Abstract: A method of manufacturing a bonded substrate includes: preparing one or plurality of products to be bonded, each including a brazing material layer and a copper plate laminated on both main surfaces of a ceramic substrate, laminating, one or a plurality of products bonded and a pair of clamping members that clamp them while providing a mold releasing layer between each thereof, heating the one or the plurality of products while pressing the one or the plurality of products in the pair of clamping members to obtain the one or the plurality of bonded substrates in which the ceramic substrate and the copper plate are bonded with a bonding layer, and removing the mold releasing layer from the bonded substrate by dissolving a portion in contact with the mold releasing layer of the copper plate included in the bonded substrate by wet etching.

Abstract: Provided is a liquid crystal display device capable of switching between a transparent state and a scattering state, reducing or preventing a decrease in transmittance in the transparent state, and reducing or preventing a decrease in luminance in the panel central portion in the scattering state. The liquid crystal display device includes, sequentially from its viewing surface side toward its back surface side: a first liquid crystal panel; a light source; and a second liquid crystal panel, the first liquid crystal panel including a polymer dispersed liquid crystal containing a polymer network and liquid crystal components, the light source being configured to irradiate a back surface side main surface of the first liquid crystal panel with light from an oblique direction.

Abstract: An assembled battery monitoring device in the present disclosure includes: an excitation signal processor generates a excitation signal by processing an in-phase signal of an orthogonal reference signal generated by a signal generator; a current exciter generates an excitation current based on the excitation signal according to voltage signals, and energizes a battery cell; and an impedance measurer measures an AC impedance of the battery cell based on the excitation current measured by the current measurer and a voltage of the battery cell measured by the voltage measurer.

Abstract: An adhesive composition contains a resin component, a thermal crosslinking agent, and a curing agent, in which the resin component contains a resin having a maleimide group. In a method for producing a semiconductor device having a plurality of connection units for connecting a semiconductor chip and a wiring circuit substrate to each other, or for connecting a plurality of semiconductor chips to each other, a first connection unit is electrically connected to a second connection unit, and at least a portion of the first and second connection units is sealed using the adhesive composition.

Abstract: A battery monitoring device for monitoring an assembled battery having multiple battery cells includes: a range specifying unit that specifies a detection range; a voltage detection unit that detects a voltage of each battery cell in the detection range, includes an A/D converter for inputting a voltage corresponding to the voltage of each battery cell and a digital filter for inputting a digital signal output from the A/D converter and functioning as a low pass filter, and outputs an output signal of the digital filter as a detection signal representing a detection result of the voltage of each battery cell; and a characteristic setting unit that sets a characteristic of the digital filter.

Abstract: A battery monitor system includes: a reference signal generation unit; an excitation signal generation unit; a current generation unit for an excitation current; a current measurement unit for the excitation current; a voltage measurement unit for a voltage of each battery cell; an impedance measurement unit for an impedance of each battery cell; a noise measurement unit for a noise voltage; and a control unit. The control unit selects one or more battery cells not a measurement target, and the noise measurement unit measures the noise voltage near a measurement frequency equal to a frequency of an orthogonal reference signal while operating the voltage measurement unit without operating the current generation unit.

Abstract: Disclosed is a method for manufacturing a semiconductor device which includes: a semiconductor chip; a substrate and/or another semiconductor chip; and an adhesive layer interposed therebetween. This method comprises the steps of: heating and pressuring a laminate having: the semiconductor chip; the substrate; the another semiconductor chip or a semiconductor wafer; and the adhesive layer by interposing the laminate with pressing members for temporary press-bonding to thereby temporarily press-bond the substrate and the another semiconductor chip or the semiconductor wafer to the semiconductor chip; and heating and pressuring the laminate by interposing the laminate with pressing members for main press-bonding, which are separately prepared from the pressing members for temporary press-bonding, to thereby electrically connect a connection portion of the semiconductor chip and a connection portion of the substrate or the another semiconductor chip.

Abstract: A battery monitoring device includes multiple A/D converters, a digital filter, an anti-alias filter, and a detection controller. The multiple A/D converters are provided in correspondence with multiple battery cells in an assemble battery. Each of the A/D converters is configured to receive an input voltage according to a voltage of corresponding one of the battery cells. The digital filter is configured to receive a digital signal output from each of the A/D converters and function as a low-pass filter. The anti-alias filter is configured to suppress aliasing by the digital filter. The detection controller is configured to control operation of the A/D converters so that the input voltage input to each of the A/D converters is A/D converted at a same timing, and detect the voltage of each of the battery cells based on an output signal of the digital filter.

Abstract: An assembled battery monitoring device in the present disclosure includes: an excitation signal processor generates a excitation signal by processing an in-phase signal of an orthogonal reference signal generated by a signal generator; a current exciter generates an excitation current based on the excitation signal according to voltage signals, and energizes a battery cell; and an impedance measurer measures an AC impedance of the battery cell based on the excitation current measured by the current measurer and a voltage of the battery cell measured by the voltage measurer.

Abstract: A correction current output circuit comprises a first voltage dividing circuit for generating a voltage in which an output voltage from a bandgap reference voltage circuit is divided in multiple stages, first and second correction circuits connected between a power supply and a ground, and a second voltage dividing circuit for dividing the above voltage in multiple stages in a path in which a positive temperature characteristic voltage is generated with the band gap reference voltage circuit. Current output terminals of a the second transistor of the first correction circuit and a first transistor of the second correction circuit are connected to a common connection point, and a current for correcting the temperature characteristic of a reference voltage generation circuit is output from the common connection point.

Abstract: A semiconductor device includes: a first semiconductor chip in which a plurality of capacitors are provided by integrating trench capacitors to form a filter that receives, as an input, a physical quantity relating to a plurality of battery cells for forming an assembled battery; a second semiconductor chip in which a circuit is provided, the circuit executing a predetermined process for monitoring the assembled battery based on an output of the filter; and one package that accommodates the first semiconductor chip and the second semiconductor chip.

Abstract: Disclosed is an adhesive composition containing a resin component, a thermal crosslinking agent, and a curing agent, in which the resin component includes a resin having a maleimide group.

Abstract: A fluctuation suppression circuit suppresses fluctuation of a reference voltage supplied to a switched capacitor circuit having a differential configuration. The switched capacitor circuit includes an input capacitor for charging an input voltage and a reference capacitor for charging the reference voltage. The input capacitor and the reference capacitor are separately disposed. The fluctuation suppression circuit includes an electric charge supply circuit. The electric charge supply circuit generates an offset electric charge by adopting a predetermined offset voltage, for offsetting a charged or discharged electric charge generated in the switched capacitor circuit, and supplies the offset electric charge to two reference input nodes, which are supplied with the reference voltage, in the switched capacitor circuit.

Abstract: An A/D conversion device, which operates in one mode including at least one of a ?? mode, a cyclic mode, and a hybrid mode, includes: a first block that processes an analog input signal by a first amplifier; a second block including a second amplifier; a quantization unit that quantizes one of outputs of the first and second blocks; and a control circuit that switches the mode to perform a control corresponding to the mode.

Abstract: An A/D conversion device, which operates in one mode including at least one of a ?? mode, a cyclic mode, and a hybrid mode, includes: a first block that processes an analog input signal by a first amplifier; a second block including a second amplifier; a quantization unit that quantizes one of outputs of the first and second blocks; and a control circuit that switches the mode to perform a control corresponding to the mode.

Abstract: A correction current output circuit comprises a first voltage dividing circuit for generating a voltage in which an output voltage from a bandgap reference voltage circuit is divided in multiple stages, first and second correction circuits connected between a power supply and a ground, and a second voltage dividing circuit for dividing the above voltage in multiple stages in a path in which a positive temperature characteristic voltage is generated with the band gap reference voltage circuit. Current output terminals of a the second transistor of the first correction circuit and a first transistor of the second correction circuit are connected to a common connection point, and a current for correcting the temperature characteristic of a reference voltage generation circuit is output from the common connection point.

Abstract: There is disclosed a method for manufacturing a semiconductor device comprising a semiconductor chip having a connection portion and a wiring circuit board having a connection portion, the respective connection portions being electrically connected to each other, or a semiconductor device comprising a plurality of semiconductor chips having connection portions, the respective connection portions being electrically connected to each other. The connection portions consist of metal.

Abstract: Disclosed is a method for manufacturing a semiconductor device which includes: a semiconductor chip; a substrate and/or another semiconductor chip; and an adhesive layer interposed therebetween. This method comprises the steps of: heating and pressuring a laminate having: the semiconductor chip; the substrate; the another semiconductor chip or a semiconductor wafer; and the adhesive layer by interposing the laminate with pressing members for temporary press-bonding to thereby temporarily press-bond the substrate and the another semiconductor chip or the semiconductor wafer to the semiconductor chip; and heating and pressuring the laminate by interposing the laminate with pressing members for main press-bonding, which are separately prepared from the pressing members for temporary press-bonding, to thereby electrically connect a connection portion of the semiconductor chip and a connection portion of the substrate or the another semiconductor chip.

Abstract: A voltage detection device comprises a voltage detection circuit, which is a fully-differential type and a control circuit for controlling an operation of the voltage detection circuit. The voltage detection circuit includes a switched capacitor circuit, a differential amplifier, a common mode feedback circuit for controlling a common mode level of an output voltage of the differential amplifier and a bias circuit for supplying biases to the differential amplifier and the common mode feedback circuit. The control circuit controls the voltage detection circuit to execute intermittently a detection operation for detecting the voltage. The control circuit controls the voltage detection circuit to execute a pseudo operation of an execution period, which is shorter than that of the detection operation, during a transition period from a stop state, in which no detection operation is executed, to the operation state, in which the detection operation is executed.

Abstract: Disclosed is a method for manufacturing a semiconductor device which includes: a semiconductor chip; a substrate and/or another semiconductor chip; and an adhesive layer interposed therebetween. This method comprises the steps of: heating and pressuring a laminate having: the semiconductor chip; the substrate; the another semiconductor chip or a semiconductor wafer; and the adhesive layer by interposing the laminate with pressing members for temporary press-bonding to thereby temporarily press-bond the substrate and the another semiconductor chip or the semiconductor wafer to the semiconductor chip; and heating and pressuring the laminate by interposing the laminate with pressing members for main press-bonding, which are separately prepared from the pressing members for temporary press-bonding, to thereby electrically connect a connection portion of the semiconductor chip and a connection portion of the substrate or the another semiconductor chip.