Abstract: A manufacturing method for a semiconductor device in which connection portions of a semiconductor chip are electrically connected to connection portions of a wiring circuit substrate or a semiconductor device in which connection portions of a plurality of semiconductor chips are electrically connected to each other, the method comprising a step of sealing at least part of the connection portions with an adhesive for a semiconductor comprising a compound having a group represented by the following formula (1): wherein R1 represents an electron-donating group.

Abstract: A manufacturing method for a semiconductor device in which connection portions of a semiconductor chip are electrically connected to connection portions of a wiring circuit substrate or a semiconductor device in which connection portions of a plurality of semiconductor chips are electrically connected to each other, the method comprising a step of sealing at least part of the connection portions with an adhesive for a semiconductor comprising a compound having a group represented by the following formula (1): wherein R1 represents an electron-donating group.

Abstract: A semiconductor encapsulation adhesive composition comprising (a) an epoxy resin, (b) a curing agent and (c) an antioxidant.

Abstract: The present invention relates to a semiconductor-encapsulating adhesive, a semiconductor-encapsulating film-form adhesive, a method for producing a semiconductor device, and a semiconductor device. The present invention provides a semiconductor-encapsulating adhesive comprising (a) an epoxy resin, and (b) a compound formed of an organic acid reactive with an epoxy resin and a curing accelerator.

Abstract: A first part circuit and an operational amplifier form a level shift circuit, which selects either one of battery cells forming an assembled battery and extracts and holds a voltage representing an inter-terminal voltage of a selected battery cell. A second part circuit and the operational amplifier form a residual voltage generation circuit, which generates a residual voltage by amplifying a differential voltage between a conversion subject voltage and an analog voltage corresponding to a conversion result of an A/D conversion circuit and applies the residual voltage to the A/D conversion circuit as a conversion subject voltage. A switchover circuit operates the operational amplifier as either one of the level shift circuit and the residual voltage generation circuit and switches over a connection-state to apply a voltage held by the level shift circuit to the A/D conversion circuit and the residual voltage generation circuit as a conversion subject voltage.

Abstract: A semiconductor encapsulation adhesive composition comprising (a) an epoxy resin, (b) a curing agent and (c) an antioxidant.

Abstract: A route switching circuit includes: a pair of normal detection routes that output voltages of a positive side connection point and a negative side connection point, which are different from each other, in multiple batteries for constituting an assembled battery; and a pair of diagnosis detection routes that output the voltages of the positive side connection point and the negative side connection point, and confirm a connection state of the normal detection routes by using the normal detection routes, which output at least one of a voltage of a positive side battery connected to a positive side from the positive side connection point and a voltage of a negative side battery connected to a negative side from the negative side connection point.

Abstract: An adhesive for a semiconductor, comprising an epoxy resin, a curing agent, and a compound having a group represented by the following formula (1): wherein R1 represents an electron-donating group.

Abstract: An adhesive for a semiconductor, containing an epoxy resin, a curing agent, and a fluxing agent comprising a compound having a group represented by the following formula (1-1) or (1-2): wherein R1 represents an electron-donating group; and a plurality of R1 may be identical or different from each other.

Abstract: A manufacturing method for a semiconductor device in which connection portions of a semiconductor chip are electrically connected to connection portions of a wiring circuit substrate or a semiconductor device in which connection portions of a plurality of semiconductor chips are electrically connected to each other, the method comprising a step of encapsulating at least part of the connection portions with an adhesive for a semiconductor containing a compound having a group represented by the following formula (1-1) or (1-2): wherein R1 represents an electron-donating group; and a plurality of R1 may be identical or different from each other.

Abstract: A logic signal transmission circuit includes a driving circuit, an isolation section, and a latch section. The driving circuit converts an input digital signal to a differential digital signal. The isolation section blocks direct current and passes the differential digital signal. The latch section has even numbers of inverters which are connected in a loop and output a logic signal by turning ON and OFF a power supply voltage in a complementary manner. An input impedance of the latch section is set so that when a logic level of the differential digital signal changes, a transient voltage inputted through the isolation section to the latch section changes across a threshold voltage of the latch section. When the transient voltage changes across the threshold voltage, a logic level of the logic signal changes.

Abstract: The present invention relates to a semiconductor-encapsulating adhesive, a semiconductor-encapsulating film-form adhesive, a method for producing a semiconductor device, and a semiconductor device. The present invention provides a semiconductor-encapsulating adhesive comprising (a) an epoxy resin, and (b) a compound formed of an organic acid reactive with an epoxy resin and a curing accelerator.

Abstract: In a voltage detecting device, a control unit turns on first switches and fifth switches corresponding to a plurality of unit batteries of an assembled battery to charge electric charge to first capacitors. The control unit simultaneously turns off at least one of the first switches or the fifth switches to hold the electric charge in the first capacitors. While selecting one of the unit batteries in a predetermined order as a target unit battery for voltage detection, the control unit temporarily turns off a fourth switch to reset electric charge of a second capacitor, and then turns of second switches and third switches in a state where one of the first switches and one of the fifth switches corresponding to the target unit battery are kept in an off state, thereby to detect a voltage of the target unit battery.

Abstract: The present invention relates to a semiconductor-encapsulating adhesive, a semiconductor-encapsulating film-form adhesive, a method for producing a semiconductor device, and a semiconductor device. The present invention provides a semiconductor-encapsulating adhesive comprising (a) an epoxy resin, and (b) a compound formed of an organic acid reactive with an epoxy resin and a curing accelerator.

Abstract: A semiconductor encapsulation adhesive composition comprising (a) an epoxy resin, (b) a curing agent and (c) an antioxidant.

Abstract: A control circuit connects a capacitor to an input terminal and an output terminal of an operational amplifier and applies a signal charge to charge the capacitor with a switch being turned off. Thus, a conversion voltage corresponding to the signal charge is outputted from the operational amplifier. The control circuit then sets charges, which correspond to the conversion voltage, in capacitors and reallocates the charges among the capacitors by connecting non-common electrodes of the capacitors to either one of a plurality of reference voltage lines in accordance with a conversion result of an A/D conversion circuit with the capacitor being connected to the input terminal and the output terminal of the operational amplifier. The control circuit thereafter performs, a number of times, charge setting, initialization and subsequent charge reallocation in accordance with a residual voltage outputted from the operational amplifier.

Abstract: An amplifier circuit is provided to be switchable between a single end output configuration and a differential output configuration without increasing a circuit area. When first and fourth switches are turned off and a second switch is turned on, a load circuit functions as an active load on a differential pair and a first output terminal is internally disconnected. The amplifier circuit is provided with a single end output configuration and differentially amplifies input voltages inputted to input terminals and outputs an imbalanced signal from a second output terminal. When the first and fourth switches are turned on and the second switch is turned off, the load circuit functions as a load on the differential pair and the first output terminal is internally connected. The amplifier circuit is provided with a differential output configuration and differentially amplifies the input voltages inputted to the input terminals and outputs balanced signals from the output terminals.

Abstract: A thermosetting resin composition for an underfilling of a semiconductor comprising, as essential components, a thermosetting resin, a curing agent, a flux agent and two or more inorganic fillers with different mean particle sizes, wherein the inorganic fillers include an inorganic filler with a mean particle size of no greater than 100 nm and an inorganic filler with a mean particle size of greater than 100 nm.

Abstract: The present invention relates to a semiconductor-encapsulating adhesive, a semiconductor-encapsulating film-form adhesive, a method for producing a semiconductor device, and a semiconductor device. The present invention provides a semiconductor-encapsulating adhesive comprising (a) an epoxy resin, and (b) a compound formed of an organic acid reactive with an epoxy resin and a curing accelerator.

Abstract: A semiconductor encapsulation adhesive composition comprising (a) an epoxy resin, (b) a curing agent and (c) an antioxidant.