Abstract: A method of manufacturing a surface shape recognition sensor. A sacrificial film is formed on an interlevel dielectric to cover a lower electrode while keeping an upper portion of a support electrode exposed. An upper electrode is formed on the sacrificial film and support electrode. The sacrificial film is selectively removed and a protective film is formed on the upper electrode. A photosensitive resin film having photosensitivity is formed on the protective film. A plurality of projections are formed in a region of the protective film above a capacitive detection element. In this manner a plurality of capacitive detection elements each having the lower electrode and upper electrode are formed.

Abstract: A sensor cell includes a sensor electrode (101) formed on a substrate (100), a signal output unit (16) which outputs a signal corresponding to a capacitance (Cf) formed between the sensor electrode and the surface of a finger (3), a high-sensitivity electrode (103) formed on the substrate so as to be insulated and isolated from the sensor electrode, and a potential controller (14) which controls the potential of the finger surface via a capacitance (Cc) formed between the high-sensitivity electrode and the finger surface by controlling the potential of the high-sensitivity electrode. In this arrangement, when the resistance of the finger is high, the potential of the finger surface can be controlled so as not to fluctuate with the potential change of the sensor electrode.

Abstract: A master latch (1) is formed from a static circuit, and a slave latch (2) is formed from a dynamic circuit. The number of circuit elements can be smaller as compared to a slave latch formed from a static circuit so that the size and area of a master-slave flip-flop can be reduced. Since the master latch is formed from a static circuit, data can be held stably during the standby time by setting the master latch in a data holding state.

Abstract: A structure (113b) which includes an overhang and a support portion supporting substantially the center of the overhang, and in which the area of the support portion is smaller than the area of the overhang in the two-dimensional direction of an upper electrode (1110b) is formed on the upper electrode (110a) in a region above each lower electrode 105a in one-to-one correspondence with the lower electrode (105a). An object of surface shape sensing, e.g., the tip of a finger (1602) touches the surface of the overhang of the structure (113b), and the support portion of the structure (113b) whose overhang is in contact with the object of sensing pushes down a portion of the upper electrode (110a) toward the lower electrode (105a), thereby deforming the upper electrode (110a).

Abstract: In a semiconductor device having a MEMS according to this invention, a plurality of units having movable portions for constituting a MEMS are monolithically mounted on a semiconductor substrate on which an integrated circuit including a driving circuit, sensor circuit, memory, and processor is formed. Each unit has a processor, memory, driving circuit, and sensor circuit.

Abstract: A structure (113b) which includes an overhang and a support portion supporting substantially the center of the overhang, and in which the area of the support portion is smaller than the area of the overhang in the two-dimensional direction of an upper electrode (110b) is formed on the upper electrode (110a) in a region above each lower electrode 105a in one-to-one correspondence with the lower electrode (105a). An object of surface shape sensing, e.g., the tip of a finger (1602) touches the surface of the overhang of the structure (113b), and the support portion of the structure (113b) whose overhang is in contact with the object of sensing pushes down a portion of the upper electrode (110a) toward the lower electrode (105a), thereby deforming the upper electrode (110a).

Abstract: In a micromachine according to this invention, a polyimide film is formed on the surface of each electrode. The polyimide film is formed as follows. A substrate having each electrode and a counterelectrode are dipped in an electrodeposition polyimide solution, and a positive voltage is applied to the electrode. A material dissolved in the electrodeposition polyimide solution is deposited on a surface of the positive-voltage-applied electrode that is exposed in the solution, thus forming a polyimide film on the surface.

Abstract: An image collation apparatus includes a collation unit, minimum coincidence ratio extraction unit, and determination unit. The collation unit obtains a coincidence ratio between first and second images within a printing element range for each collation unit by collating the first and second images with each other. The minimum coincidence ratio extraction unit obtains a minimum coincidence ratio from coincidence ratios obtained from the collation unit. The determination unit determines that the first and second images are identical, if the extracted minimum coincidence ratio is smaller than a predetermined threshold. An image collation method is also disclosed.

Abstract: A surface shape recognition sensor includes capacitive detection elements, support electrode, protective film, and projections. The detection elements are formed from lower electrodes and a deformable plate-like upper electrode made of a metal. The lower electrodes are insulated and isolated from each other and stationarily laid out on a single plane of an interlevel dielectric formed on a semiconductor substrate. The upper electrode is laid out above the lower electrodes at a predetermined interval and has opening portions. The support electrode is laid out around the lower electrodes while being insulated and isolated from the lower electrodes, and formed to be higher than the lower electrodes to support the upper electrode. The protective film is formed on the upper electrode to close the opening portions. The projections per one pixel are laid out in a region of the protective film above the capacitive detection element.

Abstract: A calibration mode signal line to which sensor cells are commonly connected is arranged. In a calibration mode, a calibration mode signal is supplied to the sensor cells through the calibration mode signal line to designate calibration. In each sensor cell, when the calibration mode signal is being supplied from the calibration mode signal line, and the sensor cell is selected by the decoder, calibration operation of adjusting the detection sensitivity of a sensor circuit is executed using a calibration circuit.

Abstract: In a semiconductor device having a MEMS according to this invention, a plurality of units having movable portions for constituting a MEMS are monolithically mounted on a semiconductor substrate on which an integrated circuit including a driving circuit, sensor circuit, memory, and processor is formed. Each unit has a processor, memory, driving circuit, and sensor circuit.

Abstract: Prior to the start of transfer of an insulation film to a substrate, the degree of opening of a butterfly valve is set small so that evaporation of a solvent component contained in the insulation film is suppressed and the fluidity of the insulation film is ensured at the start of the transfer. On the other hand, the butterfly valve is totally opened at the start of the transfer, so that the pressure inside a thin film forming chamber rapidly decreases and transfer of the insulation film to the substrate is performed always in a low-pressure state (high-degree of vacuum).

Abstract: In a method of manufacturing a surface shape recognition sensor, first and second interconnections are formed on a semiconductor substrate. An interlayer dielectric film on the semiconductor substrate covers the interconnections. A first metal film is electrically connected to the interconnections through first and second through holes in the interlayer dielectric film. A first mask pattern on the first metal film covers predetermined first and second regions corresponding to the through holes, respectively. The exposed first metal film is selectively removed to form a sensor electrode and connection electrode film, formed of the first metal film, in the first and second regions, respectively. An insulating passivation film on the interlayer dielectric film covers the sensor electrode and connection electrode film. A third through hole in the passivation film reaches the connection electrode film. A second metal film on the passivation film is in contact with the exposed connection electrode film.

Abstract: An image collation apparatus includes a collation unit, minimum coincidence ratio extraction unit, and determination unit. The collation unit obtains a coincidence ratio between first and second images within a printing element range for each collation unit by collating the first and second images with each other. The minimum coincidence ratio extraction unit obtains a minimum coincidence ratio from coincidence ratios obtained from the collation unit. The determination unit determines that the first and second images are identical, if the extracted minimum coincidence ratio is smaller than a predetermined threshold. An image collation method is also disclosed.

Abstract: A first control potential setting means (1) generates a first control potential (N2) which reverses the magnitude relationship with a second control potential (N3) when an input signal (IN) reaches the vicinity of a logical threshold value. A second control potential setting means (2) generates the second control potential (N3) which changes in the same direction as the input signal (IN), in accordance with a change in input signal (IN). An output means (3) includes transistors (Q5, Q6), and generates an output signal (OUT) having a predetermined potential on the basis of the first control potential (N2), the second control potential (N3), and a reset signal (RSET). A reset means (4) turns off the transistor (Q6) while a waveform shaping circuit is in operation.

Abstract: Prior to the start of transfer of an insulation film to a substrate, the degree of opening of a butterfly valve is set small so that evaporation of a solvent component contained in the insulation film is suppressed and the fluidity of the insulation film is ensured at the start of the transfer. On the other hand, the butterfly valve is totally opened at the start of the transfer, so that the pressure inside a thin film forming chamber rapidly decreases and transfer of the insulation film to the substrate is performed always in a low-pressure state (high-degree of vacuum).

Abstract: A structure (113b) which includes an overhang and a support portion supporting substantially the center of the overhang, and in which the area of the support portion is smaller than the area of the overhang in the two-dimensional direction of an upper electrode (110b) is formed on the upper electrode (110a) in a region above each lower electrode 105a in one-to-one correspondence with the lower electrode (105a). An object of surface shape sensing, e.g., the tip of a finger (1602) touches the surface of the overhang of the structure (113b), and the support portion of the structure (113b) whose overhang is in contact with the object of sensing pushes down a portion of the upper electrode (110a) toward the lower electrode (105a), thereby deforming the upper electrode (110a).

Abstract: A response signal generating unit (3) applies a predetermined supply signal (2S) to a detection element (1) and outputs, as a response signal (3S), a signal which has changed in accordance with the impedance of an object (10) with which the unit is in contact through the detection element (1). A waveform information detection unit (4) detects waveform information corresponding to the impedance of the object (10) on the basis of the response signal (3S) from the response signal generating unit (3), and outputs a detection signal (4S) representing the waveform information. A biometric recognition unit (5) determines on the basis of the detection signal (4S) from the waveform information detection unit (4) whether or not the object (10) is a living body.

Abstract: In a micromachine according to this invention, a polyimide film is formed on the surface of each electrode. The polyimide film is formed as follows. A substrate having each electrode and a counterelectrode are dipped in an electrodeposition polyimide solution, and a positive voltage is applied to the electrode. A material dissolved in the electrodeposition polyimide solution is deposited on a surface of the positive-voltage-applied electrode that is exposed in the solution, thus forming a polyimide film on the surface.

Abstract: A row decoding circuit (171) outputs a select signal to a row set in a row range setting unit (172) to select a select signal line (103), processing results from processing circuits (102) on this row are output to a data output line (104), and a row adder (106) adds processing results output to a data output line (104) of a column set in a column range selector (105).