Abstract: A system and method for monitoring a subject are presented. The system includes a sensing device including at least one magnetic source to generate a magnetic field and an array of magnetic sensors disposed within the magnetic field. The sensor array obtains a plurality of magnetic field measurements at a plurality of locations along a vessel carrying a fluid including one or more magnetic particles. Further, the system includes a processing subsystem communicatively coupled to the sensing device, where the processing subsystem determines variations in the measurements caused by magnetization-relaxation of the magnetic particles based on a coupled model that defines behavior of the fluid in the varying magnetic field based on principles of magnetization-relaxation, bulk motion of the magnetic particles towards a determined gradient of the magnetic field, magnetostatics, and conservation of momentum. The processing subsystem estimates values of one or more desired parameters based on the determined variations.

Abstract: Composite foams are provided including a metal template and a conformal atomic-scale film disposed over such metal template to form a 3-dimensional interconnected structure. The metal template includes a plurality of sintered interconnects, having a plurality of first non-spherical pores, a first non-spherical porosity, and a first surface-area-to-volume ratio. The conformal atomic-scale film has a plurality of second non-spherical pores, a second non-spherical porosity, and a second surface-area-to-volume ratio approximately equal to the first surface-area-to-volume ratio. The plurality of sintered interconnects has a plurality of dendritic particles and the conformal atomic-scale film includes at least one of a layer of graphene and a layer of hexagonal boron nitride.

Abstract: A system is provided for monitoring strain in a substrate using a strain sensor element within a fiber optic sensing cable. Accurate and rapid measurement of strain of remote substrates presents major technical challenges and is the focus of much of the description presented. However, systems, methods and devices provided by the present invention are not only capable of reliably measuring strain in real time, but are also capable of measuring other characteristics of a substrate such as its temperature, pressure and its acoustic characteristics. The system is configured such that a strain sensor element within a strain sensing zone detects substantially the true strain characteristics of the substrate. And while other sensing elements within the same fiber optic sensing cable may not be configured to detect substrate strain at all, these sensing elements may reliably measure the temperature and pressure at the surface of the substrate adjacent to the strain sensing zone.

Abstract: A medical reference and registration system includes a substrate configured for placement on an external surface of a patient such that the substrate conforms to and moves with the external surface of the patient. The medical reference and registration system also includes multiple integrated sensor-fiducial marker devices mounted on the substrate. Each integrated sensor-fiducial marker device includes a sensor and at least one fiducial marker coupled to the sensor. Each sensor is pre-aligned with respect to the at least one fiducial marker so that a location of each fiducial marker is known with respect to its respective sensor.

Abstract: A method of fabricating a microelectronic device structure including increased thermal dissipation capabilities. The structure including a three-dimensional (3D) integrated chip assembly that is flip chip bonded to a substrate. The chip assembly including a device substrate including an active device disposed thereon. A cap layer is physically bonded to the device substrate to at least partially define a hermetic seal about the active device. The microelectronic device structure provides a plurality of heat dissipation paths therethrough to dissipate heat generated therein.

Abstract: A position and orientation system and method is provided. A magnetoresistance sensor is provided having a sensor array configured to measure magnetic fields and a metallic coil positioned within the magnetoresistance sensor. In certain embodiments, the magnetic coil may be used to generate a known magnetic field that, when measured by the sensor array, may be used to determine or update a calibration constant for the system.

Abstract: A method of fabricating a microelectronic device structure including increased thermal dissipation capabilities. The structure including a three-dimensional (3D) integrated chip assembly that is flip chip bonded to a substrate. The chip assembly including a device substrate including an active device disposed thereon. A cap layer is physically bonded to the device substrate to at least partially define a hermetic seal about the active device. The microelectronic device structure provides a plurality of heat dissipation paths therethrough to dissipate heat generated therein.

Abstract: A microelectronic device structure including increased thermal dissipation capabilities. The structure including a three-dimensional (3D) integrated chip assembly that is flip chip bonded to a substrate. The chip assembly including a device substrate including an active device disposed thereon. A cap layer is physically bonded to the device substrate to at least partially define a hermetic seal about the active device. The microelectronic device structure provides a plurality of heat dissipation paths therethrough to dissipate heat generated therein.

Abstract: In one embodiment, a transducer apparatus comprises an elastomeric substrate and another elastomeric substrate. A plurality of transducer modules are mounted on the elastomeric substrate. A plurality of additional transducer modules are mounted on the other elastomeric substrate. Each transducer module of the plurality of transducer modules and the plurality of additional transducer modules comprises a transducer array having multiple transducer elements and an electronic circuitry coupled to the transducer array. The plurality of transducer modules and the plurality of additional transducer modules are mounted relative to each other whereby the plurality of additional transducer modules substantially cover any dead zones of the plurality of transducer modules.

Abstract: A sensor assembly is provided for use in tracking a medical device. The sensor assembly comprises a magnetoresistance sensor capable of providing position and orientation information. In certain implementations, the magnetoresistance position and orientation sensor is originally configured for connection to a substrate using one type of interconnect approach but is modified to be connected using a different interconnect approach.

Abstract: A medical reference and registration system includes a substrate configured for placement on an external surface of a patient such that the substrate conforms to and moves with the external surface of the patient. The medical reference and registration system also includes multiple integrated sensor-fiducial marker devices mounted on the substrate. Each integrated sensor-fiducial marker device includes a sensor and at least one fiducial marker coupled to the sensor. Each sensor is pre-aligned with respect to the at least one fiducial marker so that a location of each fiducial marker is known with respect to its respective sensor.

Abstract: A sensor assembly is provided for use in tracking a medical device. The sensor assembly comprises a magnetoresistance sensor capable of providing position and orientation information. In certain implementations, the magnetoresistance position and orientation sensor is originally configured for connection to a substrate using one type of interconnect approach but is modified to be connected using a different interconnect approach.

Abstract: A flexible wire assembly includes a plurality of elongated conductors and insulators each having a quadrilateral cross section and alternatingly laminated together, the flexible wire assembly having a wire width measured across the conductor and insulators, a wire height equivalent to the height of the conductors and insulators, and a wire length which is measured in a longitudinal direction orthogonal to the wire width and the wire height, wherein the wire length is one or more orders of magnitude greater than the wire width and the wire height; and a first device comprising a plurality of bond pads spaced to define a bond pad pitch, wherein the flexible wire assembly is coupled to the first device at the bond pads such that spacing of the conductor conductors is matched to the bond pad pitch.

Abstract: An optical article comprising a plurality of optically detectable marks disposed on a surface of the optical article; a removable electrical device disposed on the surface of the optical article; wherein the electrical device is operatively coupled to the optical article; and wherein the electrical device is configured to interact with an activation signal when brought in direct contact with a communication device that applies the activation signal to the electrical device. A removable electrical device is also provided. A system and a method for activation are also provided.

Abstract: In one embodiment, a transducer apparatus comprises an elastomeric substrate and another elastomeric substrate. A plurality of transducer modules are mounted on the elastomeric substrate. A plurality of additional transducer modules are mounted on the other elastomeric substrate. Each transducer module of the plurality of transducer modules and the plurality of additional transducer modules comprises a transducer array having multiple transducer elements and an electronic circuitry coupled to the transducer array. The plurality of transducer modules and the plurality of additional transducer modules are mounted relative to each other whereby the plurality of additional transducer modules substantially cover any dead zones of the plurality of transducer modules.

Abstract: A microelectronic device structure including increased thermal dissipation capabilities. The structure including a three-dimensional (3D) integrated chip assembly that is flip chip bonded to a substrate. The chip assembly including a device substrate including an active device disposed thereon. A cap layer is phsyically bonded to the device substrate to at least partially define a hermetic seal about the active device. The microelectronic device structure provides a plurality of heat dissipation paths therethrough to dissipate heat generated therein.

Abstract: A method includes supplying current to at least one photovoltaic device via a current source and detecting emitted photon radiations from the at least one photovoltaic device via a radiation detector. The method also includes outputting a signal corresponding to the detected emitted photon radiations from the radiation detector to a processor device, and processing the signal corresponding to the detected emitted photon radiations via the processor device to generate one or more two-dimensional photon images. The method further includes analyzing the one or more two-dimensional photon images to determine at least one defect in the at least one photovoltaic device.

Abstract: An activation system for optical media in one embodiment includes a tag having at least one pair of conductors with at least one heating element coupled to the conductors. The heating element is oriented proximate one or more activation regions on the optical media, and wherein the heating element activates the optical media. The tag in one embodiment is an elongate flexible tag material with a number of conductors that couple on one end to heating elements wherein the heating elements are disposed within a media case such that they are proximate activation regions on a media article.

Abstract: A method of changing a functionality of an optical article is provided. The method includes exposing the optical article to an external stimulus. The optical article includes an electrically responsive layer being configured to transform from a first optical state to a second optical state upon exposure to the external stimulus. The electrically responsive layer is configured to transform from a first optical state to a second optical state upon exposure to an external stimulus, and is capable of irreversibly transforming the optical article from the pre-activated state of functionality to the activated state of functionality.

Abstract: An electrically responsive ink composition comprising at least one electrically responsive optical-state change material, at least one electrolyte material, at least one solvent, and at least one binder material, wherein the ink composition has a viscosity between about 0.1 centipoise and about 10,000 centipoise, and a maximum optical absorbance in a range from about 200 nanometers to about 800 nanometers; and wherein the ink composition is capable of transforming from a first optical state to a second optical state upon exposure to an electrical stimulus. The electrically responsive ink composition may be used to deposit an electrically responsive coating composition, which may be used as part of an anti-theft system for optical articles. Articles comprising electrically responsive coating compositions are also disclosed, as are methods for activation.