Abstract: Disclosed herein is an electronic component that includes a first conductive layer including a lower electrode and a first inductor pattern, a dielectric film that covers the lower electrode, an upper electrode laminated on the lower electrode through the dielectric film, an insulating layer that covers the first conductive layer, dielectric film, and upper electrode, and a second conductive layer formed on the insulating layer and including a second inductor pattern. The first and second inductor patterns are connected in parallel through via conductors penetrating the insulating layer.

Abstract: A liquid micrometer which includes: a liquid flow path which supplies liquid from a liquid supply device to a discharge nozzle; a flow rate sensor provided in the liquid flow path; a control valve provided in the liquid flow path between the liquid supply device and the flow rate sensor; a controller which controls the control valve such that a flow rate measured by the flow rate sensor becomes equal to a set value; a pressure sensor which measures pressure of the liquid injected from the discharge nozzle; and a calculating section which calculates the size of a work from the pressure measured by the pressure sensor in a state where the flow rate is maintained at the set value by the controller.

Abstract: A thin-film capacitor includes an insulating base member, and a capacitance portion that is laminated on the insulating base member has a plurality of internal electrode layers which are laminated on the insulating base member and are provided in a lamination direction and dielectric layers which are sandwiched between the internal electrode layers. A relative dielectric constant of the dielectric layers is 100 or higher.

Abstract: Provided is a manufacturing method of a thin film capacitor comprising a capacitance portion in which at least one dielectric layer is sandwiched between a pair of electrode layers included in a plurality of electrode layers, the manufacturing method including a lamination process of alternately laminating the plurality of electrode layers and a dielectric film and forming a laminated body which will be the capacitance portion, a first etching process of forming an opening extending in a laminating direction with respect to the laminated body and exposing the dielectric film laminated directly on one of the plurality of electrode layers on a bottom surface of the opening, and a second etching process of exposing the one electrode layer at the bottom surface of the opening. In the second etching process, an etching rate of the one electrode layer is lower than an etching rate of the dielectric film.

Abstract: Disclosed herein is a thin film capacitor that includes a capacitive insulating film, a first metal film formed on one surface of the capacitive insulating film, and a second metal film formed on other surface of the capacitive insulating film and made of a metal material different from that of the first metal film. The thin film capacitor has an opening penetrating the capacitive insulating film, first metal film, and second metal film. The second metal film is thicker than the first metal film. A first size of a part of the opening that penetrates the first metal film is larger than a second size of a part of the opening that penetrates the second metal film.

Abstract: An object of the present invention is to provide a gel sheet comprising an intermediate base, having no variation in adhesiveness. A gel sheet 1 comprising a gel material 10 and an intermediate base 20 embedded in the gel material 10, wherein when T represents the thickness of the gel sheet 1, and S represents the amplitude of the intermediate base 20, a relation represented by the following expression (1) is satisfied: S/T?0.

Abstract: Provided is a manufacturing method of a thin film capacitor comprising a capacitance portion in which at least one dielectric layer is sandwiched between a pair of electrode layers included in a plurality of electrode layers, the manufacturing method including a lamination process of alternately laminating the plurality of electrode layers and a dielectric film and forming a laminated body which will be the capacitance portion, a first etching process of forming an opening extending in a laminating direction with respect to the laminated body and exposing the dielectric film laminated directly on one of the plurality of electrode layers on a bottom surface of the opening, and a second etching process of exposing the one electrode layer at the bottom surface of the opening. In the second etching process, an etching rate of the one electrode layer is lower than an etching rate of the dielectric film.

Abstract: Provided is a biological information detection device capable of restraining noise from being mixed with a signal relating to biological information. A biological information detection device includes an electrode pad that is able to detect a signal (bioelectric signal) relating to biological information of a subject (for example, a fetus in a mother's body), a connector that is connectable to the electrode pad, and a cable that is connected to the connector and is able to transmit the signal. The electrode pad and the connector are provided with fixing members and that are attachable to and detachable from each other, respectively.

Abstract: A thin film capacitor includes a capacitance portion in which a plurality of electrode layers and dielectric layers are alternately laminated, a cover layer, an insulating layer, a via hole in which one electrode layer different from an uppermost electrode layer among the plurality of electrode layers is exposed at a bottom surface thereof, and an opening which is provided inside the via hole and in which the one electrode layer is exposed at a bottom surface thereof, and in which the cover layer and the insulating layer are exposed at a side surface. The opening includes a first opening portion which passes through the insulating layer and a second opening portion which is provided below the first opening portion and passes through the cover layer, and when an inner diameter of the first opening portion is D1 and an inner diameter of the second opening portion is D2, D1>D2.

Abstract: In a thin-film capacitor, an electrode terminal layer and an electrode layer of a capacitor portion are connected to electrode terminals by via conductors that is formed to penetrate an insulating layer in a thickness direction thereof, and a short circuit wiring in the thickness direction is realized by the via conductors. In the thin-film capacitor, an increase in the number of terminals in the plurality of electrode terminals is achieved, a decrease in length of a circuit wiring is achieved, and thus a thin-film capacitor with low-ESL has been achieved.

Abstract: Disclosed herein a thin film capacitor that includes a lower electrode layer, an upper electrode layer, and a dielectric layer disposed between the lower electrode layer and the upper electrode layer. The dielectric layer has a through hole. An inner wall surface of the through hole has a first tapered surface and a second tapered surface surrounded by the first tapered surface. The first and second tapered surfaces are not covered with the upper electrode layer and have respective first and second taper angles with respect to a surface of the lower electrode layer. The second taper angle is smaller than the first taper angle.

Abstract: Disclosed herein a thin film capacitor that includes a lower electrode layer, an upper electrode layer, and a dielectric layer disposed between the lower electrode layer and the upper electrode layer. The dielectric layer has a through hole. The upper electrode layer has a connection part connected to the lower electrode layer through the through hole and an electrode part insulated from the connection part by a slit. A surface of the lower electrode layer that contacts the connection part through the through hole includes an annular area positioned along an inner wall surface of the through hole and a center area surrounded by the annular area. The annular area is lower in surface roughness than the center area.

Abstract: Disclosed herein is an electronic component that includes a substrate; and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of a predetermined one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part. The recessed part is covered with a first dielectric film made of an inorganic insulating material.

Abstract: Disclosed herein is an electronic component that includes a substrate and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of at least one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part.

Abstract: Disclosed herein is an electronic component that includes a first conductive layer including a lower electrode and a first inductor pattern, a dielectric film that covers the lower electrode, an upper electrode laminated on the lower electrode through the dielectric film, an insulating layer that covers the first conductive layer, dielectric film, and upper electrode, and a second conductive layer formed on the insulating layer and including a second inductor pattern. The first and second inductor patterns are connected in parallel through via conductors penetrating the insulating layer.

Abstract: A liquid micrometer of the present invention includes: a liquid flow path 30 which supplies liquid from liquid supply means 10 to a discharge nozzle 20; a flow rate sensor 40 provided in the liquid flow path 30; a control valve 50 provided in the liquid flow path 30 between the liquid supply means 10 and the flow rate sensor 40; a controller 60 which controls the control valve 50 such that a flow rate measured by the flow rate sensor 40 becomes equal to a set value; a pressure sensor 70 which measures pressure of the liquid injected from the discharge nozzle 20; and a calculating section 80 which calculates the size of a work A from the pressure measured by the pressure sensor 70 in a state where the flow rate is maintained at the set value by the controller.

Abstract: Disclosed herein is a thin film capacitor that includes a capacitive insulating film having first and second through holes, a first metal film provided on one surface of the capacitive insulating film, and a second metal film provided on the other surface of the capacitive insulating film. The first and second metal films are made of different metal materials from each other. The first metal film is divided into a first area positioned outside the first space and a second area positioned inside the first space. The second metal film is divided into a third area positioned outside the second space and a fourth area positioned inside the second space. The third area is connected to the second area through the first through hole. The fourth area is connected to the first area through the second through hole.

Abstract: A thin-film capacitor satisfies a relationship of CTE1>CTE2>CTE3 regarding a linear expansion coefficient CTE1 of a base, a linear expansion coefficient CTE2 of a capacitance unit, and a linear expansion coefficient CTE3 of a barrier layer. The inventors have newly found that in a case in which such a relationship is satisfied, when a temperature falls from a deposition temperature, cracking occurring in the capacitance unit of the thin-film capacitor is prevented, and cracking occurring in the barrier layer is also prevented.

Abstract: An electronic component mounting package includes a semiconductor element which is disposed such that an active surface faces a main surface of a wiring portion, and which is electrically connected to the wiring portion via a first terminal; and a thin film passive element which is disposed between the active surface of the semiconductor element and the main surface of the wiring portion when seen in a lamination direction, and which is electrically connected to the semiconductor element. A part of the first terminal is disposed on an outer side with respect to the thin film passive element in a plan view. A length of the first terminal in the lamination direction disposed on the outer side with respect to the thin film passive element is larger than a thickness of the thin film passive element in the lamination direction.

Abstract: An electronic component embedded substrate includes: a substrate that includes an insulating layer and has a first principal surface and a second principal surface; an electronic component that is embedded in the substrate and has at least one first terminal, at least one second terminal, and a capacity part; at least one via conductor that are formed in the insulating layer and electrically connected to the second terminal; and an adhesion layer that is in contact with the second terminal on an end face of the second terminal which are close to the second principal surface. The electronic component is laminated with the insulating layer, and adhesion strength between the adhesion layer and the insulating layer is higher than that between the second terminal and the insulating layer.