Abstract: A positive resist composition comprising (A) a resin that is decomposed by the action of an acid to increase solubility in an alkali developing solution and includes a specific repeating unit and (B) a compound that generates an acid upon irradiation of an actinic ray or radiation, and a pattern formation method using the positive resist composition.

Abstract: A positive photoresist composition containing: (A) a resin which contains at least one of a repeating unit represented by the formula (IA) defiend herein and a repeating unit represented by the formula (IB) defined herein, and is decomposed by an action of an acid and shows an increase in a solubility in an alkali developer; and (B) as compounds capable of generating an acid upon irradiation with one of an actinic ray and a radiation, at least two compounds selected from the compounds (B1), (B2), (B3) and (B4) as defiend herein.

Abstract: A positive resist composition comprising: (A) a fluorine group-containing resin having: a structure wherein at least one of the main chain and the side chain of the polymer skeleton has at least one fluorine atom; and having a group capable of decomposing under the action of an acid to increase the solubility in an alkali developer; (B) a compound capable of generating an acid upon irradiation with one of actinic ray and radiation, and (C) a surfactant containing at least one of a silicon atom and a fluorine atom.

Abstract: Disclosed is planographic printing plate precursor comprising a support having disposed thereon an image forming layer containing a fluorine macromolecular compound having a structural unit derived from a monomer represented by the following general formula (I). In the general formula (I), R0 represents a hydrogen atom, a methyl group, a cyano group or a halogen atom. X represents a single bond or a divalent connecting group. R1 to R6 each independently represent a hydrogen atom, an alkyl group, a fluorine atom or an alkyl group in which at least one hydrogen atom is substituted with a fluorine atom. Further, at least one of R1 to R6 represents a fluorine atom or an alkyl group in which at least one hydrogen atom is substituted with a fluorine atom.

Abstract: A chemical amplification type resist composition comprising: (a) a resin comprising repeating units having a side chain containing the specific partial structure and which increases the solubility in an alkaline developing solution by the action of an acid, (b) a compound capable of generating an acid upon irradiation with actinic rays or a radiation, (c) a low-molecular compound having a molecular weight of 3,000 or lower, wherein the value determined with the specific calculation formula is from 0.1 to 0.5, and (d) a solvent.

Abstract: A positive resist composition comprising (A) polysiloxane or polysilsesquioxane that has a property of increasing solubility in an alkali developing solution by the action of an acid and contains a group capable of being decomposed with an acid, (B) a compound that generates a sulfonic acid upon irradiation of an actinic ray or radiation and (C) an organic basic compound, wherein an amount of the compound that generates a sulfonic acid upon irradiation of an actinic ray or radiation is from 6 to 20% by weight based on the total solid content of the positive resist composition.

Abstract: A positive resist composition comprising (A) a resin, which is decomposed by the action of an acid to increase solubility in an alkali developing solution, having a repeating unit represented by formula (Y) defined in the specification, (B) a compound capable of generating an acid upon irradiation of an actinic ray or radiation, and (C) a solvent.

Abstract: A composition for a bottom anti-reflective coating material and a method for forming a resist pattern using the composition, which are high in the dry etching rate, high in the resolution, excellent in the resist film thickness dependency and high in the effect of preventing reflective light against exposure light, and provide no intermixing with the photoresist layer, are disclosed, wherein the composition for a bottom anti-reflective coating material comprises a naphthalene group-containing polymer compound having a specific structure.

Abstract: A positive working resist composition comprising (A1) a resin containing a repeating unit represented by formula (1) defined in the specification and a repeating unit represented by formula (2) defined in the specification and having a property of being insoluble or sparingly soluble in an alkali developing solution and becoming soluble in an alkali developing solution by the action of an acid, and (B) a compound capable of generating sulfonic acid upon irradiation with active rays or radiations in an amount of from 5 to 20% by weight based on the total solid content of the positive working resist composition.

Abstract: The photosensitive resin composition comprising:

Abstract: To provide a lower layer resist composition for a silicon-containing two-layer resist, which is excellent in the dry etching resistance and film thickness uniformity. A lower layer resist composition for a silicon-containing two-layer resist, comprising (a) a phenol-based polymer, (b) a compound capable of generating a sulfonic acid at a temperature of 100° C. or more, (c) a phenol-based acid crosslinking agent having two or more benzene rings and capable of crosslinking with the polymer under the action of an acid, and (d) a solvent.

Abstract: A positive resist composition is disclosed, comprising (A) a resin containing at least one repeating unit represented by the following formula (I) and at least one repeating unit represented by formula (VII), which decomposes under the action of an acid to increase the solubility in an alkali developer, and (B) a compound capable of generating an acid upon irradiation with actinic rays or radiation.

Abstract: A positive resist composition to be irradiated with one of an electron beam and X-ray, comprises: (a) a compound capable of generating an acid upon irradiation with one of electron beam and X-ray; (b1) a resin: increasing the solubility in an alkali developer by the action of an acid; and having a group capable of leaving by the action of an acid, in which the leaving group includes a residue of a compound, the compound having a smaller ionization potential value than p-ethylphenol; and (c) a solvent.

Abstract: A negative type resist composition comprising:

Abstract: A resist composition comprising:

Abstract: A chemical amplification type resist composition comprising:

Abstract: A positive resist composition of the present invention achieving significant performance improvements in high energy-beam lithography, which comprises a phenolic polymer having a property of being insoluble or hardly soluble in an aqueous alkali solution and becoming soluble in an aqueous alkali solution by the action of an acid, in which the phenolic polymer includes a repeating unit containing at least one selected from the group consisting of an acetal-protected phenolic hydroxyl group, a ketal-protected phenolic hydroxyl group, a tertiary ester-protected carboxyl group and a tetrahydropyranyl-protected carboxyl group; and a compound having a phenacylsulfonium structure and capable of generating an acid upon irradiation with one of actinic rays and radiation.

Abstract: The photosensitive resin composition of the present invention is an excellent photosensitive resin composition: exhibiting significant transmissibility at the use of an exposure light source of 160 nm or less, more specifically F2 excimer laser light , where line edge roughness and development time dependence are small and a problem of footing formation is improved; and comprising a resin which decomposes by an action of acid to increase the solubility in alkali developer, in which the resin contains a specific repeat unit; a compound capable of generating an acid upon irradiation with one of an actinic ray and a radiation, in which the compound includes at least two kinds of compounds selected from the group consisting of specific compounds (B1), (B2), (B3) and (B4).

Abstract: The resist composition of the present invention, ensuring excellent pattern profile and excellent isolation performance for use in the pattern formation by the irradiation of actinic rays or radiation, particularly, electron beam, X ray or EUV light, which comprising (A) a compound having a specific partial structure and a counter ion, the compound generating an acid upon irradiation of actinic rays or radiation.

Abstract: A positive-working resist composition comprising: