Abstract: First circuit board 10 including first resin base material 12 which is softened by heating and has a fusing property, and a plurality of first conductor patterns 14 formed on a surface of first resin base material 12, and second circuit board 20 on which a plurality of second conductor patterns 24 are formed with the same pitch as that of first conductor patterns 14 are provided. In the configuration, first conductor patterns 14 and second conductor patterns 24 are brought into mechanical contact with each other to provide electrical conduction; first resin base material 12 covers first conductor patterns 14 and second conductor patterns 24 and is bonded to second resin base material 22 of second circuit board 20, thereby connecting first circuit board 10 and second circuit board 20 to each other.

Abstract: An electronic component having connection terminals on one side thereof is bonded to a circuit board via an adhesive sheet having through-holes. The connection terminals on the electronic component are connected to electrode pads provided on the circuit board via a conductive adhesive in the through-holes. Thus, an electronic circuit device is formed. Using a polymeric resin film sheet for the circuit board and mounting an electronic component, e.g. an LSI, onto the circuit board can provide a small, light, thin, and inexpensive electronic circuit device.

Abstract: A circuit board comprises a base film that is a base layer, a first conductive circuit manufactured by hardening conductive paste material formed in a predetermined shape on the base film, a first insulating layer manufactured by hardening insulating paste material formed on the base film and the first conductive circuit, and a second conductive circuit manufactured by hardening conductive paste material in a predetermined shape on the first insulating layer, wherein an electronic part built-in by the first insulating layer and second insulating layer is connected to the second conductive circuit, and the first conductive circuit is connected to the second conductive circuit through a via hole.

Abstract: An electronic component having connection terminals on one side thereof is bonded to a circuit board via an adhesive sheet having through-holes. The connection terminals on the electronic component are connected to electrode pads provided on the circuit board via a conductive adhesive in the through-holes. Thus, an electronic circuit device is formed. Using a polymeric resin film sheet for the circuit board and mounting an electronic component, e.g. an LSI, onto the circuit board can provide a small, light, thin, and inexpensive electronic circuit device.

Abstract: It comprises circuit board 10 with circuit pattern 2 formed by conductive resin paste on resin substrate 1, surface-mounted type electronic components 30, 40 arranged with electrode terminals with respect to the connecting region of circuit pattern 2, connecting member 3 formed from conductive resin paste for connecting the connecting region to the electrode terminal, and insulating adhesive 6 for bonding the electronic components 30, 40 and circuit board 10, which is lower in curing temperature than conductive resin paste and disposed in a space between circuit board 10 and electronic components 30, 40 between connecting regions.

Abstract: A circuit board comprises a base film that is a base layer, a first conductive circuit manufactured by hardening conductive paste material formed in a predetermined shape on the base film, a first insulating layer manufactured by hardening insulating paste material formed on the base film and the first conductive circuit, and a second conductive circuit manufactured by hardening conductive paste material in a predetermined shape on the first insulating layer, wherein an electronic part built-in by the first insulating layer and second insulating layer is connected to the second conductive circuit, and the first conductive circuit is connected to the second conductive circuit through a via hole.

Abstract: A method for manufacturing a circuit board (7); in which, an electronic component is injected into a resin substrate at a low temperature, and then the resin substrate is improved in its heat withstanding property. The manufacturing method comprises the steps of softening by heat a resin substrate which contains a thermoplastic component and a chemical cross-link component and then injecting an electronic component (1) into the resin substrate; curing the resin substrate by bridging the chemical cross-link component of the resin substrate, making the resin substrate into a heat-withstanding substrate (70); and forming an electric wiring pattern (6) on the heat-withstanding substrate (70) for connection with a protruding electrode (2) of the electronic component (1). The circuit board (7) maintains the high dimensional accuracy throughout the manufacturing process. Thus, the present invention offers a superior circuit board, which is thin and compact in size and has a small thermal deformation rate.

Abstract: The present invention includes a plurality of lead terminals made of a conductive material having spring elasticity; and insulative housing that buries a part of the region of lead terminal and fixedly retains a plurality of lead terminals in an arrangement having been set in advance. Lead terminal is composed of a buried part that is a part of lead terminal buried in housing; bottom end joint that is extended from one end of the buried part, is exposed through bottom end surface of housing, and extracted in width direction of bottom end surface; and flexibly changing part that is exposed from another end of the buried part through one wall surface orthogonal to bottom end surface, and is extended along this wall surface to top end surface facing to bottom end surface, being spaced from wall surface and top end surface.

Abstract: In an analog resistive-film type touch panel, a lower-side electrode member having a transparent electrode on a part of a top face of a transparent insulating base member, a pair of bus bars on two parallel sides of the transparent electrode, and routing circuits connected to the bus bars for external terminal connection on a portion other than the transparent electrode, and an upper-side electrode member having a transparent electrode on a part of a bottom face of a transparent insulating base member having flexibility, a pair of bus bars on two parallel sides of the transparent electrode, and routing circuits connected to the bus bars for external terminal connection on a portion other than the transparent electrode are disposed facing each other in a square pattern via an insulative spacer and are bonded at peripheral portions, in which the bus bars and the routing circuits are respectively formed from metal thin wires with a diameter of 30 to 100 ?m.

Abstract: In a transparent conductive film for use in a transparent touch panel in which a lower electrode and an upper electrode are stacked so as to be spaced from each other by spacers, the transparent conductive film being provided on an electrode substrate of at least one of the electrodes and thereby forming the electrode, the transparent conductive film has, in its surface shape, an arithmetic mean roughness (Ra) within a range of 0.4 nm?Ra?4.0 nm and a root-mean-square roughness (Rms) within a range of 0.6 nm?Rms?3.0 nm.

Abstract: A 3D circuit module which is highly reliable, easily layered and able to mount electronic components in high density is obtained by providing a support member having a frame in the periphery thereof and a recess; a coating layer for coating the frame and filling in the recess, the coating layer being made of resin material which is adhesive and has a softening temperature lower than the softening temperature of the support member; a wiring pattern formed on the coating layer, the wiring pattern including a first land on the frame, a second land on the recess, and a wiring part for connecting between the first land and the second land; and an electronic component having a projecting electrode formed on a side thereof, the electronic component being bonded to the coating layer and accommodated in the recess, with the projecting electrode connected to the second land.

Abstract: First circuit board 10 including first resin base material 12 which is softened by heating and has a fusing property, and a plurality of first conductor patterns 14 formed on a surface of first resin base material 12, and second circuit board 20 on which a plurality of second conductor patterns 24 are formed with the same pitch as that of first conductor patterns 14 are provided. In the configuration, first conductor patterns 14 and second conductor patterns 24 are brought into mechanical contact with each other to provide electrical conduction; first resin base material 12 covers first conductor patterns 14 and second conductor patterns 24 and is bonded to second resin base material 22 of second circuit board 20, thereby connecting first circuit board 10 and second circuit board 20 to each other.

Abstract: Thinning and stacking are essential for circuit modules used for mobile devices of various kinds, smart cards, memory cards and the like. These demands make the manufacture of the circuit modules more complicated or less reliable due to delamination. A circuit module of a multilayer structure is provided which is formed by embedding semiconductor chips and passive components in a sheet made from a thermoplastic resin; folding a module sheet, which is formed of circuit blocks provided with wiring patterns thereon, at the boundaries of the circuit blocks so as to be stacked into layers; and thermal-bonding and integrating the module sheet by applying heat and pressure. As a result, a highly reliable circuit module can be manufactured in a simple manner.

Abstract: A multilayered circuit board and a method of forming the multilayered circuit board are provided. In a first circuit forming process, a first circuit is formed on an insulating board with a conductor; in a circuit embedding process, the first circuit is embedded in the insulating board so as to have a predetermined surface flatness and a predetermined parallelism; in a masking process, a pilot hole for a via hole is masked at a part of a surface of the circuit; in an insulating layer forming process P5p, an insulating material is applied as a layer to the surface except that portion thereof covered by the mask; in an insulating material layer flattening process, the surface of the insulating material layer is flattened so as to have the predetermined surface flatness and the predetermined parallelism; and in a pilot hole forming process, the mask is removed.

Abstract: The present invention includes a plurality of lead terminals made of a conductive material having spring elasticity; and insulative housing that buries a part of the region of lead terminal and fixedly retains a plurality of lead terminals in an arrangement having been set in advance. Lead terminal is composed of a buried part that is a part of lead terminal buried in housing; bottom end joint that is extended from one end of the buried part, is exposed through bottom end surface of housing, and extracted in width direction of bottom end surface; and flexibly changing part that is exposed from another end of the buried part through one wall surface orthogonal to bottom end surface, and is extended along this wall surface to top end surface facing to bottom end surface, being spaced from wall surface and top end surface.

Abstract: There is provided a mounting structure for a touch panel composed of a touch panel having a satin finished surface formed on at least either facing surface of an upper insulating substrate and a lower insulating substrate, the touch panel being mounted on a display, and being capable of suppressing glare on a display screen. The touch panel having the satin finished surface formed on at least either facing surface of the upper insulating substrate and the lower insulating substrate is entirely bonded to the display by a diffusion adhesive layer for mounting of the touch panel.

Abstract: A stereoscopically connected structure is made up of a first circuit board and a second circuit board which are mounted with other electronic components, and a relay board having a recess which is mounted with an electronic component and is provided with a lead-out wiring extending from the electronic component, and also having a land part to be connected with the lead-out wiring on one of the surfaces of the relay board that face the first circuit board and second circuit board. Thus the relay board can mount the electronic component thereon as well as connect the first circuit board and the second circuit board, thereby achieving high density mounting.

Abstract: An electronic circuit device has a substrate having a wiring pattern, an electronic component electrically connected to a terminal section of the wiring pattern by contacting a projection electrode with it, a cover that is disposed at a position facing the substrate and grapples the electronic component between it and the substrate, and a resin layer made of thermoplastic resin filled in a gap between the substrate and the cover. The gap includes a space in a connection region except an electric connection part between the projection electrode and the terminal section. The electronic component is adhered to the substrate and the substrate is adhered to the cover through the resin layer. Thus, the electronic circuit device having high connection reliability and high mass productivity, and a method and apparatus for manufacturing the electronic circuit device can be provided.

Abstract: A wiring board comprises a patterned wiring formed of electrically conductive resin composed primarily of silver and embedded into a substrate in a manner that a surface thereof is exposed above the substrate, and a covering conductor formed primarily of carbon covering the surface of the patterned wiring. The wiring board of this structure is superior in resistance to moisture absorption and water, prevents silver migration attributable to the moisture, and reduces a contact resistance in the connection between a terminal portion of the wiring board and an external apparatus.

Abstract: An interconnection substrate include: interconnection layer 12 region where at least first conductor layer 16 and second conductor layer 18 are vertically stacked in that order on substrate 10, first conductor layer 16 and second conductor layer 18 containing conductive particles and a binder, wherein first conductor layer 16 and second conductor layer 18 stacked in the interconnection layer 12 region have conductive particles different in average particle size from each other. As a result, only intended region can have low resistance.