Abstract: In a semiconductor device, a first semiconductor substrate includes a first element on a first-surface side thereof, and a second semiconductor substrate includes a second element and a wiring part on a first-surface side thereof. The first semiconductor substrate and the second semiconductor substrate are attached with each other in such a manner that a first surface of the first semiconductor substrate is opposite a first surface of the second semiconductor substrate. A hole is provided from a second surface of the first semiconductor substrate to the wiring part through the first semiconductor substrate, and a sidewall of the hole is insulated. A drawing wiring part made of a conductive member fills the hole.

Abstract: A separating device for separating a semiconductor substrate includes: a cutting element for cutting the semiconductor substrate into a plurality of chips along with a cutting line on the semiconductor substrate; an adsorbing element for adsorbing a dust on a surface of the semiconductor substrate by using electrostatic force; and a static electricity generating element for generating static electricity and for controlling the static electricity in order to remove the dust from the adsorbing element.

Abstract: A physical quantity sensor includes: a sensor substrate including a first support substrate, a first insulation film and a first semiconductor layer, which are stacked in this order; a cap substrate including a second support substrate disposed on the first semiconductor layer, and has a P conductive type; and multiple electrodes, which are separated from each other. The first support substrate, the first insulation film and the first semiconductor layer have the P conductive type. The physical quantity is detected based on a capacitance between the plurality of electrodes, and the electrodes are disposed in the first semiconductor layer.

Abstract: A method of manufacturing a semiconductor sensor includes a forming step, a preparing step, a fixing step and a separating step. In the forming step, a plurality of caps made of resin is formed on a supporting substrate through a separable agent. Each of the caps has a cavity therein. In the preparing step, a semiconductor wafer is prepared, on which a plurality of sensor elements are formed. In the fixing step, the caps are fixed to the semiconductor wafer. Each cavity of the caps corresponds to each of the sensor elements. In the separating step, the separable agent and the supporting substrate are separated from the caps so as to leave the caps on the semiconductor wafer.

Abstract: A physical sensor includes: a substrate having a silicon layer, an oxide film and a support layer; and a sensor portion having movable and fixed electrodes and a lower electrode. The movable electrode is supported by a beam on the support layer. The fixed electrode faces the movable electrode. The lower electrode is disposed on the support layer and faces the movable electrode. The physical sensor detects horizontal physical quantity based on a capacitance between the movable and fixed electrodes, and vertical physical quantity based on a capacitance between the movable and lower electrodes. The beam includes vertical and horizontal beams. The thickness of the vertical beam is smaller than the thickness of the horizontal beam.

Abstract: A semiconductor device includes a semiconductor substrate, an element portion provided in the semiconductor substrate, and a connecting portion connected to the semiconductor substrate electrically, in which the connecting portion is formed of a conductive material in order to perform an electrical connection to an outside. The connecting portion is directly in contact with a surface of the semiconductor substrate such that the connecting portion and the semiconductor substrate are connected electrically.

Abstract: A computer-readable medium causes an information processing apparatus capable of performing a plurality of setting processing for making a setting in accordance with a predetermined sequence to perform processing including a first display control process including displaying a corresponding setting image for each of the plurality of setting processing, an information acceptance process including accepting information required to perform the setting processing through the displayed setting image, a shift command acceptance process including accepting a shift command for making a shift toward another setting processing from setting processing corresponding to the setting image displayed in the first display control process, and a second display control process including displaying an input completion image showing information accepted in the information acceptance process in addition to the setting image corresponding to the setting processing to be shifted by the shift command when the shift command is accepte

Abstract: The present invention provides an information processing apparatus capable of improving the operability of an installation screen. The information processing apparatus of the present invention starts up an application on an operating system to perform information processing. This information processing apparatus includes: installation means for installing the application; display means for displaying, when the application is installed, an installation screen on which a plurality of buttons, each associated with each of a plurality of setting items and operated by a user, are arranged; detection means for detecting a use environment of the information processing apparatus; and display control means for allowing, among the buttons arranged on the installation screen, the button relevant to the use environment detected by the detection means to be displayed on the display means so as to be relatively increased in display level with respect to the other buttons.

Abstract: A method of manufacturing a micro-structure includes dry-etching a sacrificial layer provided to a silicon substrate to form structures the sacrificial layer reacting with etching gas to generate reaction products including H2O, wherein the dry-etching includes etching the sacrificial layer and removing H2O as one of the reaction products generated through the etching step of the sacrificial layer, wherein the etching and the removing of H2O are repetitively performed.

Abstract: A semiconductor device includes: a sensor element having a plate shape with a surface and including a sensor structure disposed in a surface portion of the sensor element; and a plate-shaped cap element bonded to the surface of the sensor element. The cap element has a wiring pattern portion facing the sensor element. The wiring pattern portion connects an outer periphery of the surface of the sensor element and the sensor structure so that the sensor structure is electrically coupled with an external element via the outer periphery. The sensor element does not have a complicated multi-layered structure, so that the sensor element is simplified. Further, the dimensions of the device are reduced.

Abstract: A semiconductor device includes: a first substrate made of semiconductor and having first regions, which are insulated from each other and disposed in the first substrate; and a second substrate having electric conductivity and having second regions and insulation trenches. Each insulation trench penetrates the second substrate so that the second regions are insulated from each other. The first substrate provides a base substrate, and the second substrate provides a cap substrate. The second substrate is bonded to the first substrate so that a sealed space is provided between a predetermined surface region of the first substrate and the second substrate. The second regions include an extraction conductive region, which is coupled with a corresponding first region.

Abstract: A client device for a direct printing system includes the client device and a printing device connected to the client device, and an external device containing print data subject to direct printing being detachably connectable to either of the client device and printing device. The client device includes a judging unit configured to judge whether the external device is connected to the client device and a setting unit configured to set an output port of RAW format print data to the external storage connected to the client device if the judging unit judges that the storage device is connected to the client device.

Abstract: If a user wish to print files to be printed in accordance with a specific print setting, the user may store the file in a predetermined area of the external storage that is preliminarily associated with the predetermined print setting. When the printing device starts printing, files stored in the predetermined area are printed in accordance with the print setting associated to the predetermined area. Therefore, the printing device can reduce a user's burden in performing a relatively complicated print setting, while enabling print setting along with the user's demand.

Abstract: Recently a portable telephone, a portable player or a compact digital camera is packed with various kinds of personal information. Since personal information is lost or flowed out when a portable telephone or the like is broken by a shock or picked up by a stranger as a result of falling to a ground or a floor, falling of a portable telephone or the like must be prevented positively. A hanger loop on inner side of a pocket is characterized in that falling of a portable telephone or the like can be prevented positively by sewing a loop cloth on inner side of a pocket and connecting a portable telephone or the like and a strap to the loop cloth.

Abstract: An image scanning device has a scanning unit, a first storage unit, a first determination unit, and a control unit. The scanning unit scans an original document to produce image data. The first storage unit stores a specific condition used by the scanning unit for scanning a specific document. The specific document requires a limited scanning condition. The first determination unit determines based on the image data whether the original document is the specific document. The control unit reads the specific condition from the first storage unit and causes the scanning unit to scan the original document with the specific condition if the first determination unit determines that the original document is the specific document.

Abstract: In an attachment structure, a protective cap is provided with an adhesion layer on its outer peripheral edge part and its internal surface. The protective cap is bonded and fixed to an adherend member through the adhesion layer. This attachment structure can be suitably used for a semiconductor device. Alternatively, in a semiconductor device, a protective cap can be bonded using an adhesive. In this case, an outer peripheral edge part of the protective cap has a first end positioned on its inner rim surface, and a second end positioned on its outer rim surface. Furthermore, the first end protrudes toward a sensor chip more than the second end, and is adjacent to the sensor chip.

Abstract: A method of manufacturing a semiconductor sensor includes a forming step, a preparing step, a fixing step and a separating step. In the forming step, a plurality of caps made of resin is formed on a supporting substrate through a separable agent. Each of the caps has a cavity therein. In the preparing step, a semiconductor wafer is prepared, on which a plurality of sensor elements are formed. In the fixing step, the caps are fixed to the semiconductor wafer. Each cavity of the caps corresponds to each of the sensor elements. In the separating step, the separable agent and the supporting substrate are separated from the caps so as to leave the caps on the semiconductor wafer.

Abstract: A separating device for separating a semiconductor substrate includes: a cutting element for cutting the semiconductor substrate into a plurality of chips along with a cutting line on the semiconductor substrate; an adsorbing element for adsorbing a dust on a surface of the semiconductor substrate by using electrostatic force; and a static electricity generating element for generating static electricity and for controlling the static electricity in order to remove the dust from the adsorbing element.

Abstract: A dicing sheet frame, which is used when a semiconductor wafer adhered to a dicing sheet is cut into chips, includes a plurality of frame parts and a connecting device. The plurality of frame parts supports the dicing sheet. The connecting device connects the plurality of frame parts such that the plurality of frame parts has an annular shape.

Abstract: A method for dicing a semiconductor substrate includes: forming a reforming layer in the substrate by irradiating a laser beam on the substrate; forming a groove on the substrate along with a cutting line; and applying a force to the substrate in order to cutting the substrate at the reforming layer as a starting point of cutting. The groove has a predetermined depth so that the groove is disposed near the reforming layer, and the force provides a stress at the groove.