one main surface of the second resin layer (13A), the one main surface being on an opposite side to the inorganic insulating layer (11A). The inorganic insulating layer (11A) includes a plurality of first inorganic insulating particles (14) which are bound to each other at a part of each of the first inorganic insulating particles and gaps (G) surrounded by the plurality of first inorganic insulating particles (14). A part of the first resin layer (12A) and a part of the second resin layer (13A) are located inside the gaps (G).

Abstract: According to an aspect of the invention, a wiring board includes an inorganic insulating layer and a conductive layer disposed on part of one main surface of the inorganic insulating layer. The part of the one main surface of the inorganic insulating layer includes a plurality of first recessed portions each of which has at least partially circular shape in a plan view. Part of the conductive layer enters into the plurality of first recessed portions. According to the aspect of the invention, it is possible to obtain a wiring board capable of reducing disconnection of the conductive layer and therefore having superior electrical reliability.

Abstract: A structure for which the electrical reliability is improved is provided. A structure in accordance with one embodiment includes an inorganic insulating layer including amorphous silicon oxide and having an elastic modulus which is 45 GPa or less. A method for manufacturing a structure in accordance with one embodiment includes applying an inorganic insulating sol including inorganic insulating particles composed of amorphous silicon oxide, and forming an inorganic insulating layer including amorphous silicon oxide and having an elastic modulus which is 45 GPa or less by heating the inorganic insulating particles at a temperature lower than a crystallization onset temperature of silicon oxide to each other.

Abstract: A wiring substrate with excellent electrical reliability and a mounting structure using the same are provided. A wiring board according to one embodiment of the invention includes an insulating layer; and a frame body disposed on the insulating layer. The frame body is provided with a through-hole. The insulating layer has a concave portion in one main surface on a frame body side. In a plan view of the wiring board, the concave portion has a first portion positioned at the through-hole, and a second portion which is positioned at the frame body and is continuous with the first portion. An air gap is formed between the frame body and the insulating layer in the second portion. As a result, a wiring substrate with excellent electrical reliability can be obtained.

Abstract: A wiring board excellent in electrical reliability is provided. A wiring board includes a first resin layer; an inorganic insulating layer disposed on the first resin layer; a second resin layer disposed on the inorganic insulating layer; and a conductive layer disposed on the second resin layer. The inorganic insulating layer has a first region located in a vicinity of the second resin layer and a second region located on a side opposite to a second resin layer side of the first region. A content ratio of second inorganic insulating particles in the first region is lower than a content ratio of second inorganic insulating particles in the second regions.

Abstract: A method for producing a mounted structure according to an embodiment of the present invention includes a step of forming a circuit substrate, which includes an insulation layer and a conductive layer, on a support member by alternately stacking the insulation layer and the conductive layer on the support member; a step of forming a mounted structure, which includes the circuit substrate and an electronic component, on the support member by mounting the electronic component on the circuit substrate; and a step of removing the support member from the mounted structure. As a result, the efficiency in producing the mounted structure can be increased.

Abstract: A wiring board includes a first electrically-conductive layer; and a first resin layer covering the first electrically-conductive layer, the first resin layer including a resin portion and inorganic insulating particles dispersed in the resin portion. The first resin layer has a first layer region which is in contact with one main surface and side surfaces of the first electrically-conductive layer, and a second layer region which is located on a side of the first layer region which side is opposite to the first electrically-conductive layer. The inorganic insulating particles include a plurality of first inorganic insulating particles contained in the first layer region, and a plurality of second inorganic insulating particles contained in the second layer region. A content rate of the first inorganic insulating particles in the first layer region is lower than a content rate of the second inorganic insulating particles in the second layer region.

Abstract: An electronic device is provided wherein the characteristics thereof are prevented from deteriorating. The electronic device (1) is provided with: a chip component (2) having an electronic element (22); a wiring board (3) on which the chip component (2) is mounted with a space therebetween, the space for containing the electronic element (22); a resin layer (4) provided from the surface of the chip component (2) to the surface of the wiring board (3) so as to surround the space; and an inorganic insulating layer (5), which is provided at the resin layer (4) and is positioned at the side of the space. Since entry of water vapor into the space can be reduced not only by means of the resin layer (4) but also by means of the inorganic insulating layer (5), the electronic device (1) having high airtight sealing performance can be provided.

Abstract: According to an aspect of the invention, a wiring board includes an inorganic insulating layer and a conductive layer disposed on part of one main surface of the inorganic insulating layer. The part of the one main surface of the inorganic insulating layer includes a plurality of first recessed portions each of which has at least partially circular shape in a plan view. Part of the conductive layer enters into the plurality of first recessed portions. According to the aspect of the invention, it is possible to obtain a wiring board capable of reducing disconnection of the conductive layer and therefore having superior electrical reliability.

Abstract: There is provided an interposer which meets the need of improving electrical reliability of an electronic device. An interposer includes a substrate including a penetrating-hole in a thickness direction thereof, and a penetrating conductor disposed in the penetrating-hole. The substrate includes a first insulating layer and a second inorganic insulating layer which are separated from each other in the thickness direction, and a first resin layer interposed between the first inorganic insulating layer and the second inorganic insulating layer and being in contact with the first inorganic insulating layer and the second inorganic insulating layer. A coefficient of thermal expansion of the first resin layer in thickness and planar directions thereof is larger than those of the first inorganic insulating layer and the second inorganic insulating layer.

Abstract: A circuit substrate includes a resin layer; and an inorganic insulating layer including a groove portion penetrating the inorganic insulating layer in a thickness direction thereof. A part of the resin layer is in the groove portion.