Abstract: A method includes supplying current to at least one photovoltaic device via a current source and detecting emitted photon radiations from the at least one photovoltaic device via a radiation detector. The method also includes outputting a signal corresponding to the detected emitted photon radiations from the radiation detector to a processor device, and processing the signal corresponding to the detected emitted photon radiations via the processor device to generate one or more two-dimensional photon images. The method further includes analyzing the one or more two-dimensional photon images to determine at least one defect in the at least one photovoltaic device.

Abstract: An optical article comprising at least one data side and configured for transformation from a pre-activated state of functionality to an activated state of functionality is provided. The optical article includes an optical data layer for storing data. Furthermore, the optical article includes an electrically responsive layer having a first surface and a second surface, wherein the electrically responsive layer is characterized by an optical absorbance in the range of about 200 nm to about 800 nm. The electrically responsive layer being configured to transform from a first optical state to a second optical state upon exposure to an external stimulus, and being capable of irreversibly transforming the optical article from the pre-activated state of functionality to the activated state of functionality. The electrically responsive layer includes a binder polymeric material, an electrically responsive material, and an electrolyte.

Abstract: A thermal management system includes graphene paper disposed between a heat source and a heat sink to transfer heat therebetween. The graphene paper is oriented such that the individual layers are substantially perpendicular to the plane of the heat source and the plane of the heat sink to maximize heat transfer. The heat source and the heat sink can be any physical structure that emits and absorbs thermal energy, respectively. The graphene paper may be bonded to the heat source and the heat sink using a bonding agent, such as a thermally conductive material, and the like. The graphene paper may be formed in several different configurations, such as a spring structure, and the like.

Abstract: An activation system for optical media in one embodiment includes a tag having at least one pair of conductors with at least one heating element coupled to the conductors. The heating element is oriented proximate one or more activation regions on the optical media, and wherein the heating element activates the optical media. The tag in one embodiment is an elongate flexible tag material with a number of conductors that couple on one end to heating elements wherein the heating elements are disposed within a media case such that they are proximate activation regions on a media article.

Abstract: A packaging for an optical article comprises an electrical device configured to be in contact with the optical article; and an electrical circuit element configured to interact with an activation signal provided by a communication device configured to interact with the electrical device. A system and a method of packaging are also provided.

Abstract: An optical article comprising a plurality of optically detectable marks disposed on a surface of the optical article; a removable electrical device disposed on the surface of the optical article; wherein the electrical device is operatively coupled to the optical article; and wherein the electrical device is configured to interact with an activation signal when brought in direct contact with a communication device that applies the activation signal to the electrical device. A removable electrical device is also provided. A system and a method for activation are also provided.

Abstract: A semiconductor assembly includes a semiconductor wafer including backside contact pads coupled to respective contact regions of different signal types and insulation separating the backside contact regions by signal type. The semiconductor assembly further includes metallization situated over at least a portion of the insulation and interconnecting the backside contact pads.