Abstract: The present invention provides a liquid crystalline polyester resin composition which imparts a good mold-releasability during molding and further is improved in heat resistance. Specifically, with 100 parts by weight of a liquid crystalline polyester resin is added 0.001 to 1 part by weight of a fatty acid ester which is a tetraester of pentaerythritol and a C10 to C32 higher fatty acid and has an acid value ranging from 0.01 to 0.5 and a hydroxyl value ranging from 0.01 to 5.

Abstract: A solid-state imaging device according to an embodiment of the present invention includes plural pixels, in which each pixel includes: a transfer transistor that transfers electric charge from a photoelectric conversion section to a floating diffusion section; a reset transistor that resets the floating diffusion section; a amplifying transistor that outputs a signal based on the electric charge held by the floating diffusion section; a selection transistor that is provided at the output side of the amplifying transistor and selects a pixel; and a charge storage capacitor that is provided between the amplifying transistor and the selection transistor and stores the quantity of electric charge on the basis the quantity of the electric charge held by the floating diffusion section through the charge-discharge behavior of electric charge through a current source.

Abstract: A solid-state imaging device having unit pixels arranged therein is provided, each unit pixel including: a transfer transistor configured to transfer a charge from a photoelectric conversion part to a floating diffusion part; a first reset transistor configured to reset the floating diffusion part; a charge storage capacitor; a charging transistor configured to charge the charge storage capacitor by a current corresponding to a charge in the floating diffusion part; a second reset transistor configured to reset the charge storage capacitor; an amplifying transistor configured to output an electric signal corresponding to a charge in the charge storage capacitor; and a selection transistor configured to selectively cause the amplifying transistor to be in an operation state.

Abstract: The present invention provides a very thin planar connector having 2 mm or smaller pitch interval at the lattice area and 0.5 mm or smaller thickness of the lattice area, giving excellent performance in the whole performances such as moldability, flatness, warp-deformation, and heat resistance. A planar connector having a lattice structure within an outer frame is molded by using (C) a resin composition prepared by compounding (A) a liquid-crystalline polymer with (B) a fibrous filler, while the relation between the compounding quantity and the weight-average length of (B) the fibrous filler is controlled to a specified range.

Abstract: A solid-state imaging device includes: a pixel region in which a plurality of pixels composed of a photoelectric conversion section and a pixel transistor is arranged; an on-chip color filter; an on-chip microlens; and a multilayer interconnection layer in which a plurality of layers of interconnections is formed through an interlayer insulating film. The solid-state imaging device further includes a light-shielding film formed through an insulating layer in a pixel boundary of a light receiving surface in which the photoelectric conversion section is arranged.

Abstract: An object of the present invention is to economically produce a resin composition pellet with the degradation of resin suppressed, by using an ordinary extruder, the resin composition pellet being filled with a desired filling amount of a uniformly compounded fibrous filler, and having a required weight average fiber length, in particular, to produce a resin composition pellet used for a socket of a planar socket pin in which the pitch interval of a lattice area of a semiconductor device is 2.0 mm or less, the thickness of the lattice area is 0.5 mm or less, and the height of the socket is 5.0 mm or less.

Abstract: The present invention provides a thermoplastic resin composition having high flowability, has high dimensional stability like being free from deformation after molding, shows excellent rigidity, impact resistance, and heat resistance, and is suitable for thin-wall molded article. Specifically the thermoplastic resin composition is composed of: 100 parts by weight of a resin composition structured by (A) 91 to 99% by weight of a thermoplastic resin having a specified melt viscosity and (B) 1 to 9% by weight of a liquid crystalline polymer; and 0.001 to 2 parts by weight of (C) a specified phosphorus oxo acid monoester or diester, wherein the (B) liquid crystalline polymer is dispersed as particles, and the ratio of the melt viscosity of (A) component to (B) component is within a specified range. The present invention also provides a liquid crystal display component and an information recording media component.

Abstract: For equalizing the rising and falling operating speeds in a CMOS circuit, it is necessary to make the areas of a p-type MOS transistor and an n-type MOS transistor different from each other due to a difference in carrier mobility therebetween. This area unbalance prevents an improvement in integration degree of semiconductor devices. The NMOS transistor and the PMOS transistor each have a three-dimensional structure with a channel region on both the (100) plane and the (110) plane so that the areas of the channel regions and gate insulating films of both transistors are equal to each other. Accordingly, it is possible to make the areas of the gate insulating films and so on equal to each other and also to make the gate capacitances equal to each other. Further, the integration degree on a substrate can be improved twice as much as that in the conventional technique.

Abstract: The present invention provides a very thin planar connector having 2 mm or smaller pitch interval at the lattice area and 0.5 mm or smaller thickness of the lattice area, giving excellent performance in the whole performances such as moldability, flatness, warp-deformation, and heat resistance. A planar connector having a lattice structure within an outer frame is molded by using (C) a resin composition prepared by compounding (A) a liquid-crystalline polymer with (B) a fibrous filler, while the relation between the compounding quantity and the weight-average length of (B) the fibrous filler is controlled to a specified range.

Abstract: An object of the present invention is to economically produce a resin composition pellet with the degradation of resin suppressed, by using an ordinary extruder, the resin composition pellet being filled with a desired filling amount of a uniformly compounded fibrous filler, and having a required weight average fiber length, in particular, to produce a resin composition pellet used for a socket of a planar socket pin in which the pitch interval of a lattice area of a semiconductor device is 2.0 mm or less, the thickness of the lattice area is 0.5 mm or less, and the height of the socket is 5.0 mm or less.

Abstract: The object is to provide a liquid crystalline polymer material having good moldability, excellent flatness, warp-deformation resistance, and heat-resistance, and securing performance balance. A specified quantity of mica and a fibrous filler is added to a liquid crystalline polyester resin prepared by combining a 2-hydroxy-6-naphthoic acid unit and a 4-hydroxybenzoic acid unit at a specifically limited ratio.

Abstract: The object is to provide a method for manufacturing liquid crystalline resin composition having a hollow filler and a fibrous filler using a common melting-kneading extruder to maintain well-balanced relation between the residual percentages of hollow filler and the fiber length, which balance could not be attained in the prior art. A liquid crystalline resin composition having 5 to 30% by weight of hollow filler and 5 to 30% by weight of fibrous filler is manufactured using a melting-kneading extruder provided with a screw. (1) The liquid crystalline resin is fed from a main feed port located at upstream side in the extruding direction, while a hollow filler and a fibrous filler are fed from a side feed port located at downstream side in the extruding direction.

Abstract: To provide a thermoplastic polyester resin composition which has a very good durability to alkaline solutions for a long period of time. That is, a thermoplastic polyester resin composition, wherein a thermoplastic polyester resin (A) is compounded with 1-25% by weight (in the total composition) of impact resistance rendering materials (B), 0.1-15% by weight (in the total composition) of a silicone compound and/or a fluorine compound (C), 1-50% by weight (in the total composition) of an inorganic filler (D), and 0.1-10% by weight of at least one polyfunctional compound (E) selected from the group consisting of an epoxy compound, an isocyanate compound and a carboxylic acid dianhydride. A molded article of the present invention has anti-stress properties even in a weld part thereof.

Abstract: A semiconductor memory incorporating an operation circuit for carrying out logical operations on data and arithmetic operations on address signals. The memory is arranged functionally so that the data representing the result of each of such operations is written to a memory array while also being output through an external terminal in the same memory cycle.

Abstract: A heat exchanger apparatus includes a cylindrical-shaped heat exchanger formed by alternately laminating first and second elements in the circumferential direction of the cylindrical-shaped heat exchanger. The cylindrical-shaped heat exchanger is rotated to carry out the function of the conventional regenerative rotary type total heat exchanger. In addition, the first and second elements are also allowed to effect a heat exchange or total heat exchange operation. The cylindrical-shaped heat exchanger is either hollow or solid, which provides many variations in arrangement of air ducts for primary and secondary air flows. Further, a partition interposed between the first and second elements has variation in property: permeable to water vapor; non-permeable to water vapor as well as non-hygroscopic; and so forth. The first and second elements exchange heat with each other in a total heat exchange operation mode and a sensible heat exchange operation mode.