Abstract: An imaging apparatus includes a light source unit that selectively outputs white light and light in a different wavelength band to an observation target, an imaging unit including an imaging device, and a spectral image formation circuit that generates a spectral image signal for a specified wavelength by an operation using an image signal based on an output from the imaging unit and predetermined matrix data. The imaging unit selectively obtains an image of the observation target for each of first, second and third light components in a visible light region and an image for each of at least fourth and fifth light components in a near-infrared region. Further, the imaging unit includes first spectral devices that make only the first and fourth light components enter first pixels of the imaging device and second spectral devices that make only the second and fifth light components enter second pixels thereof.

Abstract: A system in-package test inspection apparatus for measuring and evaluating the high-speed/high frequency characteristic of a system in-package through an electrode pad in which I/O terminals are formed on one side of an LSI package containing metallic wiring internally and plural LSI chips are stacked in multiple layers on the other face while electric connection between the LSI chip and the LSI package and the electric connection between the LSI chips are implemented, the system in-package test inspection apparatus comprising: a printed wiring substrate to which the I/O terminals of the system in-package are connected to enable transmission of high speed and high frequency signals; LSI chip driving means for driving the LSI chip; a contact probe having a contact electrode and for transmitting a high frequency signal; evaluation signal generating means for supplying a high frequency evaluation signal to the contact probe; output signal detecting means for detecting an output signal of the system in-package th

Abstract: An interposer having multi-layer fine wiring structure which comprises an insulating layer made of photosensitive polyimide which is photosensitive organic material and a wiring layer portion made of metal, such as copper, silver, gold, aluminum, palladium, indium, titanium, tantalum, and niobium, functions as wiring in an integrated circuit chip, wherein junctions between the integrated circuit chip and the interposer are formed by micron to submicron size fine connection metal pads or bumps which are formed on both the integrated circuit chip and the interposer.

Abstract: A superconducting integrated circuit includes a substrate, a multilayer structure formed on the substrate and composed of a lower superconducting electrode, a tunnel barrier and an upper superconducting electrode sequentially joined together upward in the order mentioned, and an insulating layer perforated to form via holes to get electrical contacts with the lower and upper electrodes. The insulating layer is formed of a high-resolution, photosensitive, solvent-soluble, organic insulating material. The superconducting integrated circuit is produced by a method that includes the steps of depositing the multiplayer on the substrate, applying the insulating material to the front surface of the substrate inclusive of the multiplayer, forming the via holes in the insulating material by the lithographic technique at the prospective positions to get electrical contacts with the upper and lower electrodes, and laying wirings for connecting the upper and lower electrodes through the via holes.

Abstract: There is provided a contact probe that is smaller than 50 ?m in a pitch between a signal electrode and a ground electrode and can correctly conduct a high-speed high-frequency measurement, a measuring pad used for the contact probe, and a method of manufacturing the contact probe. The contact probe includes: a tip member having a signal electrode 10a and a ground electrode 11a that are put into contact with an object to be measured; and a coaxial cable 1 having a core 1b electrically connected to the signal electrode 10a and an outer covering conductor la electrically connected to the ground electrode 11a, wherein the tip member is formed on a printed wiring board 2, and wherein the signal electrode 10a and the ground electrode 11a are constructed of fine coplanar strip lines formed on an insulating board 2a.

Abstract: There is provided a contact probe that is smaller than 50 ?m in a pitch between a signal electrode and a ground electrode and can correctly conduct a high-speed high-frequency measurement, a measuring pad used for the contact probe, and a method of manufacturing the contact probe. The contact probe includes: a tip member having a signal electrode 10a and a ground electrode 11a that are put into contact with an object to be measured; and a coaxial cable 1 having a core 1b electrically connected to the signal electrode 10a and an outer covering conductor 1a electrically connected to the ground electrode 1a, wherein the tip member is formed on a printed wiring board 2, and wherein the signal electrode 10a and the ground electrode 11a are constructed of fine coplanar strip lines formed on an insulating board 2a.

Abstract: There is provided a contact probe that is smaller than 50 ?m in a pitch between a signal electrode and a ground electrode and can correctly conduct a high-speed high-frequency measurement, a measuring pad used for the contact probe, and a method of manufacturing the contact probe. The contact probe includes: a tip member having a signal electrode 10a and a ground electrode 11a that are put into contact with an object to be measured; and a coaxial cable 1 having a core 1b electrically connected to the signal electrode 10a and an outer covering conductor la electrically connected to the ground electrode 11a, wherein the tip member is formed on a printed wiring board 2, and wherein the signal electrode 10a and the ground electrode 11a are constructed of fine coplanar strip lines formed on an insulating board 2a.

Abstract: There is provided a contact probe that is smaller than 50 ?m in a pitch between a signal electrode and a ground electrode and can correctly conduct a high-speed high-frequency measurement, a measuring pad used for the contact probe, and a method of manufacturing the contact probe. The contact probe includes: a tip member having a signal electrode 10a and a ground electrode 11a that are put into contact with an object to be measured; and a coaxial cable 1 having a core 1b electrically connected to the signal electrode 10a and an outer covering conductor 1a electrically connected to the ground electrode 1a, wherein the tip member is formed on a printed wiring board 2, and wherein the signal electrode 10a and the ground electrode 11a are constructed of fine coplanar strip lines formed on an insulating board 2a.

Abstract: A system in-package test inspection apparatus for measuring and evaluating the high-speed/high frequency characteristic of a system in-package through an electrode pad in which I/O terminals are formed on one side of an LSI package containing metallic wiring internally and plural LSI chips are stacked in multiple layers on the other face while electric connection between the LSI chip and the LSI package and the electric connection between the LSI chips are implemented, the system in-package test inspection apparatus comprising: a printed wiring substrate to which the I/O terminals of the system in-package are connected to enable transmission of high speed and high frequency signals; LSI chip driving means for driving the LSI chip; a contact probe having a contact electrode and for transmitting a high frequency signal; evaluation signal generating means for supplying a high frequency evaluation signal to the contact probe; output signal detecting means for detecting an output signal of the system in-package th

Abstract: A mouthpiece for use in upper endoscopy, including a main body of generally tubular shape internally providing a passage for receiving an endoscopic insertion tube and having a teeth support portion on the outer periphery of the passage portion. The internal passage in the main body is provided with a partition plate, thereby dividing the internal passage into an upper passage for introduction of an endoscopic insertion tube and a lower passage adapted to receive and hold a patient's tongue in such a way to restrict its movements.

Abstract: A superconducting integrated circuit includes a substrate, a multilayer structure formed on the substrate and composed of a lower superconducting electrode, a tunnel barrier and an upper superconducting electrode sequentially joined together upward in the order mentioned, and an insulating layer perforated to form via holes to get electrical contacts with the lower and upper electrodes. The insulating layer is formed of a high-resolution, photosensitive, solvent-soluble, organic insulating material. The superconducting integrated circuit is produced by a method that includes the steps of depositing the multiplayer on the substrate, applying the insulating material to the front surface of the substrate inclusive of the multiplayer, forming the via holes in the insulating material by the lithographic technique at the prospective positions to get electrical contacts with the upper and lower electrodes, and laying wirings for connecting the upper and lower electrodes through the via holes.

Abstract: A superconducting integrated circuit includes a substrate, a multilayer structure formed on the substrate and composed of a lower superconducting electrode, a tunnel barrier and an upper superconducting electrode sequentially joined together upward in the order mentioned, and an insulating layer perforated to form via holes to get electrical contacts with the lower and upper electrodes. The insulating layer is formed of a high-resolution, photosensitive, solvent-soluble, organic insulating material. The superconducting integrated circuit is produced by a method that includes the steps of depositing the multiplayer on the substrate, applying the insulating material to the front surface of the substrate inclusive of the multiplayer, forming the via holes in the insulating material by the lithographic technique at the prospective positions to get electrical contacts with the upper and lower electrodes, and laying wirings for connecting the upper and lower electrodes through the via holes.

Abstract: An interposer having multi-layer fine wiring structure which comprises an insulating layer made of photosensitive polyimide which is photosensitive organic material and a wiring layer portion made of metal, such as copper, silver, gold, aluminum, palladium, indium, titanium, tantalum, and niobium, functions as wiring in an integrated circuit chip, wherein junctions between the integrated circuit chip and the interposer are formed by micron to submicron size fine connection metal pads or bumps which are formed on both the integrated circuit chip and the interposer.

Abstract: A superconducting integrated circuit includes a substrate, a multilayer structure formed on the substrate and composed of a lower superconducting electrode, a tunnel barrier and an upper superconducting electrode sequentially joined together upward in the order mentioned, and an insulating layer perforated to form via holes to get electrical contacts with the lower and upper electrodes. The insulating layer is formed of a high-resolution, photosensitive, solvent-soluble organic insulating material. The superconducting integrated circuit is produced by a method Eat includes the steps of depositing the multiplayer on the substrate, applying the insulating material to the front surface of the substrate inclusive of the multiplayer, forming the via holes in the insulating material by the lithographic technique at the prospective positions to get electrical contacts with the upper and lower electrodes, and laying wirings for connecting the upper and lower electrodes through the via holes.

Abstract: An endoscope in which moving and still picture image pickup operations are alternatively carried out, and a light source emits either a continuous light or a pulsed light in the moving or still picture image pickup operations, a detector detects illuminances of moving and still picture images in the moving and still picture image pickup operations to obtain an illuminance ratio between the moving and still picture images, and the illuminance ratio is adjusted to a certain value by an adjuster on the basis of the illuminance ratio detected by the detector.

Abstract: A oil strainer device for an automatic transmission has an oil strainer with an oil suction, an oil supplying port, and an oil strainer, an opening portion formed in the transmission case, and a cover mounted on an opening portion for holding the strainer. The strainer has a meshed filter and a filter supporting plate with ribs forming lattice and is arc-shaped in cross section.

Abstract: In an electronic endoscope system, an endoscopically-processed endoscopic image such as a color-enhanced endoscopic image is photographed with a simple operation.

Abstract: In an electronic endoscope apparatus, a region having an over exposure level within a functional image of a biological body under medical examination is detected and displayed, such as a hemoglobin concentration distribution image superimposed thereon. The electronic endoscope apparatus includes a unit for processing a functional information image signal so as to detect a region having an exposure level exceeding over an allowable maximum exposure level, and for superimposing the region having the over-exposure level on the functional information image signal; and, a monitor for displaying both a functional information image and the over-exposure region superimposed thereon based upon the functional information image signal and the detected over-exposure region.

Abstract: An endoscope including a scope, in which a light source emits at least one light pulse locating in a boundary portion of adjacent first and second fields, and a photoelectric device detects image signals from the light pulse, and wherein a processor determines a difference between first and second field illuminances of the light pulse from the image signals, and a controller controls, depending on the difference, to reduce the difference to at least a certain value to obtain a frozen picture image having a high resolving power without causing a flicker therein.

Abstract: An endoscope including a light source for generating light beams having difference wavelengths to an object in an internal organ such as the stomach and the intestines of a subject, in which picture signals are picked up by a pickup device such as an optoelectronic device from the object radiated with the light beams, in which correction signals such as reference picture signals for correcting sensitivities of the light source and the pickup device depending on the different wavelengths of the light beams are picked up by the pickup device from a reference member such as a reference white plate radiated with the same light beams, and in which a bloodstream amount and an oxygen saturation rate are operated from the picture signals and the correction signals. The bloodstream amount and the oxygen saturation rate may be displayed on a display. The correction signals may be picked up outside the body of the subject.