Abstract: The camera module structure (10) of the present invention, is a board electrode (2) formed on a printed board (1) and a mounting electrode (4) formed on a camera module (3) mounted on the printed board (1) being joined through a solder joint section (5), and the board electrode (2) and the mounting electrode (4) are aligned by self-alignment. The solder joint section (5) is composed of a first solder (6) and a second solder (7) having different characteristics. Thus, a solder mounting structure wherein a heavy-weight component is joined on the board with solder by self-alignment is provided.

Abstract: A camera module structure (100) of the present invention is arranged such that a heat-sensitive camera module (2) is joined to a printed wiring board (1) through solder joint sections (3). The printed wiring board (1) has through holes (11) formed therein and terminals (12) formed thereon so as to close front surface apertures which are formed by the through holes (11) in the mounting surface of the printed wiring board (1). The solder joint sections (3) are provided on the terminals (12), respectively. The solder joint sections (3) are formed by heating by light (heat rays) applied to the rear side of the printed wiring board (1) by way of the terminals (12) on the printed wiring board (1), so that heat is not transmitted to the camera module (2). Accordingly, the camera module structure (100) mounted on the printed wiring board (1) is realized without heat damage to the heat-sensitive camera module (2).

Abstract: In manufacturing a camera module structure (100), a hot air nozzle (4) melts solder at a solder connection portion (3) by blowing hot air to the solder connection portion (3), while a suction nozzle (5) suctions the hot air that moves toward the camera module (2), from a position nearer from the camera module (2) than a position of the hot air nozzle (4). This makes it possible to manufacture a solder mounting structure in which a heat-vulnerable electronic component can be mounted on a wiring board without being damaged by heat.

Abstract: A camera module 1 includes: an optical structure 3 that forms a subject image and moves up and down along an optical path; a solid-state image pickup element 21 that converts, into an electrical signal, a subject image formed by the optical structure 3; a lens holder 4, holding the optical structure 3 therein, which contains the solid-state image pickup element 21, the optical structure 3 having a cushioning member 34 so provided on a back surface thereof as to absorb the impact of contact between the optical structure 3 and the holding section 4. The cushioning member 34 has a removing section for, when in contact with a contact surface 4a of the holding section 4, removing dust D on the contact surface 4a outward from the contact surface 4a. This makes it possible to provide a small camera module 1 while preventing (reducing) dust from causing an image defect.

Abstract: A camera module 1 includes: an optical structure 3 that forms a subject image; a solid-state image pickup element 21 that converts, into an electrical signal, a subject image formed by the optical structure 3; a lens holder 4, holding the optical structure 3 therein, which contains the solid-state image pickup element 21; and a cushioning member 34, disposed between the optical structure 3 and the lens holder 4 so as to avoid an optical path of the optical structure 3, which absorbs the impact of contact between the optical structure 3 and the lens holder 4, the cushioning member being made of nonmetallic material. This makes it possible to provide a small solid-state image pickup device while preventing dust from being generated when the camera module 1 is manufactured or used.

Abstract: A camera module 100a includes a lens unit 1a, which includes a lens 11 and a lens holder 12 holding the lens 11 therein, and an image sensing unit 2a, which has a solid-state image sensor 24. A position adjustment of the lens 11 is performed by moving the lens 11 independently of the lens holder 12, by use of electromagnetic force. This allows a fine adjustment of a position of the lens 11, thereby improving the alignment precision of the lens 11. Thus, a solid-state image sensing device is provided, which can make fine adjustments of focal lengths.

Abstract: A camera module 100 according to the present invention includes a lens unit 1 including a lens 11, and an imaging unit 2 where a solid-state imaging element is mounted on a wiring board 21, the lens unit 1 and the imaging unit 2 being engaged with each other by inserting a projection 23 into a cutout part 13, the projection 23 being provided on the imaging unit 2, and the cutout part 13 being provided on the lens unit 1. The cutout part 13 has a cross-sectional shape that is in parallel with an opening surface 13a and that becomes smaller inwardly of the lens unit 1. Thus, when detaching each unit, breaking of the projection can be prevented and each unit can be easily detached. With this arrangement it is possible to realize a camera module in which a disengagement of an optical unit and an imaging unit can be performed easily, while effectively preventing the breaking of the projection when detaching the optical unit and the imaging unit.

Abstract: A camera module 100a includes a lens unit 1a which includes a lens 11 and a lens holder 12 holding the lens 11 therein, and an image sensing unit 2a which includes a solid-state image sensor 24 and a transparent lid section 26 which is arranged so as to face the receiving surface of the solid-state image sensor 24, provided with a space S therebetween. The lens holder 12 blocks unnecessary light to the transparent lid section 26 by engaging the lens holder 12 with a whole periphery part of the transparent lid section 26. Thus, it is possible to provide a solid-state image sensing device, which realizes adequate camera function by blocking unnecessary light to the transparent lid section.

Abstract: A camera module 100a of the present invention includes a lens unit 10a which includes a lens 11 and a lens holder 12 holding the lens 11 therein, and an image sensing unit 20a which includes a solid-state image sensor 24 and a transparent lid section 26 which is arranged so as to face the receiving surface of the solid-state image sensor 24, provided with a space S therebetween. The transparent lid section 26 and the lens 11 are independent of each other, and alignment of the lens 11 with respect to the solid-state image sensor 24 is performed by mounting the lens 11 on the transparent lid section 26. Thus, it is possible to provide a solid-state image sensing device having high lens alignment precision with respect to a solid-state image sensor.

Abstract: A camera module 100a of the present invention includes a lens unit 10a which includes a lens 11 and a lens holder 12 holding the lens 11 therein, and an image sensing unit 20a which includes a solid-state image sensor 24 and a transparent lid section 26 which is arranged so as to face the receiving surface of the solid-state image sensor 24, provided with a space S therebetween. The transparent lid section 26 and the lens 11 are independent of each other, and alignment of the lens 11 with respect to the solid-state image sensor 24 is performed by mounting the lens 11 on the transparent lid section 26. Thus, it is possible to provide a solid-state image sensing device having high lens alignment precision with respect to a solid-state image sensor.

Abstract: A camera module of the present invention includes a plurality of projections 61b on a bottom base of a driving section 61 of an AF/Zoom module. The projections 61b are radially extended from an aperture 63 formed on an optical path. By this, adhesive can be spread over the projections 61b when bonding a lens holder and the AF/Zoom module together. Furthermore, even if the adhesive is excessively applied, excessive adhesive can be retained between the projections 61b. As a result, it is possible to realize a solid-state imaging device which makes it possible to improve adhesive strength between the lens holder and the AF/Zoom module and easily bond the lens holder and the AF/Zoom module.

Abstract: The camera module structure (10) of the present invention is arranged such that a board electrode (2) of a printed board (1) and a mounting electrode (4) of a camera module (3) mounted on the printed board (1) are joined with each other through a solder joint section (5), and the board electrode (2) and the mounting electrode (4) are aligned by self-alignment. The solder joint section (5) includes a solder section (16) for solder-joining, and a supporting section (17) for supporting the camera module (3). The present invention realizes a solder mounting structure wherein a heavy-weight component is joined on the board with solder by self-alignment.

Abstract: An optical path delimiter having a lens is disposed so as to be in contact with a transparent lid bonded to a surface of a solid-state image sensor, and is fixed without bonded. Further, the solid-state image sensor to which the transparent lid is bonded, the optical path delimiter disposed so as to be in contact with the transparent lid without bonded, a DSP serving as a signal processor, a circuit part and a wiring board are fixed by being sealed in a synthetic resin. Even when distortion occurs due to warpage, flexure or the like on a board where the solid-state image sensor is disposed, the accuracy of the alignment of the lens with respect to the solid-state image sensor never decreases. In addition, the solid-state image sensor or the signal processor is never damaged by an external shock.

Abstract: A screw portion is provided on an image sensing unit, a screw hole portion to be engaged with the screw portion is provided on an optical path delimiter, and the screw portion and the screw hole portion are engaged together to thereby fix the image sensing unit and the optical path delimiter so that a lens barrel of the optical path delimiter is in contact with a transparent lid bonded to a surface of a solid-state image sensor. The solid-state image sensor, the transparent lid, a DSP, a wiring board and the like are sealed by a sealing portion made of a resin. Even when distortion occurs due to warpage, flexure or the like on the board where the solid-state image sensor is disposed, the accuracy of the positioning of the lens with respect to a pixel area of the solid-state image sensor is never decreased, it can be prevented that the solid-state image sensor or a signal processor is damaged by an external shock, and the optical device module is easily fabricated.

Abstract: A solid-state image sensor, a transparent cover, a DSP, a wiring board and the like are sealed in a sealing portion by molding of a synthetic resin, and fixed to an imaging unit. At this time, a portion of the transparent cover is exposed from the sealing portion. The optical path fixing device and the imaging unit sealed by the sealing portion are fixedly combined by engagement of hook engaging portions and hook portions, in a state where the lower end surface of a lens barrel comes into contact with the exposed portion. As the result, positioning accuracy of a lens with respect to a pixel area of the solid-state image sensor dose not deteriorate even if a substrate on which the solid-state image sensor is arranged is deflected or distorted.

Abstract: An optical path delimiter having a lens is disposed so as to be in contact with a transparent lid bonded to a surface of a solid-state image sensor, and is fixed without bonded. Further, the solid-state image sensor to which the transparent lid is bonded, the optical path delimiter disposed so as to be in contact with the transparent lid without bonded, a DSP serving as a signal processor, a circuit part and a wiring board are fixed by being sealed in a synthetic resin. Even when distortion occurs due to warpage, flexure or the like on a board where the solid-state image sensor is disposed, the accuracy of the alignment of the lens with respect to the solid-state image sensor never decreases. In addition, the solid-state image sensor or the signal processor is never damaged by an external shock.

Abstract: A screw portion is provided on an image sensing unit, a screw hole portion to be engaged with the screw portion is provided on an optical path delimiter, and the screw portion and the screw hole portion are engaged together to thereby fix the image sensing unit and the optical path delimiter so that a lens barrel of the optical path delimiter is in contact with a transparent lid bonded to a surface of a solid-state image sensor. The solid-state image sensor, the transparent lid, a DSP, a wiring board and the like are sealed by a sealing portion made of a resin. Even when distortion occurs due to warpage, flexure or the like on the board where the solid-state image sensor is disposed, the accuracy of the positioning of the lens with respect to a pixel area of the solid-state image sensor is never decreased, it can be prevented that the solid-state image sensor or a signal processor is damaged by an external shock, and the optical device module is easily fabricated.

Abstract: A lens holder for supporting a lens is put so as to slide on a side surface of a lens barrel in which an image sensor having a light receiving portion is arranged at the bottom, and the lens barrel and the lens holder are connected together by a connecting material. A fluid is filled in a space formed by the container composed of the substrate and the lens barrel, and the lens holder, and then a position of the lens with respect to the light receiving portion is controlled by controlling a volume of the fluid in the space to thereby move a position of the lens holder with respect to the lens barrel. Positioning of the lens is easily performed even when it is a compact configuration.