Abstract: A method for manufacturing a resin substrate includes heating a resin sheet including fibers and a resin containing incompletely polymerized molecules to a temperature lower than a polymerization initiation temperature of the resin in order to soften the resin; applying a first pressure to the resin sheet to discharge air bubbles between the fibers outside the resin sheet; decreasing the pressure applied to the resin sheet from the first pressure to a second pressure lower than the first pressure; and heating the resin sheet to the polymerization initiation temperature of the resin or higher to polymerize the molecules of the resin and to discharge a gas generated by the polymerization outside the resin sheet.

Abstract: A fiber-reinforced resin is provided which includes a fiber bundle 2 comprising a plurality of monofilament layers 20, 21, and 22 being laminated, each of the monofilament layers comprising a plurality of monofilaments 23 arranged in one direction and an adhesive 3 for adhering the monofilaments 23 of the fiber bundle 2 together, and the fiber bundle 2 has a honeycomb-shaped cross section.

Abstract: A circuit board according to an embodiment of the present invention relates to a circuit board 2 including an insulating layer 7 and a via conductor 8 embedded in the insulating layer 7. The via conductor 8 has a narrowed portion 80 inclined with respect to a horizontal direction X.

Abstract: The present invention provides a method for manufacturing an optical waveguide. The inventive method includes steps of providing a transfer member comprising a transfer sheet and a first metal film. The transfer sheet and the first metal film are detachable from each other. A laminated body made of a core layer disposed between two clad layers is formed on the transfer member. The invention also relates to optical waveguides produced by the inventive process and devices incorporating the optical waveguides of the invention.

Abstract: There is disclosed a wiring board comprising a core substrate 110, a build-up layer 130a formed on at least one side of main surfaces the core substrate, wherein a cavity 120 for accommodating a chip-type decoupling capacitor 121 is formed in the build-up layer 130a. The capacitor 121 includes electrode terminals on an upper surface thereof that are directly connected to a semiconductor component, and electrode terminals on a back surface of the capacitor 121 is connected to a wiring conductor layer 132a on a bottom surface of the cavity 120. This structure enables decoupling capacitor and the semiconductor component 260 to be connected with low resistance and low inductance.

Abstract: There is disclosed a wiring board comprising a core substrate 110, a build-up layer 130a formed on at least one side of main surfaces the core substrate, wherein a cavity 120 for accommodating a chip-type decoupling capacitor 121 is formed in the build-up layer 130a. The capacitor 121 includes electrode terminals on an upper surface thereof that are directly connected to a semiconductor component, and electrode terminals on a back surface of the capacitor 121 is connected to a wiring conductor layer 132a on a bottom surface of the cavity 120. This structure enables decoupling capacitor and the semiconductor component 260 to be connected with low resistance and low inductance.

Abstract: A transfer sheet for use in forming a conductor circuit comprises a base and a metal layer formed into a circuit pattern on the base. The metal layer is transferred onto a surface of an insulation layer. At least part of the circuit pattern of the metal layer is formed by laser-processing. Since it is possible, without using an etching process and a plating process at a minute part of the conductor circuit, to remove the metal layer by emitting laser light having a minute beam diameter, it is possible to form a minute conductor circuit which is 50 ?m or less in width and pitch, with the result that it is prevented that the conductor circuit has a break because of excessive etching and a failure of plating deposition or the conductor circuit is short-circuited because of the residue of etching and a short of plating.

Abstract: There is disclosed a wiringboard comprising a core substrate 110, a build-up layer 130a formed on at least one side of main surfaces the core substrate, wherein a cavity 120 for accommodating a chip-type decoupling capacitor 121 is formed in the build-up layer 130a. The capacitor 121 includes electrode terminals on an upper surface thereof that are directly connected to a semiconductor component, and electrode terminals on a back surface of the capacitor 121 is connected to a wiring conductor layer 132a on a bottom surface of the cavity 120. This structure enables decoupling capacitor and the semiconductor component 260 to be connected with low resistance and low inductance.

Abstract: In a film with metal foil of the present invention, a metal foil is stuck to the surface of a resin film via an adhesive layer. The adhesive is formed by crosslinking an acrylic polymer obtained by the copolymerization of a (meth)acrylic acid ester with a carboxyl group-containing radically polymerizable monomer, with a polyfunctional compound having a functional group reactive with the carboxyl group. The film with metal foil is very useful for producing a multi-layer wiring board by the so-called transfer method. By using this film, there can be produced a multi-layer wiring board having a fine and highly dense wiring/circuit layer and having a very excellently flat surface.

Abstract: An object of the invention is to satisfy all of a high-density wiring package, soldering thermal resistance, an insulating property and high-frequency transmission characteristics. The invention is a multi-layer wiring substrate having a lamination of a plurality of dielectric layers which are each provided with a wiring conductor made of a metallic foil on at least one of upper and bottom surfaces of the dielectric layer, the wiring conductors between which the dielectric layer is disposed being electrically connected with each other via a through conductor formed in the dielectric layer; on this occasion, the dielectric layers each individually are composed of a liquid crystal polymer layer and cladding layers made of a polyphenyleneether-type organic substance and formed on upper and bottom surfaces of the liquid crystal polymer layer.

Abstract: A transfer sheet for use in forming a conductor circuit comprises a base and a metal layer formed into a circuit pattern on the base. The metal layer is transferred onto a surface of an insulation layer. At least part of the circuit pattern of the metal layer is formed by laser-processing. Since it is possible, without using an etching process and a plating process at a minute part of the conductor circuit, to remove the metal layer by emitting laser light having a minute beam diameter, it is possible to form a minute conductor circuit which is 50 &mgr;m or less in width and pitch, with the result that it is prevented that the conductor circuit has a break because of excessive etching and a failure of plating deposition or the conductor circuit is short-circuited because of the residue of etching and a short of plating.

Abstract: In a film with metal foil of the present invention, a metal foil is stuck to the surface of a resin film via an adhesive layer. The adhesive is formed by crosslinking an acrylic polymer obtained by the copolymerization of a (meth)acrylic acid ester with a carboxyl group-containing radically polymerizable monomer, with a polyfunctional compound having a functional group reactive with the carboxyl group. The film with metal foil is very useful for producing a multi-layer wiring board by the so-called transfer method. By using this film, there can be produced a multi-layer wiring board having a fine and highly dense wiring/circuit layer and having a very excellently flat surface.

Abstract: An object of the invention is to satisfy all of a high-density wiring package, soldering thermal resistance, an insulating property and high-frequency transmission characteristics. The invention is a multi-layer wiring substrate having a lamination of a plurality of dielectric layers which are each provided with a wiring conductor made of a metallic foil on at least one of upper and bottom surfaces of the dielectric layer, the wiring conductors between which the dielectric layer is disposed being electrically connected with each other via a through conductor formed in the dielectric layer; on this occasion, the dielectric layers each individually are composed of a liquid crystal polymer layer and cladding layers made of a polyphenyleneether-type organic substance and formed on upper and bottom surfaces of the liquid crystal polymer layer.

Abstract: Provided is a curable sheet for the formation of a wiring circuit layer by circuit transfer from a transfer base material, wherein the curable sheet comprises (A) a reaction product between a polyphenylene ether resin and an unsaturated carboxylic acid or acid anhydride, (B) triallyl isocyanurate and/or triallyl cyanurate, (C) a hydrogenated block copolymer obtained by hydrogenation of a block copolymer comprising at least one polymer block A mainly comprising an aromatic vinyl compound and at least one polymer block B mainly comprising a conjugated diene compound, and (D) an inorganic filler; said Component (A), Component (B) and Component (C) being contained in amounts of 45 to 55 parts by weight, 55 to 45 parts by weight, and 25 to 35 parts by weight, respectively, each based on 100 parts by weight of total of Components (A) and (B), and said Component (C) being contained in an amount of 20 to 80 vol. %.

Abstract: In a film with metal foil of the present invention, a metal foil is stuck to the surface of a resin film via an adhesive layer. The adhesive is formed by crosslinking an acrylic polymer obtained by the copolymerization of a (meth)acrylic acid ester with a carboxyl group-containing radically polymerizable monomer, with a polyfunctional compound having a functional group reactive with the carboxyl group. The film with metal foil is very useful for producing a multi-layer wiring board by the so-called transfer method. By using this film, there can be produced a multi-layer wiring board having a fine and highly dense wiring/circuit layer and having a very excellently flat surface.

Abstract: Wiring substrate including an insulating substrate made of glass ceramics and having Young's modulus of 120 GPa or less, and a wiring circuit layer made of a high-purity metal conductor in concentration of 99% by weight or more formed on the surface of the insulating substrate and/or inside thereof. This wiring substrate may be a multi-layer wiring substrate that has a plurality of wiring circuit layers. The wiring circuit layer is preferably made of a metal foil.

Abstract: The present invention discloses a process for producing a dicyclopentadiene-modified unsaturated polyester. The process includes a first step of reacting a reaction mixture of maleic anhydride (MA) and water (H2O) with dicyclopentadiene (DCPD) and a second step of reacting the reaction product obtained in the first step with a polyhydric alcohol, or a polyhydric alcohol and a polybasic acid, to obtain an unsaturated polyester modified with dicyclopentadiene. In the first step of the process, (1) a molar ratio of water to dicyclopentadiene is greater than 1 and a molar ratio of maleic anhydride to dicyclopentadiene is 1.2 or more, (2) a molar ratio of water to maleic anhydride is 1 or less, or (3) both of the features (1) and (2) are satisfied. The present invention also discloses a polyester resin composition containing the modified unsaturated polyester and a radically polymerizable monomer, and a molding material containing the resin composition as a main component.

Abstract: A wiring board that incorporates electric element such as capacitor. The wiring board includes a dielectric substrate having electronic components mounting surface on the surface thereof, an electric element that is embedded in the dielectric substrate, a first conductive layer and a second conductive layer formed inside of the dielectric substrate, and via hole conductors that connect the first terminal electrode and the second terminal electrode of the electric element to the first conductive layer and the second conductive layer, respectively, and extend the surface of the dielectric substrate from the first and second conductive layers. In case both the first and the second terminal electrodes are provided in plurality, all of the plurality of first terminal electrodes are connected to the first conductive layer through the via hole conductors and all of the plurality of second terminal electrodes are connected to the second conductive layer through the via hole conductors.

Abstract: An electronic device mounting wiring board having an electronic device mounted on the surface of a wiring substrate or inside thereof is provided. The wiring substrate includes an insulation substrate made by laminating a plurality of insulation layers that include a thermosetting resin, a wiring circuit layer formed on the surface of and inside of the insulation substrate and via hole conductors. A resin layer having a glass transition temperature lower than the curing temperature of the thermosetting resin is formed between at least one of top and bottom surfaces of the electrical device and the insulation layer.

Abstract: A wiring board comprising an insulating substrate containing at least an organic resin, a plurality of electrically conducting wiring layers formed on the surface and/or inside of said insulting substrate, and via-hole conductors formed in said insulating substrate in order to electrically connect the plurality of electrically conducting wiring layers, wherein said via-hole conductors contain an organic binder as well as a Cu—Sn intermetallic compound as an electrically conducting component. The via-hole conductors formed in the wiring board exhibit a high electric conductivity and a large heat resistance, making it possible to very highly reliably connect the electrically conducting wiring layers together.