Patents by Inventor Kazuo Kohmura

Kazuo Kohmura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11137677
    Abstract: A pellicle for EUV exposure that has a high transmittance to EUV light, causes little outgassing, and is not much contaminated, and a method for manufacturing the same are provided. A pellicle (100) includes a pellicle film (101); a support frame (103); and a first adhesive layer (109) provided at an end of the support frame, the end being opposite to an end on which the pellicle film is extended. The pellicle further includes an inorganic layer (111) on a side surface of the first adhesive layer, the side surface extending in a direction crossing a surface of the pellicle film, and the pellicle film being extended on the side surface. The inorganic layer has a mass absorption coefficient (?m) in the range of 5×103 cm2/g to 2×105 cm2/g.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: October 5, 2021
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Kazuo Kohmura, Yosuke Ono, Atsushi Okubo, Daiki Taneichi, Hisako Ishikawa, Tsuneaki Biyajima
  • Patent number: 11042085
    Abstract: Provided are a pellicle film, a pellicle frame and a pellicle having a higher EUV transmittance. An exposure pattern plate capable of performing EUV lithography with the pellicle film, the pellicle frame or the pellicle, and a method for producing a semiconductor device, are provided. A pellicle film for exposure extendable over an opening of a support frame and having a thickness of 200 nm or less is provided. The film includes a carbon nanotube sheet. The carbon nanotube sheet includes bundles each including a plurality of carbon nanotubes, the bundles each have a diameter of 100 nm or shorter, and the bundles are aligned in a planar direction in the carbon nanotube sheet.
    Type: Grant
    Filed: December 18, 2018
    Date of Patent: June 22, 2021
    Assignees: MITSUI CHEMICALS, INC., NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Yosuke Ono, Atsushi Okubo, Kazuo Kohmura, Atsuko Sekiguchi, Yuichi Kato, Takeo Yamada
  • Patent number: 10990001
    Abstract: Provided are a pellicle film, a pellicle frame and a pellicle having a higher EUV transmittance. An exposure pattern plate capable of performing EUV lithography with the pellicle film, the pellicle frame or the pellicle, and a method for producing a semiconductor device, are provided. A pellicle film for exposure extendable over an opening of a support frame and having a thickness of 200 nm or less is provided. The film includes a carbon nanotube sheet. The carbon nanotube sheet includes bundles each including a plurality of carbon nanotubes, the bundles each have a diameter of 100 nm or shorter, and the bundles are aligned in a planar direction in the carbon nanotube sheet.
    Type: Grant
    Filed: December 18, 2018
    Date of Patent: April 27, 2021
    Assignees: MITSUI CHEMICALS, INC., NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Yosuke Ono, Atsushi Okubo, Kazuo Kohmura, Atsuko Sekiguchi, Yuichi Kato, Takeo Yamada
  • Patent number: 10988647
    Abstract: The purpose of the present invention is to provide a semiconductor substrate manufacturing method, which prevents detachment of a semiconductor wafer being ground, and which prevents cracking or chipping in a semiconductor substrate obtained. In order to solve the problem, the semiconductor substrate manufacturing method comprises: a polyimide layer forming step of forming a polyimide layer on a support material; a wafer attaching step of affixing the support material and a semiconductor wafer to each other with the polyimide layer disposed therebetween; a wafer grinding step of grinding the semiconductor wafer; a support material peeling step of peeling the support material from the polyimide layer; and a polyimide layer peeling step of peeling the polyimide layer from the semiconductor wafer. The polyimide layer includes polyimide which includes a benzophenone skeleton and an aliphatic structure, wherein an amine equivalent weight is 4000 to 20000.
    Type: Grant
    Filed: April 19, 2018
    Date of Patent: April 27, 2021
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Jun Kamada, Kaichiro Haruta, Takashi Unezaki, Kiyomi Imagawa, Kenichi Fujii, Yasuhisa Kayaba, Kazuo Kohmura
  • Patent number: 10955740
    Abstract: The present invention provides; a pellicle frame which can effectively inhibit distortion of the photo mask (8) caused by mounting the pellicle (1), and which does not have a complex shape, and a pellicle which uses said pellicle frame are provided, and a manufacturing method of a blackened pellicle frame is also provided which can reduce the defect of the surface flickering under concentrated light and which facilitates inspection of the foreign matter adhesion prior to use. The present invention relates to a pellicle frame with an anodized film on a surface of an aluminum alloy frame, characterized in that: the aluminum alloy frame comprises an aluminum alloy which contains Ca: 5.0 to 10.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: March 23, 2021
    Assignees: NIPPON LIGHT METAL COMPANY, LTD., Mitsui Chemicals, Inc.
    Inventors: Yoshihiro Taguchi, Kazuo Kohmura, Daiki Taneichi
  • Publication number: 20210080824
    Abstract: A support frame for pellicle is provided including a first support frame part, a second support frame part, and a filter, wherein the filter has a flat plate-shaped frame shape and is sandwiched by the first support frame part and the second support frame part, the first support frame part includes a first body part having a flat plate-shaped frame shape and a first engaging portion protruded from the first body part to a thickness direction of the support frame for pellicle, and the second support frame part includes a second body part having a flat plate-shaped frame shape and a second engaging portion of the second body part engaging with the first engaging portion being arranged in a concave part provided in the thickness direction of the support frame for pellicle.
    Type: Application
    Filed: November 20, 2020
    Publication date: March 18, 2021
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Akira ISHIKAWA, Atsushi OKUBO, Yosuke ONO, Kazuo KOHMURA
  • Patent number: 10895805
    Abstract: A method for producing a pellicle according to the one embodiment of the present invention produces a pellicle including a pellicle film and a pellicle frame supporting an outer peripheral portion of the pellicle film. The method includes forming the pellicle film on a substrate, and bonding a pressure-sensitive adhesive sheet, that is elastic and has a pressure-sensitive adhesive force thereof decreased upon receipt of external stimulation, to each of two surfaces of the substrate; making a notch inside a part of the substrate, the part having the pressure-sensitive adhesive sheets bonded thereto; separating a substrate outer peripheral portion outer to the notch of the substrate, in a state where the pressure-sensitive adhesive sheets are bonded to the substrate, to form a pellicle frame; and stimulating the pressure-sensitive adhesive sheets to peel off the pressure-sensitive adhesive sheets.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: January 19, 2021
    Assignees: MITSUI CHEMICALS, INC., TAZMO CO., LTD.
    Inventors: Kazuo Kohmura, Daiki Taneichi, Yosuke Ono, Hisako Ishikawa, Tsuneaki Biyajima, Yasuyuki Sato, Toshiaki Hirota
  • Publication number: 20210011372
    Abstract: Provided is a supporting frame in which a vent hole detachably arranging a filter and to which a pellicle film for extreme ultraviolet lithography can be attached. A support frame according to an embodiment of the present invention is a support frame for arranging a pellicle film, the support frame has a through hole being made from a hole extending along a first direction, the first direction being almost parallel to a surface direction of the pellicle film, and a hole extending along a second direction, the second direction not being parallel to the first direction; and the support frame includes a filter, the filter arranged at an inside of the through hole or at an end of the through hole, and the filter is arranged apart from the pellicle film.
    Type: Application
    Filed: September 25, 2020
    Publication date: January 14, 2021
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Akira ISHIKAWA, Atsushi OKUBO, Yosuke ONO, Kazuo KOHMURA
  • Publication number: 20200401039
    Abstract: To provide a pellicle in which outgas from an adhesive layer is suppressed. The pellicle includes a pellicle film, a support frame for supporting the pellicle film, a protrusion part arranged in the support frame, a first adhesive layer arranged on the protrusion part; and an inorganic material layer arranged at a position closer to the pellicle film than the first adhesive layer. The inorganic material layer may include a first inorganic material layer arranged at a first side surface of the first adhesive layer, the first side surface of the first adhesive layer intersecting the pellicle film, and arranged at a position closer to the pellicle film.
    Type: Application
    Filed: September 3, 2020
    Publication date: December 24, 2020
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Yosuke ONO, Kazuo KOHMURA, Atsushi OKUBO, Daiki TANEICHI, Hisako ISHIKAWA, Tsuneaki BIYAJIMA
  • Publication number: 20200377772
    Abstract: The purpose of the present invention is to provide a semiconductor substrate manufacturing method, which prevents detachment of a semiconductor wafer being ground, and which prevents cracking or chipping in a semiconductor substrate obtained. In order to solve the problem, the semiconductor substrate manufacturing method comprises: a polyimide layer forming step of forming a polyimide layer on a support material; a wafer attaching step of affixing the support material and a semiconductor wafer to each other with the polyimide layer disposed therebetween; a wafer grinding step of grinding the semiconductor wafer; a support material peeling step of peeling the support material from the polyimide layer; and a polyimide layer peeling step of peeling the polyimide layer from the semiconductor wafer. The polyimide layer includes polyimide which includes a benzophenone skeleton and an aliphatic structure, wherein an amine equivalent weight is 4000 to 20000.
    Type: Application
    Filed: April 19, 2018
    Publication date: December 3, 2020
    Applicant: Mitsui Chemicals, Inc.
    Inventors: Jun KAMADA, Kaichiro HARUTA, Takashi UNEZAKI, Kiyomi IMAGAWA, Kenichi FUJII, Yasuhisa KAYABA, Kazuo KOHMURA
  • Publication number: 20200181457
    Abstract: Provided is an adhesive member including: a base material having an uneven shape on at least one surface; and a surface layer covering at least a portion of the surface having the uneven shape on the base material.
    Type: Application
    Filed: July 10, 2018
    Publication date: June 11, 2020
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Jun KAMADA, Tomoya MATAYOSHI, Michio ERIGUCHI, Kaichiro HARUTA, Kenichi FUJII, Takashi UNEZAKI, Kazuo KOHMURA
  • Publication number: 20200168476
    Abstract: This method for producing a semiconductor device comprises: a first step wherein a plurality of semiconductor chips are affixed onto a supporting substrate such that circuit surfaces of the semiconductor chips face the supporting substrate; a second step wherein a plurality of sealed layers are formed at intervals by applying the sealing resin onto the semiconductor chips by three-dimensional modeling method, each sealed layer containing one or more semiconductor chips embedded in a sealing resin; a third step wherein the sealed layers are cured or solidified; and a fourth step wherein sealed bodies are obtained by separating the cured or solidified sealed layers from the supporting substrate.
    Type: Application
    Filed: May 10, 2018
    Publication date: May 28, 2020
    Applicant: Mitsui Chemicals, Inc.
    Inventors: Jun KAMADA, Kaichiro HARUTA, Yasuhisa KAYABA, Kazuo KOHMURA, Yoichi KODAMA
  • Patent number: 10606169
    Abstract: The purpose of the present invention is to provide: a pellicle frame which is not susceptible to deterioration even if irradiated with short-wavelength light such as excimer light, and which is not susceptible to generation of an outgas or foreign substance; and a pellicle which uses this pellicle frame. In order to achieve the above-described purpose, this pellicle frame for supporting the outer periphery of a pellicle film is configured to comprise a frame and a film that is formed on the surface of the frame and contains a polyimide resin.
    Type: Grant
    Filed: August 15, 2016
    Date of Patent: March 31, 2020
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Kazuo Kohmura, Takashi Kozeki, Daiki Taneichi, Shintaro Maekawa, Yosuke Ono, Tsuneaki Biyajima
  • Patent number: 10585348
    Abstract: Provided are a pellicle for extreme ultraviolet light lithography, a method for producing the same, and an exposure method. A pellicle according to the present invention includes a first frame having a pellicle film located thereon; a second frame supporting the first frame; a through-hole running through the first frame; and a filter covering the through-hole on the side of a surface of the first frame on which the pellicle film is located. The through-hole may run through the pellicle film; and the filter may be located on the pellicle film. The filter may be located, adjacent to the pellicle film, on the first frame.
    Type: Grant
    Filed: March 9, 2017
    Date of Patent: March 10, 2020
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Kazuo Kohmura, Daiki Taneichi, Takashi Kozeki, Yosuke Ono, Hisako Ishikawa, Tsuneaki Biyajima, Atsushi Okubo, Yasuyuki Sato, Toshiaki Hirota
  • Publication number: 20200064729
    Abstract: A pellicle for EUV exposure that has a high transmittance to EUV light, causes little outgassing, and is not much contaminated, and a method for manufacturing the same are provided. A pellicle (100) includes a pellicle film (101); a support frame (103); and a first adhesive layer (109) provided at an end of the support frame, the end being opposite to an end on which the pellicle film is extended. The pellicle further includes an inorganic layer (111) on a side surface of the first adhesive layer, the side surface extending in a direction crossing a surface of the pellicle film, and the pellicle film being extended on the side surface. The inorganic layer has a mass absorption coefficient (?m) in the range of 5×103 cm2/g to 2×105 cm2/g.
    Type: Application
    Filed: February 9, 2018
    Publication date: February 27, 2020
    Applicant: Mitsui Chemicals, Inc.
    Inventors: Kazuo KOHMURA, Yosuke ONO, Atsushi OKUBO, Daiki TANEICHI, Hisako ISHIKAWA, Tsuneaki BIYAJIMA
  • Publication number: 20200048515
    Abstract: A body, comprising stacked substrates, wherein: a first substrate, an adhesion layer comprising a reaction product of a compound (A), which has a cationic functional group containing at least one of a primary nitrogen atom or a secondary nitrogen atom and which has a defined weight average molecular weight, and a crosslinking agent (B), which has three or more —C(?O)OX groups in a molecule, in which from one to six of the three or more —C(?O)OX groups are —C(?O)OH groups and which has a weight average molecular weight of from 200 to 600, X is a hydrogen atom or an alkyl group having from 1 to 6 carbon atoms, and a second substrate, are layered in this order, and the compound (A) comprises at least one selected from the group consisting of a defined aliphatic amine and a defined compound having a siloxane bond and an amino group.
    Type: Application
    Filed: April 24, 2018
    Publication date: February 13, 2020
    Applicant: Mitsui Chemicals, Inc.
    Inventors: Jun KAMADA, Kazuo KOHMURA, Yasuhisa KAYABA
  • Patent number: 10488751
    Abstract: Provided are a pellicle for extreme ultraviolet light lithography, a production method thereof, and an exposure method. A pellicle according to the present invention includes a first frame having a pellicle film located thereon; a second frame including a thick portion including a first surface carrying a surface of the first frame opposite to a surface on which the pellicle film is located, and also including a second surface connected with the first surface and carrying a side surface of the first frame, the second frame enclosing the pellicle film and the first frame; a through-hole provided in the thick portion of the second frame; and a filter located on an outer side surface of the second frame and covering the through-hole, the outer side surface crossing the surface of the first frame on which the pellicle film is located.
    Type: Grant
    Filed: March 9, 2017
    Date of Patent: November 26, 2019
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Kazuo Kohmura, Daiki Taneichi, Yosuke Ono, Hisako Ishikawa, Tsuneaki Biyajima, Atsushi Okubo, Yasuyuki Sato, Toshiaki Hirota
  • Publication number: 20190235377
    Abstract: The present invention provides; a pellicle frame which can effectively inhibit distortion of the photo mask (8) caused by mounting the pellicle (1), and which does not have a complex shape, and a pellicle which uses said pellicle frame are provided, and a manufacturing method of a blackened pellicle frame is also provided which can reduce the defect of the surface flickering under concentrated light and which facilitates inspection of the foreign matter adhesion prior to use. The present invention relates to a pellicle frame with an anodized film on a surface of an aluminum alloy frame, characterized in that: the aluminum alloy frame comprises an aluminum alloy which contains Ca: 5.0 to 10.
    Type: Application
    Filed: June 30, 2017
    Publication date: August 1, 2019
    Inventors: Yoshihiro TAGUCHI, Kazuo KOHMURA, Daiki TANEICHI
  • Publication number: 20190129300
    Abstract: Provided are a pellicle film, a pellicle frame and a pellicle having a higher EUV transmittance. An exposure pattern plate capable of performing EUV lithography with the pellicle film, the pellicle frame or the pellicle, and a method for producing a semiconductor device, are provided. A pellicle film for exposure extendable over an opening of a support frame and having a thickness of 200 nm or less is provided. The film includes a carbon nanotube sheet. The carbon nanotube sheet includes bundles each including a plurality of carbon nanotubes, the bundles each have a diameter of 100 nm or shorter, and the bundles are aligned in a planar direction in the carbon nanotube sheet.
    Type: Application
    Filed: December 18, 2018
    Publication date: May 2, 2019
    Applicants: MITSUI CHEMICALS, INC., NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Yosuke Ono, Atsushi Okubo, Kazuo Kohmura, Atsuko Sekiguchi, Yuichi Kato, Takeo Yamada
  • Publication number: 20190121229
    Abstract: Provided is a pellicle film, a pellicle frame and a pellicle for EUV decreased in the amount of dust or the like attached thereto, and a method for producing the same. Provided is a method for producing a pellicle including forming a pellicle film above a substrate; forming a metal mask on a surface of the substrate opposite to a surface having the pellicle film formed thereon; removing a part of the substrate from the side of the metal mask; and removing the metal mask. In an embodiment, the present invention provides a pellicle film, a pellicle frame and a pellicle for EUV decreased in the amount of dust or the like attached thereto, and a method for producing the same.
    Type: Application
    Filed: December 17, 2018
    Publication date: April 25, 2019
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Atsushi Okubo, Yosuke Ono, Kazuo Kohmura, Yasuhisa Fujii, Wataru Yoshikawa