Abstract: An ePLX unit includes a logic unit having an SRAM and a MUX, and a switch unit having an SRAM and a TG for establishing wiring connection in the logic unit. When a composite module is set in the first mode, an Add/Flag control unit uses the SRAMs as a data field and a flag field, respectively, to autonomously control the read address of each of the data field and the flag field in accordance with a control flag stored in the flag field. Furthermore, when the composite module is set in the second mode, the Add/Flag control unit writes configuration information into each of the SRAMs to reconfigure a logic circuit. Consequently, the granularity of the circuit configuration can be rendered variable, which allows improvement in flexibility when configuring a function.

Abstract: By activating a word line and a bit line in parallel with a storage transistor set to OFF, the potential conditions of the charge line, and the word line, and the bit line are controlled so that the potential of a body region is increased by a leak current flowing from a connecting node to the body region in a period until the storage transistor is turned ON.

Abstract: A semiconductor device includes a decoder receiving first multiplier data of 3 bits indicating a multiplier to output a shift flag, an inversion flag, and an operation flag in accordance with Booth's algorithm, and a first partial product calculation unit receiving first multiplicand data of 2 bits indicating a multiplicand, a shift flag, an inversion flag, and an operation flag to select one of the higher order bit and lower order bit of the first multiplicand data based on the shift flag, invert or non-invert the selected bit based on the inversion flag, select one of the inverted or non-inverted data and data of a predetermined logic level based on the operation flag, and output the selected data as partial product data indicating the partial product of the first multiplier data and the first multiplicand data.

Abstract: One memory cell is formed of a first port access transistor, a second port access transistor and a storage transistor coupled commonly to these access transistors. The first port access transistor is coupled to a first electrode of the storage transistor, and the second port access transistor is coupled to a third electrode of the storage transistor. These first and second port access transistors enter a selected state when first and second port word lines are selected, respectively, to couple corresponding second and third electrodes of the corresponding storage transistor to first and second port bit lines, respectively. A dual-port memory cell of which scalability can follow miniaturization in a process can be provided.

Abstract: When data “1” is stored in a memory cell, a bit line is driven to an H level (control line drive potential) and the other bit line is driven to an L level (reference potential) when a sense operation is completed. When a verify write operation is initiated, a charge line is driven from an H level (power supply potential) to an L level (reference potential). By the GIDL current from a source line, accumulation of holes is initiated again for a storage node subsequent to discharge of holes, whereby the potential of the storage node rises towards an H level (period ?). When the charge line is driven to an H level from an L level, the potential of the storage node further rises (period ?).

Abstract: During a stand-by state in which power supply is cut off, a high-voltage power supply control circuit isolates a global negative voltage line transmitting a negative voltage and a local negative voltage line provided corresponding to each respective sub array block from each other and isolates a global ground line and a local ground line transmitting a ground voltage from each other. These local ground line and local negative voltage line are charged to a high voltage level through a high voltage line before cut-off from the corresponding power supply. A leakage current path from a word line to the negative voltage line or the ground line is cut off, so that the word line in a non-selected state can reliably be maintained at a non-selection voltage. Thus, in a low power consumption stand-by mode, data stored in a memory cell can be held in a stable manner.

Abstract: A unit operator cell includes a plurality of SOI (Silicon on Insulator) transistors, write data is stored in a body region of at least two SOI transistors, and the storage SOI transistors are connected in series with each other to a read port or each of the storage SOI transistors is singly connected to the read port. Therefore, an AND operation result or a NOT operation result of data stored in the unit operator cells can be obtained, and operation processing can be performed only by writing and reading data. A semiconductor signal processing device that can perform logic operation processing and arithmetic operation processing at high speed is implemented with low power consumption and a small occupation area.

Abstract: In a content addressable memory device, before search operations in two TCAM cells connected to first and second match lines, respectively, a memory controller connects the first match line to a power source and connects the second match line to a ground, and then connects the first and second match lines to each other so as that electric potentials of the first and second match lines are the same as each other.

Abstract: Conductive lines constituting word lines of memory cells and conductive lines constituting memory cell plate electrodes are formed in the same interconnecting layer in a memory device including a plurality of memory cells each including a capacitor for storing data in an electrical charge form. By forming the capacitors of the memory cells into a planar capacitor configuration, a step due to the capacitors is removed. Thus, a dynamic semiconductor memory device can be formed through CMOS process, and a dynamic semiconductor memory device suitable for merging with logic is achieved. Data of 1 bit is stored by two memory cells, and data can be reliably stored even if the capacitance value of the memory cell is reduced due to the planar type capacitor.

Abstract: A CAM (Content Addressable Memory) cell includes first and second data storage portions storing data, horizontal port write gates for storing data applied through a match line pair in the data storage portions in a data write through a horizontal port, and search/read gates for driving the match lines of the match line pair in accordance with the data stored in the data storage portions in a search operation and in a data read through the horizontal port. The match lines are used as horizontal bit line pair, or signal lines for accessing the horizontal port. As the first and second data storage portions are used, it becomes possible to store ternary data, and accordingly, a write mask function of inhibiting a data write at a destination of data transfer is realized. Further, as the CAM cell is used, an arithmetic/logic operation following a search process can be executed selectively, and high speed data writing/reading becomes possible.

Abstract: By activating a word line and a bit line in parallel with a storage transistor set to OFF, the potential conditions of the charge line, and the word line, and the bit line are controlled so that the potential of a body region is increased by a leak current flowing from a connecting node to the body region in a period until the storage transistor is turned ON.

Abstract: Conductive lines constituting word lines of memory cells and conductive lines constituting memory cell plate electrodes are formed in the same interconnecting layer in a memory device including a plurality of memory cells each including a capacitor for storing data in an electrical charge form. By forming the capacitors of the memory cells into a planar capacitor configuration, a step due to the capacitors is removed. Thus a dynamic semiconductor memory device can be formed through CMOS process, and a dynamic semiconductor memory device suitable for merging with logic is achieved. Data of 1 bit is stored by two memory cells, and data can be reliably stored even if the capacitance value of the memory cell is reduced due to the planar type capacitor.

Abstract: A CAM (Content Addressable Memory) cell includes first and second data storage portions storing data, horizontal port write gates for storing data applied through a match line pair in the data storage portions in a data write through a horizontal port, and search/read gates for driving the match lines of the match line pair in accordance with the data stored in the data storage portions in a search operation and in a data read through the horizontal port. The match lines are used as horizontal bit line pair, or signal lines for accessing the horizontal port. As the first and second data storage portions are used, it becomes possible to store ternary data, and accordingly, a write mask function of inhibiting a data write at a destination of data transfer is realized. Further, as the CAM cell is used, an arithmetic/logic operation following a search process can be executed selectively, and high speed data writing/reading becomes possible.

Abstract: During a stand-by state in which power supply is cut off, a high-voltage power supply control circuit isolates a global negative voltage line transmitting a negative voltage and a local negative voltage line provided corresponding to each respective sub array block from each other and isolates a global ground line and a local ground line transmitting a ground voltage from each other. These local ground line and local negative voltage line are charged to a high voltage level through a high voltage line before cut-off from the corresponding power supply. A leakage current path from a word line to the negative voltage line or the ground line is cut off, so that the word line in a non-selected state can reliably be maintained at a non-selection voltage. Thus, in a low power consumption stand-by mode, data stored in a memory cell can be held in a stable manner.

Abstract: The present invention aims at providing a semiconductor memory device that can be manufactured by a MOS process and can realize a stable operation. A storage transistor has impurity diffusion regions, a channel formation region, a charge accumulation node, a gate oxide film, and a gate electrode. The gate electrode is connected to a gate line and the impurity diffusion region is connected to a source line. The storage transistor creates a state where holes are accumulated in the charge accumulation node and a state where the holes are not accumulated in the charge accumulation node to thereby store data “1” and data “0”, respectively. An access transistor has impurity diffusion regions, a channel formation region, a gate oxide film, and a gate electrode. The impurity diffusion region is connected to a bit line.

Abstract: Conductive lines constituting word lines of memory cells and conductive lines constituting memory cell plate electrodes are formed in the same interconnecting layer in a memory device including a plurality of memory cells each including a capacitor for storing data in an electrical charge form. By forming the capacitors of the memory cells into a planar capacitor configuration, a step due to the capacitors is removed. Thus. a dynamic semiconductor memory device can be formed through CMOS process, and a dynamic semiconductor memory device suitable for merging with logic is achieved. Data of 1 bit is stored by two memory cells, and data can be reliably stored even if the capacitance value of the memory cell is reduced due to the planar type capacitor.

Abstract: One memory cell is formed of a first port access transistor, a second port access transistor and a storage transistor coupled commonly to these access transistors. The first port access transistor is coupled to a first electrode of the storage transistor, and the second port access transistor is coupled to a third electrode of the storage transistor. These first and second port access transistors enter a selected state when first and second port word lines are selected, respectively, to couple corresponding second and third electrodes of the corresponding storage transistor to first and second port bit lines, respectively. A dual-port memory cell of which scalability can follow miniaturization in a process can be provided.

Abstract: When data “1” is stored in a memory cell, a bit line is driven to an H level (control line drive potential) and the other bit line is driven to an L level (reference potential) when a sense operation is completed. When a verify write operation is initiated, a charge line is driven from an H level (power supply potential) to an L level (reference potential). By the GIDL current from a source line, accumulation of holes is initiated again for a storage node subsequent to discharge of holes, whereby the potential of the storage node rises towards an H level (period ?). When the charge line is driven to an H level from an L level, the potential of the storage node further rises (period ?).

Abstract: Conductive lines constituting word lines of memory cells and conductive lines constituting memory cell plate electrodes are formed in the same interconnecting layer in a memory device including a plurality of memory cells each including a capacitor for storing data in an electrical charge form. By forming the capacitors of the memory cells into a planar capacitor configuration, a step due to the capacitors is removed. Thus, a dynamic semiconductor memory device can be formed through CMOS process, and a dynamic semiconductor memory device suitable for merging with logic is achieved. Data of 1 bit is stored by two memory cells, and data can be reliably stored even if the capacitance value of the memory cell is reduced due to the planar type capacitor.

Abstract: A CAM (Content Addressable Memory) cell includes first and second data storage portions storing data, horizontal port write gates for storing data applied through a match line pair in the data storage portions in a data write through a horizontal port, and search/read gates for driving the match lines of the match line pair in accordance with the data stored in the data storage portions in a search operation and in a data read through the horizontal port. The match lines are used as horizontal bit line pair, or signal lines for accessing the horizontal port. As the first and second data storage portions are used, it becomes possible to store ternary data, and accordingly, a write mask function of inhibiting a data write at a destination of data transfer is realized. Further, as the CAM cell is used, an arithmetic/logic operation following a search process can be executed selectively, and high speed data writing/reading becomes possible.