Abstract: In order to attain an optical module which can prevent a foreign object from intruding into the optical module, a camera module includes a top surface section having an opening for allowing light to pass through the opening into the optical module; and a glass substrate for sealing the opening, the glass substrate being adhered to the top surface section, the top surface section including a projection section which projects to abut on the glass substrate, the projection section being formed to surround the opening.

Abstract: A tablet includes a bismuth-based glass and a refractory filler, wherein the bismuth-based glass comprises, as a glass composition, in terms of mass %, 70 to 90% of Bi2O3, 2 to 12% of B2O3, 0 to 5% of Al2O3, 1 to 15% of ZnO, 0 to 10% of BaO, and 0 to 8% of CuO+Fe2O3; the tablet comprises 1 to 25 vol % of alumina as the refractory filler; and the filling ratio of the tablet is 71% or more.

Abstract: A camera module (1) is an assembly of a lens holder (4) and a wiring board (2). The lens holder (4) holds an optical structure (3) which forms an image of a subject. The wiring board (2) has formed thereon a solid-state image sensing element (21) which converts the image of the subject formed by the optical structure (3) to electrical signals. Grease (7) is applied to the camera module (1) in such a manner that the grease is not present in an optical path in the optical structure (3). The grease (7) catches the dust (D) produced during manufacture and while in use, thereby prevented the dust (D) from causing image defects. A solid-state image sensing device is thus provided which is capable of preventing the dust produced during manufacture and while in use from causing image defects.

Abstract: In order to attain an optical module which can prevent a foreign object from intruding into the optical module, a camera module includes a top surface section having an opening for allowing light to pass through the opening into the optical module; and a glass substrate for sealing the opening, the glass substrate being adhered to the top surface section, the top surface section including a projection section which projects to abut on the glass substrate, the projection section being formed to surround the opening.

Abstract: The solid image capture device 100 in accordance with the present invention is detachably fixed to a wiring board 1 and applies pressure to the side faces of a transparent lid section 3 in a direction normal to the faces, so as to nip and secure the transparent lid section 3. The mechanism allows a solid image capture element 2 to be attached to and detached from the wiring board 1. The solid image capture element 2 is readily positioned precisely on the wiring board 1.

Abstract: A solid-state image pickup apparatus 100 of the present invention includes a transparent cover section 24 which is provided so as to be spaced from a lens section, the transparent cover section 24 being provided (i) so as to face a light-receiving section of a solid-state image sensing device 22 and (ii) so as to have a gap between the solid-state image sensing device 22 and the transparent cover section 24. Furthermore, the transparent cover section 24 is provided with a positioning mark which serves as a reference for positioning the lens section in consideration of the solid-state image sensing device 22. Consequently, it is possible to provide a shock-resistant solid-state image pickup apparatus in which a lens section and an image pickup section are positionally aligned with high accuracy.

Abstract: A tablet comprises a bismuth-based glass and a refractory filler, wherein: (1) the bismuth-based glass comprises, as a glass composition, in terms of mass %, 70 to 90% of Bi2O3, 2 to 12% of B2O3, 0 to 5% of Al2O3, 1 to 15% of ZnO, 0 to 10% of BaO, and 0 to 8% of CuO+Fe2O3; (2) the tablet comprises 1 to 25 vol % of alumina as the refractory filler; and (3) the filling ratio of the tablet is 71% or more.

Abstract: The solid image capture device 100 in accordance with the present invention is detachably fixed to a wiring board 1 and applies pressure to the side faces of a transparent lid section 3 in a direction normal to the faces, so as to nip and secure the transparent lid section 3. The mechanism allows a solid image capture element 2 to be attached to and detached from the wiring board 1. The solid image capture element 2 is readily positioned precisely on the wiring board 1.

Abstract: A camera module 100a of the present invention includes a lens unit 10a which includes a lens 11 and a lens holder 12 holding the lens 11 therein, and an image sensing unit 20a which includes a solid-state image sensor 24 and a transparent lid section 26 which is arranged so as to face the receiving surface of the solid-state image sensor 24, provided with a space S therebetween. The transparent lid section 26 and the lens 11 are independent of each other, and the lens 11 is aligned with respect to the solid-state image sensor 24 by engaging the transparent lid section 26 with the lens holder 12 by mounting the lens 11 on the transparent lid section 26. Thus, it is possible to provide a solid-state image sensing device having high lens alignment precision with respect to a solid-state image sensor.

Abstract: The camera module structure (10) of the present invention is arranged such that a board electrode (2) of a printed board (1) and a mounting electrode (4) of a camera module (3) mounted on the printed board (1) are joined with each other through a solder joint section (5), and the board electrode (2) and the mounting electrode (4) are aligned by self-alignment. The solder joint section (5) includes a solder section (16) for solder-joining, and a supporting section (17) for supporting the camera module (3). The present invention realizes a solder mounting structure wherein a heavy-weight component is joined on the board with solder by self-alignment.

Abstract: A camera module 1 includes: an optical structure 3 that forms a subject image and moves up and down along an optical path; a solid-state image pickup element 21 that converts, into an electrical signal, a subject image formed by the optical structure 3; a lens holder 4, holding the optical structure 3 therein, which contains the solid-state image pickup element 21, the optical structure 3 having a cushioning member 34 so provided on a back surface thereof as to absorb the impact of contact between the optical structure 3 and the holding section 4. The cushioning member 34 has a removing section for, when in contact with a contact surface 4a of the holding section 4, removing dust D on the contact surface 4a outward from the contact surface 4a. This makes it possible to provide a small camera module 1 while preventing (reducing) dust from causing an image defect.

Abstract: A camera module 100a includes a lens unit 1a, which includes a lens 11 and a lens holder 12 holding the lens 11 therein, and an image sensing unit 2a, which has a solid-state image sensor 24. A position adjustment of the lens 11 is performed by moving the lens 11 independently of the lens holder 12, by use of electromagnetic force. This allows a fine adjustment of a position of the lens 11, thereby improving the alignment precision of the lens 11. Thus, a solid-state image sensing device is provided, which can make fine adjustments of focal lengths.

Abstract: A camera module 100a includes a lens unit 1a which includes a lens 11 and a lens holder 12 holding the lens 11 therein, and an image sensing unit 2a which includes a solid-state image sensor 24 and a transparent lid section 26 which is arranged so as to face the receiving surface of the solid-state image sensor 24, provided with a space S therebetween. The lens holder 12 blocks unnecessary light to the transparent lid section 26 by engaging the lens holder 12 with a whole periphery part of the transparent lid section 26. Thus, it is possible to provide a solid-state image sensing device, which realizes adequate camera function by blocking unnecessary light to the transparent lid section.

Abstract: A solid-state image sensor, a transparent cover, a DSP, a wiring board and the like are sealed in a sealing portion by molding of a synthetic resin, and fixed to an imaging unit. At this time, a portion of the transparent cover is exposed from the sealing portion. The optical path fixing device and the imaging unit sealed by the sealing portion are fixedly combined by engagement of hook engaging portions and hook portions, in a state where the lower end surface of a lens barrel comes into contact with the exposed portion. As the result, positioning accuracy of a lens with respect to a pixel area of the solid-state image sensor dose not deteriorate even if a substrate on which the solid-state image sensor is arranged is deflected or distorted.

Abstract: A solid-state image pickup apparatus 100 of the present invention includes a transparent cover section 24 which is provided so as to be spaced from a lens section, the transparent cover section 24 being provided (i) so as to face a light-receiving section of a solid-state image sensing device 22 and (ii) so as to have a gap between the solid-state image sensing device 22 and the transparent cover section 24. Furthermore, the transparent cover section 24 is provided with a positioning mark which serves as a reference for positioning the lens section in consideration of the solid-state image sensing device 22. Consequently, it is possible to provide a shock-resistant solid-state image pickup apparatus in which a lens section and an image pickup section are positionally aligned with high accuracy.

Abstract: A camera module (1) is an assembly of a lens holder (4) and a wiring board (2). The lens holder (4) holds an optical structure (3) which forms an image of a subject. The wiring board (2) has formed thereon a solid-state image sensing element (21) which converts the image of the subject formed by the optical structure (3) to electrical signals. Grease (7) is applied to the camera module (1) in such a manner that the grease is not present in an optical path in the optical structure (3). The grease (7) catches the dust (D) produced during manufacture and while in use, thereby prevented the dust (D) from causing image defects. A solid-state image sensing device is thus provided which is capable of preventing the dust produced during manufacture and while in use from causing image defects.

Abstract: A camera module of the present invention includes a plurality of projections 61b on a bottom base of a driving section 61 of an AF/Zoom module. The projections 61b are radially extended from an aperture 63 formed on an optical path. By this, adhesive can be spread over the projections 61b when bonding a lens holder and the AF/Zoom module together. Furthermore, even if the adhesive is excessively applied, excessive adhesive can be retained between the projections 61b. As a result, it is possible to realize a solid-state imaging device which makes it possible to improve adhesive strength between the lens holder and the AF/Zoom module and easily bond the lens holder and the AF/Zoom module.

Abstract: A solid image capture device 100 in accordance with the present invention includes a holder 4 securing a lens barrel 8a onto a transparent lid section 3. When the holder 4 is in engagement with an external section of the transparent lid section 3, the holder 4 presses down the lens barrel 8a to secure the lens barrel 8a to the transparent lid section 3.

Abstract: A lens holder for supporting a lens is put so as to slide on a side surface of a lens barrel in which an image sensor having a light receiving portion is arranged at the bottom, and the lens barrel and the lens holder are connected together by a connecting material. A fluid is filled in a space formed by the container composed of the substrate and the lens barrel, and the lens holder, and then a position of the lens with respect to the light receiving portion is controlled by controlling a volume of the fluid in the space to thereby move a position of the lens holder with respect to the lens barrel. Positioning of the lens is easily performed even when it is a compact configuration.

Abstract: The solid image capture device 100 in accordance with the present invention is detachably fixed to a wiring board 1 and applies pressure to the side faces of a transparent lid section 3 in a direction normal to the faces, so as to nip and secure the transparent lid section 3. The mechanism allows a solid image capture element 2 to be attached to and detached from the wiring board 1. The solid image capture element 2 is readily positioned precisely on the wiring board 1.