Abstract: A solar cell module includes a solar cell string including solar cells disposed in an arrangement direction and at least two wiring members provided to extend along the arrangement direction in order to electrically connect the solar cells. The at least two wiring members include a first wiring member disposed at a first position where a distance between the solar cells adjacent to each other is short and a second wiring member disposed at a second position where the distance between the solar cells adjacent to each other is long. The respective first and second wiring members include bent portions between the solar cells. Between edge portions of the solar cells facing each other, the first wiring member has a slope whose maximum value is larger than the maximum value of a slope of the second wiring member.

Abstract: A switched capacitor type D/A converter receives m-bit (m represents an integer) input data, and outputs an analog signal that corresponds to the input data value. Switch circuits are provided to respective bits of the input data, and are classified into two groups: a first group configured to turn on when the corresponding input data bit is 1, and to turn off when the corresponding input data bit is 0; and a second group configured to turn on when the corresponding input data bit is 0, and to turn off when the corresponding input data bit is 1. Each switch of the first and second switch groups is configured as a P-channel MOSFET (Metal Oxide Semiconductor Field Effect Transistor). The ground voltage 0 V is applied to the lower power supply terminal of each of the first and second inverters configured to supply a gate signal to each switch.

Abstract: An optical sensor module is provided in which an engagement portion of a board unit is fitted in a groove of an optical waveguide unit and, even with the single engagement portion, the board unit is stably supported. An optical sensor module includes an optical waveguide unit, and a board unit mounted with an optical element and coupled to the optical waveguide unit. The optical waveguide unit includes a single edge extension portion axially extending along one side edge of an over-cladding layer, a board unit engagement groove provided in the single edge extension portion, and a projection provided on a side wall of the vertical groove and kept in abutment against an engagement portion of the board unit. The board unit includes an engagement portion fitted in the vertical groove, which abuts against the projection within the vertical groove.

Abstract: The input device includes a frame-shaped optical waveguide having a hollow input-use interior, and a control means provided on the outside of one of the sides of the optical waveguide. The optical waveguide and the control means are provided on a surface of a frame-shaped retainer plate. The control means includes: a light-emitting element connected to ends of light-emitting cores of the optical waveguide; a light-receiving element connected to ends of light-receiving cores of the optical waveguide; and a CPU incorporating a program. Upon sensing a first light-shielded area where light is intercepted by the tip of a pen and a second light-shielded area where light is intercepted by user's hand that holds the pen, the program recognizes the second light-shielded area larger than the first light-shielded area as unnecessary information, based on a difference in light-shielded area.

Abstract: A wired circuit board includes a conductive pattern, and an insulating layer covering the conductive pattern and having a transmittance of not more than 30% with respect to a wavelength in a range of 600 to 680 nm.

Abstract: A plurality of wiring traces are formed on a base insulating layer, and a metal layer is formed on the opposite surface of the base insulating layer. Two adjacent wiring traces constitute a transmission line pair. The width of the wiring trace is set to not more than 250 ?m, and the distance between the adjacent wiring traces is set to not less than 8 ?m. The thickness of the base insulating layer is selected to cause differential impedance of the transmission line pair to be not less than 10 ? and not more than 50 ?.

Abstract: An optical sensor module is provided in which an engagement portion of a board unit is fitted in a groove of an optical waveguide unit and, even with the single engagement portion, the board unit is stably supported. An optical sensor module includes an optical waveguide unit, and a board unit mounted with an optical element and coupled to the optical waveguide unit. The optical waveguide unit includes a single edge extension portion axially extending along one side edge of an over-cladding layer, a board unit engagement groove provided in the single edge extension portion, and a projection provided on a side wall of the vertical groove and kept in abutment against an engagement portion of the board unit. The board unit includes an engagement portion fitted in the vertical groove, which abuts against the projection within the vertical groove.

Abstract: A switched capacitor type D/A converter receives m-bit (m represents an integer) input data, and outputs an analog signal that corresponds to the input data value. Switch circuits are provided to respective bits of the input data, and are classified into two groups: a first group configured to turn on when the corresponding input data bit is 1, and to turn off when the corresponding input data bit is 0; and a second group configured to turn on when the corresponding input data bit is 0, and to turn off when the corresponding input data bit is 1. Each switch of the first and second switch groups is configured as a P-channel MOSFET (Metal Oxide Semiconductor Field Effect Transistor). The ground voltage 0 V is applied to the lower power supply terminal of each of the first and second inverters configured to supply a gate signal to each switch.

Abstract: An insulating layer made of an insulator film or the like is prepared. Then, a thin metal film and a thin copper film are formed in sequence on the insulating layer. The thin copper film is subsequently laminated with a dry film or the like, and exposed and developed to form a plating resist thereon that have patterns opposite to conductor patterns which are formed in a subsequent step. This is followed by forming conductor patterns made of copper, by electrolytic plating using an electrolytic copper sulfate plating solution, on the surfaces of the thin copper film where the plating resist is not formed. The plating resist is then removed by, for example, stripping. After this, the thin copper film is held at a temperature of not less than 200° C. and not more than 300° C. for approximately an hour to be thermally treated. Then, the thin copper film and the thin metal film are removed by chemical etching except the portions under the conductor patterns.

Abstract: A semiconductor integrated circuit receives an input current, and supplies, to a different circuit, an output current that corresponds to the input current. A first terminal of a first variable resistor is connected to an input terminal. A first transistor and a second transistor are sequentially arranged in series between a power supply terminal and a second terminal of the first variable resistor. A third transistor and a fourth transistor are sequentially arranged in series between the power supply terminal and an output terminal. The gates of the first transistor and the third transistor are each connected to the second terminal of the first variable resistor. The gates of the second transistor and the fourth transistor are each connected to the input terminal. The first variable resistor is configured to be capable of switching the resistance value thereof according to the input current.

Abstract: An image forming apparatus includes a fixing apparatus for fixing a toner image onto a recording medium by applying pressure and heat to toner provided on the surface of the recording medium. The fixing apparatus includes a fixing member, a pressing member for pressing against the fixing member, a temperature detecting part for detecting the temperature of the fixing member, and a heating member including a main heating member and an auxiliary heating member for heating the fixing member, the main heating member being heated by obtaining power from a main power supply, the auxiliary heating member being heated by obtaining power from an auxiliary power supply.

Abstract: An image forming apparatus which causes a long recording medium carrying a toner image thereon to pass between a fixing roller and a pressure roller to fix the toner image onto the long recording medium by means of the action of heat and pressure. The temperature of the fixing roller is prevented from being significantly reduced during operation of fixing the toner image, and thereby the occurrence of a toner image fixation failure is prevented. When the temperature of the fixing roller is reduced, in addition to a main heating member of heating means, electric power is also supplied from an auxiliary power source to an auxiliary heating member to cause the auxiliary heating member to generate heat.

Abstract: A plurality of wiring traces are formed on a base insulating layer, and a metal layer is formed on the opposite surface of the base insulating layer. Two adjacent wiring traces constitute a transmission line pair. The width of the wiring trace is set to not more than 250 ?m, and the distance between the adjacent wiring traces is set to not less than 8 ?m. The thickness of the base insulating layer is selected to cause differential impedance of the transmission line pair to be not less than 10? and not more than 50?.

Abstract: A fixing device includes a fixing member, pressure member, first temperature detector, and pressure adjustment mechanism. The pressure member presses against the fixing member to form a nip though which a recording medium bearing a toner image thereon is conveyed. The first temperature detector detects a temperature of the fixing member. The pressure adjustment mechanism performs an adjustment to contact pressure between the fixing and pressure members to be lower than an appropriate pressure for image fixing at the detected temperature of the fixing roller or separation of the pressure roller from the fixing member for a part of a period between a time at which a tailing end of a precedent recording medium is conveyed out from the nip and a time at which a leading end of a following recording medium is conveyed into the nip when a plurality of recording media are successively conveyed through the nip.

Abstract: A wired circuit board is provided having a high-reliability conductive pattern formed thereon and mounting an electronic component thereon with high accuracy, and a method is provided for manufacturing the wired circuit board and mounting the electronic component thereon. An insulating layer including a mounting portion is formed on a metal supporting layer having a specular gloss of 150 to 500% at an incidence angle of 45°. A conductive pattern is formed on the insulating layer. By a reflection-type optical sensor, a defective shape of the conductive pattern is inspected. Then, an opening is formed by etching the portion of the metal supporting layer which is overlapping the mounting portion such that the mounting portion of the insulating layer exposed by etching has a haze value of 20 to 50%, whereby a TAB tape carrier is obtained.

Abstract: The invention is intended to provide a building sequence planning system for an automobile production line, which can prepare an efficient building sequence. The system comprises an input unit (1) for inputting information of vehicles to be manufactured, a processing unit (3) for deciding an optimum building sequence based on the vehicle information inputted through the input unit (1), and an output unit (5) for externally outputting a building sequence schedule decided by the processing unit (3). The processing unit (3) prepares a vehicle building sequence, determines a degree of dissatisfaction of the prepared building sequence, as a penalty value, in accordance with restriction conditions which are inputted through the input unit (1) and are imposed when building the vehicles into work, and decides a building sequence with a minimum penalty by preparing a plurality of building sequences and determining the penalty value for each building sequence with respect to the restriction conditions.

Abstract: An adenine compound or its pharmaceutically acceptable salt as a medicament as shown following formula (1): wherein R1 is optionally substituted alkyl group, etc., X is oxygen atom, etc., A is 4 to 8 membered optionally substituted saturated or unsaturated heterocyclic group containing 1 to 2 hetero atoms selected from 1 to 3 nitrogen atoms, 0 to 1 oxygen atom and 0 to 1 sulfur atom, L1 and L2 are independently straight or branched chain alkylene, or a single bond, R2 is optionally substituted alkyl group, etc.

Abstract: A wired circuit board is provided having a high-reliability conductive pattern formed thereon and mounting an electronic component thereon with high accuracy, and a method is provided for manufacturing the wired circuit board and mounting the electronic component thereon. An insulating layer including a mounting portion is formed on a metal supporting layer having a specular gloss of 150 to 500% at an incidence angle of 45°. A conductive pattern is formed on the insulating layer. By a reflection-type optical sensor, a defective shape of the conductive pattern is inspected. Then, an opening is formed by etching the portion of the metal supporting layer which is overlapping the mounting portion such that the mounting portion of the insulating layer exposed by etching has a haze value of 20 to 50%, whereby a TAB tape carrier is obtained.

Abstract: In an outer lead portion, outer lead wirings are provided on one surface of a base insulating layer and a plurality of metal substrates are provided on the opposite surface thereof. The plurality of metal substrates are provided with predetermined spacings therebetween. The outer lead wirings are not provided on the areas on the surface opposite to the areas on the other surface of the base insulating layer on which the slits are provided between the metal substrates. Metals such as stainless steel, copper or copper alloy can be used for the metal substrates. Coefficient of linear expansion of each metal substrate is preferably equal to that of the base insulating layer.

Abstract: An image forming apparatus includes an image forming device forming an image on a recording medium wound into a roll, and a roll sheet conveyance device unwinding and conveying the medium to the image forming device. The roll sheet conveyance device includes a roll sheet feed device, a torsion detector, and a control device. The roll sheet feed device includes a drive device including upstream and downstream shafts in a drive transmission direction to rotate the medium, and a feed device to feed the medium. The detection device includes a torsion coil spring provided between the upstream and downstream shafts, and a pair of an encoder and an encoder sensor detecting the torsion amount at the opposite ends of the torsion coil spring. The control device controls the torsion amount on the basis of a signal from the detection device, and applies a given back tension to the medium.