Abstract: The present invention relates to an electromechanical transducer and a method of producing it, in which the substrate rigidity is maintained to prevent the substrate from being broken during formation of dividing grooves or a film. The electromechanical transducer includes a plurality of elements each having at least one cell. An insulating layer is formed on a first substrate, and gaps are formed in the insulating layer. A second substrate is bonded to the insulating layer provided with the gaps. Then, dividing grooves are formed in the first substrate and are at least partially filled with an insulating member. Then, the thickness of the second substrate bonded to the insulating layer is reduced to form a film.

Abstract: An electromechanical transducer with less characteristic variation and a method of manufacturing the electromechanical transducer is provided. The electromechanical transducer has a plurality of cells constituted of a first electrode, a vibration film provided with a second electrode provided so as to face the first electrode through a gap, and a supporting portion supporting the vibration film. A structure configured to reduce an uneven flatness between the vibration film and the supporting portion is provided at an outer peripheral portion of a gap while a portion of the supporting portion is interposed between the structure and the gap.

Abstract: Provided is a method of manufacturing an electromechanical transducer having a reduced variation in a breakdown strength caused by a variation in flatness of an insulating layer. In the method of manufacturing the electromechanical transducer, a first insulating layer is formed on a first substrate, a barrier wall is formed by removing a part of the first insulating layer, and a second insulating layer is formed on a region of the first substrate after the part of the first insulating layer has been removed. Next, a gap is formed by bonding a second substrate on the barrier wall, and a vibration film that is opposed to the second insulating layer via the gap is formed from the second substrate. In the forming of the barrier wall, a height on a gap side in a direction vertical to the first substrate becomes lower than a height of a center portion.

Abstract: In a fabrication method of fabricating a structure, a basic etching mask corresponding a target shape with a convex corner, and a correction etching mask with a first portion, a second portion and an opening portion are formed on a single-crystal silicon substrate, and the silicon substrate with the basic etching mask and the correction etching mask formed thereon is subjected to an anisotropic etching to form the silicon substrate having the target shape. The first portion extends in a <110> direction, respective ends of the first portion are connected to the basic etching mask. The second portion is connected to a side of the first portion extending in the <110> direction.

Abstract: A method of manufacturing an oscillator device having an oscillator supported relative to a fixed member by a torsion spring for oscillation around a torsion axis and arranged to be driven at a resonance frequency, which method includes a first step for determining an assumed value of an inertia moment weight of the oscillator, a second step for measuring the resonance frequency, a third step for calculating a spring constant of the torsion spring, from the assumed value of the inertia moment weight and the measured resonance frequency obtained at said first and second steps, a fourth step for calculating an adjustment amount for the inertia moment of the oscillator or for the spring constant of the torsion spring, based on the spring constant calculated at said third step and a target resonance frequency determined with respect to the resonance frequency of the oscillator, so as to adjust the resonance frequency to the target resonance frequency, and a fifth step for adjusting the resonance frequency of the

Abstract: Disclosed is an electromechanical transducer, including: a cell including a substrate, a vibration film, and a supporting portion of the vibration film configured to support the vibration film so that a gap is formed between the substrate and the vibration film; and a lead wire that is placed on the substrate with an insulator interposed therebetween and extends to the cell, wherein the insulator has a thickness greater than the thickness of the supporting portion. The electromechanical transducer can reduce parasitic capacitance to prevent an increase in noise, a reduction in bandwidth, and a reduction in sensitivity.

Abstract: The present invention provides an electromechanical transducer which can prevent light from being incident on a receiving face, without deteriorating mechanical characteristics of a vibration film. The electromechanical transducer has at least one cell 2 in which the vibration film 7 containing one electrode 8 out of two electrodes 3 and 8 that are provided so as to interpose a space 5 therebetween is vibratably supported. The electromechanical transducer has a stress relaxation layer formed on the vibration film 7, which has an acoustic impedance matching that of the vibration film 7, and has a light reflection layer 6 formed on the stress relaxation layer 9.

Abstract: An electromechanical transducer includes a first electrode; a silicon oxide film disposed on the first electrode; and a vibration film including a silicon nitride film disposed on the silicon oxide film with a space therebetween and a second electrode disposed on the silicon nitride film so as to oppose the first electrode.

Abstract: A method of producing an electromechanical transducer includes forming an insulating film on a first electrode, forming a sacrificial layer on the insulating film, forming a first membrane on the sacrificial layer, forming a second electrode on the first membrane, forming an etching-hole in the first membrane and removing the sacrificial layer through the etching-hole, and forming a second membrane on the second electrode, and sealing the etching-hole. Forming the second membrane and sealing the etching-hole are performed in one operation.

Abstract: An electromechanical transducer includes a substrate, a first electrode disposed on the substrate, and a vibration film including a membrane disposed on the first electrode with a space therebetween and a second electrode disposed on the membrane so as to oppose the first electrode. The first electrode has a surface roughness value of 6 nm RMS or less.

Abstract: An electromechanical transducer includes multiple elements each including at least one cellular structure, the cellular structure including: a semiconductor substrate, a semiconductor diaphragm, and a supporting portion for supporting the diaphragm so that a gap is formed between one surface of the substrate and the diaphragm. The elements are separated from one another at separating locations of a semiconductor film including the diaphragm. Each of the elements includes in a through hole passing through a first insulating layer including the supporting portion and the semiconductor substrate: a conductor which is connected to the semiconductor film including the diaphragm; and a second insulating layer for insulating the conductor from the semiconductor substrate.

Abstract: An oscillating device includes a supporting portion, a movable portion, a torsion spring that supports the movable portion with respect to the supporting portion so that the movable portion is capable of torsionally vibrating around a torsion axis, and a driving unit that vibrates the movable portion. The torsion spring is formed of single-crystal silicon, and a crystal orientation parallel to the torsion axis of the torsion spring is a [111] orientation.

Abstract: A method of manufacturing an oscillator device having an oscillator supported relative to a fixed member by a torsion spring for oscillation around a torsion axis and arranged to be driven at a resonance frequency, which method includes a first step for determining an assumed value of an inertia moment weight of the oscillator, a second step for measuring the resonance frequency, a third step for calculating a spring constant of the torsion spring, from the assumed value of the inertia moment weight and the measured resonance frequency obtained at said first and second steps, a fourth step for calculating an adjustment amount for the inertia moment of the oscillator or for the spring constant of the torsion spring, based on the spring constant calculated at said third step and a target resonance frequency determined with respect to the resonance frequency of the oscillator, so as to adjust the resonance frequency to the target resonance frequency, and a fifth step for adjusting the resonance frequency of the

Abstract: An oscillator device includes a supporting base plate, a torsion spring, and a movable member, wherein the movable member is supported by the torsion spring, for torsional oscillation relative to the supporting base plate about a torsional axis, wherein the torsion spring has an X-shaped section being perpendicular to the torsional axis and a top surface and a bottom surface each being defined by a (100)-equivalent surface of monocrystal silicon, and wherein a distance L1 connecting bottoms of concavities formed at the top surface and bottom surface, respectively, and a distance L2 connecting bottoms of concavities defined at side surfaces of the X-shaped torsion spring as well as a rate of change ?i of inertia moment of the movable member around the torsion axis, with a change of a thickness t of the supporting base plate, satisfy the following relation: L1/L2=C1?Exp{C2?(?i+C3)}+C4??i+C5 where C1=5.0*10^=?1, C2=?4.4, C3=4.6*10^?2, C4=?6.0*10^?1 and 1.5<C5<1.7.

Abstract: A swing member device comprises a swingable part supported by a supporting part to be swingable around a torsional axis on a supporting base in at least one intrinsic oscillation mode: the swing member device having a temperature-raising unit for raising the temperature of ambient atmosphere in the region of swing motion of the swingable part, the temperature-raising unit raising the temperature of the ambient atmosphere to enable decrease of an influence of an unsteady dragging force caused by the ambient atmosphere.

Abstract: Disclosed is an oscillating system arranged so that a gravity center of a movable member and a torsional axis of a resilient support are easily registered with each other to prevent deformation of the movable member due to its dead weight or deviation of deformation from symmetrical deformation, wherein the oscillating system includes a substrate 301, a movable member 302 with hard magnetic members 310 and 311, resilient supports 304 and 305 for supporting the movable member for torsional vibration about a torsional axis 312 with respect to the substrate, and a magnetic field producing device for driving the movable member relative to the substrate, wherein the movable member 302 has recesses 306 and 307, and wherein the hard magnetic members are fixed while their end portions are aligned with end faces 308 and 309 corresponding to the recesses.

Abstract: A method of manufacturing an oscillator device having a fixed member and an oscillation plate supported by the fixed member through a supporting member for oscillation around a torsion axis, the oscillation plate being driven at a resonance frequency around the torsion axis, includes a frequency regulating step based on an extension member for adjustment of a mass of the oscillation plate, for forming the extension member on the oscillation plate and for adjusting the mass of the oscillation plate by cutting a portion of the extension member with the irradiation of a laser beam, an oscillator assembling step for fixing the fixed member to a fixed base, and a driving member assembling step for fixing a driving member for driving the oscillation plate to the fixed base, wherein at least the driving member assembling step is carried out after the frequency regulating step based on the extension member is performed.

Abstract: An oscillator device includes a supporting base plate, a torsion spring, and a movable member, wherein the movable member is supported by the torsion spring, for torsional oscillation relative to the supporting base plate about a torsional axis, wherein the torsion spring has an X-shaped section being perpendicular to the torsional axis and a top surface and a bottom surface each being defined by a (100)-equivalent surface of monocrystal silicon, and wherein a distance L1connecting bottoms of concavities formed at the top surface and bottom surface, respectively, and a distance L2 connecting bottoms of concavities defined at side surfaces of the X-shaped torsion spring as well as a rate of change ?i of inertia moment of the movable member around the torsion axis, with a change of a thickness t of the supporting base plate, satisfy the following relation: L1/L2=C1?Exp{C2?(?i+C3)}+C4??i+C5 where C1=5.0*10?=?1, C2=?4.4, C3=4.6*10??2, C4=?6.0*10??1 and 1.5<C5<1.7.

Abstract: An oscillator device includes a supporting member, a movable member, an elastic supporting member configured to elastically support the supporting member and the movable member around an oscillation axis, and a driving member configured to drive the movable member, wherein the elastic supporting member includes a plurality of springs and at least one spring constant adjusting member configured to couple the plurality of springs with each other.

Abstract: In a fabrication method of fabricating a structure, a basic etching mask corresponding a target shape with a convex corner, and a correction etching mask with a first portion, a second portion and an opening portion are formed on a single-crystal silicon substrate with a (100) principal face, and the silicon substrate with the basic etching mask and the correction etching mask formed thereon is subjected to an anisotropic etching to form the silicon substrate having the target shape. The first portion extends in a <110> direction, respective ends of the first portion are connected to the basic etching mask, and at least one end of the first portion is connected to the convex corner of the basic etching mask. The second portion is connected to a side of the first portion extending in the <110> direction, the second portion includes at least one convex corner, and the opening portion extends straddling a boundary between the first portion and the second portion.