Patents by Inventor Kei Yamamoto

Kei Yamamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200324846
    Abstract: A saddle riding vehicle includes a body frame, an engine supported by the body frame, an exhaust sensor that detects exhaust air of the engine, and a radiator for the engine. The engine is supported by an engine hanger portion disposed in the body frame. The exhaust sensor is disposed on an exhaust pipe of the engine at a position on a front with respect to the engine hanger portion and is positioned underneath the radiator. At least a part of the exhaust sensor overlaps the engine hanger portion as viewed in a front view of a vehicle.
    Type: Application
    Filed: March 10, 2020
    Publication date: October 15, 2020
    Inventors: Kyotaro Yamamoto, Kei Mayuzumi, Masaomi Yamada, Kazuya Sawasaki, Souichiro Makino
  • Patent number: 10761426
    Abstract: The pattern forming method includes forming an actinic ray-sensitive or radiation-sensitive film using an actinic ray-sensitive or radiation-sensitive composition, forming an upper layer film using a composition for forming an upper layer film on the actinic ray-sensitive or radiation-sensitive film, exposing the actinic ray-sensitive or radiation-sensitive film having the upper layer film formed thereon, and developing the exposed actinic ray-sensitive or radiation-sensitive film using a developer containing an organic solvent, in which the composition for forming an upper layer film includes a resin and at least one of a compound capable of generating an acid with actinic rays or radiation, a compound capable of generating an acid with heat, and an acid, in which the resin includes a repeating unit represented by General Formula (II). The method for manufacturing an electronic device includes the pattern forming method. A laminate includes the film and the upper layer film.
    Type: Grant
    Filed: February 26, 2018
    Date of Patent: September 1, 2020
    Assignee: FUJIFILM Corporation
    Inventors: Hideaki Tsubaki, Wataru Nihashi, Toru Tsuchihashi, Kei Yamamoto
  • Publication number: 20200274331
    Abstract: A semiconductor laser wafer includes a substrate, a first semiconductor layer, an active layer, a second semiconductor layer, and a composition evaluation layer. The active layer is provided on the first semiconductor layer; multiple periods of pairs of a light-emitting multi-quantum well region and an injection multi-quantum well region are stacked in the active layer; the light-emitting multi-quantum well region is made of a first compound semiconductor and a second compound semiconductor. The second semiconductor layer is provided on the active layer. The composition evaluation layer is provided above the active layer and includes a first film and a second film; the first film is made of the first compound semiconductor and has a first thickness; and the second film is made of the second compound semiconductor and has a second thickness.
    Type: Application
    Filed: December 5, 2019
    Publication date: August 27, 2020
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Kei KANEKO, Shinji SAITO, Rei HASHIMOTO, Tsutomu KAKUNO, Yuichiro YAMAMOTO, Tomohiro TAKASE
  • Publication number: 20200239613
    Abstract: Provided is a water repellent composition which does not use a fluorine-containing monomer, especially a fluoroalkyl group-containing monomer. A water repellent composition which contains (1) (a) a polymer which has a repeating unit derived from an amide group-containing monomer that is represented by formula: (wherein R1 represents an organic residue having an ethylenically unsaturated polymerizable group; R2 represents a hydrocarbon group having 7-30 carbon atoms; and R3 represents a hydrocarbon group having 1-5 carbon atoms) in an amount of 2-100% by weight relative to the polymer, and (2) a liquid medium.
    Type: Application
    Filed: July 13, 2018
    Publication date: July 30, 2020
    Applicants: DAIKIN INDUSTRIES, LTD., NOF CORPORATION
    Inventors: Yuuki YAMAMOTO, Norimasa UESUGI, Ikuo YAMAMOTO, Kei-ichi MARUYAMA, Mitsuhiro FUKUSHIMA, Muneaki IIZUKA
  • Patent number: 10714004
    Abstract: A semiconductor device includes first to fourth terminals, a switch circuit, and an integrating circuit. The integrating circuit includes an amplifier circuit having a (?) terminal, a first (+) terminal, and a second (+) terminal. The integrating circuit is configured to integrate an input signal of the (?) terminal using an average voltage of a voltage of the first (+) terminal and a voltage of the second (+) terminal as a reference voltage. The switch circuit is configured to electrically connect the (?) terminal to the second terminal, the first (+) terminal to the first terminal, the second (+) terminal to the third terminal the (?) terminal to the third terminal, the first (+) terminal to the second terminal, and the second (+) terminal to the fourth terminal. The present semiconductor device is used as a semiconductor device sensing a current flowing through a pixel in a display panel.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: July 14, 2020
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Kei Takahashi, Roh Yamamoto
  • Patent number: 10712244
    Abstract: Provided is a specimen staining apparatus that includes a gap-forming member arranged to form a gap having a thickness that induces capillary action, the gap being formed above a mounting surface of a slide glass having a specimen mounted thereon; and a chemical solution supply unit that supplies a chemical solution for staining the specimen to the gap between the gap-forming member and the mounting surface so that the chemical solution spreads within the gap due to capillary action and is evenly supplied to the specimen placed on the mounting surface.
    Type: Grant
    Filed: November 16, 2017
    Date of Patent: July 14, 2020
    Assignee: OLYMPUS CORPORATION
    Inventors: Yoshihiro Kawano, Kei Tsuyuki, Asuka Yamamoto
  • Publication number: 20200202959
    Abstract: A semiconductor memory device includes a differential waveform shaping circuit including first and waveform shaping circuits connected in parallel. The first waveform shaping circuit has a first inverting amplifier, and two inverters connected in series. The first inverting amplifier inverts and differentially amplifies an input signal having a rectangular waveform. Then, the output of the first inverting amplifier is passed through the two inverters. The second waveform shaping circuit has a first inverter, a second inverting amplifier, and a second inverter connected in series. The second inverting amplifier inverts and differentially amplifies the output signal from the first invertor, and the second inverter inverts the output signal from the second inverting amplifier. The differential waveform shaping circuit generates an output signal by averaging the output signal from the first waveform shaping circuit and the output signal from the second waveform shaping circuit.
    Type: Application
    Filed: August 29, 2019
    Publication date: June 25, 2020
    Inventors: Kei SHIRAISHI, Masaru KOYANAGI, Mikihiko ITO, Yumi TAKADA, Yasuhiro HIRASHIMA, Satoshi INOUE, Kensuke YAMAMOTO, Shouichi OZAKI, Taichi WAKUI, Fumiya WATANABE
  • Patent number: 10681416
    Abstract: A quality-of-experience optimization system configured to optimize quality (QoE: Quality of Experience) that a user experiences in a content distribution service, including: a recommend request apparatus configured to output a distribution parameter candidate of content distribution for optimizing QoE of content distribution, and to receive a distribution parameter for optimizing the QoE as a recommend value; and a quality-of-experience optimization apparatus configured to estimate QoE from the distribution parameter candidate received from the recommend request apparatus, and to calculate a distribution parameter for optimizing the QoE as a recommend value to output the recommend value.
    Type: Grant
    Filed: December 24, 2015
    Date of Patent: June 9, 2020
    Assignee: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Hiroshi Yamamoto, Kazumichi Sato, Taichi Kawano, Kei Takeshita
  • Patent number: 10678159
    Abstract: An apparatus is configured to determine an illumination condition for irradiating a printed product with light. The printed product is generated by outputting an image onto a recording medium based on fed input image data. The apparatus includes an input unit configured to receive inputs of luminance dynamic range information of the input image data and exposure condition information at the time of imaging regarding the input image data, an acquisition unit configured to acquire characteristic information of the recording medium, and a determination unit configured to determine the illumination condition based on the luminance dynamic range information, the exposure condition information, and the characteristic information.
    Type: Grant
    Filed: April 23, 2018
    Date of Patent: June 9, 2020
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Satoshi Wada, Takeshi Yazawa, Kei Yoshizawa, Naomi Yamamoto, Makoto Torigoe, Yuji Konno, Hiroshi Tajika, Hidetsugu Kagawa
  • Publication number: 20200176894
    Abstract: A bonder cap includes a plurality of electrical wire bundles each having conductor parts in a plurality of electrical wires therein connected together and covered by a bonder cap; a tying member configured to tie the bonder caps together by being integrally wound around the bonder caps that are included in the electrical wire bundles; and an accommodating part into which the bonder caps that have been tied together by the tying member are inserted and in which the bonder caps are integrally accommodated.
    Type: Application
    Filed: November 25, 2019
    Publication date: June 4, 2020
    Inventors: Kei Tomita, Daiki Yamamoto
  • Publication number: 20200176961
    Abstract: an electric wire fixing structure includes a first half hole part and a second half hole part formed by dividing an electric wire hole through which an electric wire is passed; an electric wire fixing part formed in a shape along the first half hole part when viewed in the axial direction of the electric wire hole, the electric wire fixing part extending from the first half hole part in the axial direction of the electric wire hole; and a fixing member wound around the electric wire and the electric wire fixing part together, so as to fix the electric wire to the electric wire fixing part.
    Type: Application
    Filed: October 27, 2019
    Publication date: June 4, 2020
    Inventors: Kei Tomita, Daiki Yamamoto
  • Publication number: 20200176953
    Abstract: A quantum cascade laser of an embodiment includes a semiconductor stacked body in which a ridge waveguide is provided. The semiconductor stacked body includes an active layer including a quantum well region including a layer including Al; and the active layer emits laser light. The layer that includes Al includes first regions, and a second region interposed between the first regions; the first region includes Al oxide and reaches a prescribed depth inward from an outer edge of the active layer along a direction parallel to a surface of the active layer in a cross section orthogonal to the optical axis; and the second region does not include Al oxide.
    Type: Application
    Filed: December 3, 2019
    Publication date: June 4, 2020
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Rei Hashimoto, Shinji Saito, Tomohiro Takase, Tsutomu Kakuno, Yuichiro Yamamoto, Kei Kaneko
  • Publication number: 20200172030
    Abstract: An insertion coupling structure includes a base portion that is in contact with a surface on one side in a thickness direction of a coupling member, a clamping portion that faces a surface on the other side of the coupling member, a rigid supporting portion that is provided to the clamping portion in a rib-like shape along an insertion direction that intersects the thickness direction of the coupling member and in which the coupling member is inserted, and is in contact with the surface on the other side of the coupling member, and an elastic supporting portion that has rigidity lower than the rigidity of the rigid supporting portion.
    Type: Application
    Filed: October 31, 2019
    Publication date: June 4, 2020
    Inventors: Kei Tomita, Daiki Yamamoto, Suguru Sakai
  • Patent number: 10663864
    Abstract: The pattern forming method includes forming an actinic ray-sensitive or radiation-sensitive film using an actinic ray-sensitive or radiation-sensitive composition, forming an upper layer film on the actinic ray-sensitive or radiation-sensitive film using a composition for forming an upper layer film, exposing the actinic ray-sensitive or radiation-sensitive film having the upper layer film formed thereon, and developing the exposed actinic ray-sensitive or radiation-sensitive film using a developer, in which the composition for forming an upper layer film includes a solvent and a crosslinking agent; and in which the content of a solvent having a hydroxyl group is 80% by mass or less with respect to all the solvents included in the composition for forming an upper layer film. The method for manufacturing an electronic device includes the pattern forming method. The laminate has an actinic ray-sensitive or radiation-sensitive film, and an upper layer film including a crosslinking agent.
    Type: Grant
    Filed: February 26, 2018
    Date of Patent: May 26, 2020
    Assignee: FUJIFILM Corporation
    Inventors: Wataru Nihashi, Hideaki Tsubaki, Toru Tsuchihashi, Kei Yamamoto
  • Patent number: 10578968
    Abstract: The present invention has an object to provide a pattern forming method capable of providing good DOF and EL, a resist pattern formed by the pattern forming method, and a method for manufacturing an electronic device, including the pattern forming method. The pattern forming method of the present invention includes a step a of coating an active-light-sensitive or radiation-sensitive resin composition onto a substrate to form a resist film, a step b of coating a composition for forming an upper layer film onto the resist film to form an upper layer film on the resist film, a step c of exposing the resist film having the upper layer film formed thereon, and a step d of developing the exposed resist film using a developer to form a pattern, in which the active-light-sensitive or radiation-sensitive resin composition contains a hydrophobic resin.
    Type: Grant
    Filed: March 27, 2017
    Date of Patent: March 3, 2020
    Assignee: FUJIFILM Corporation
    Inventors: Kei Yamamoto, Naohiro Tango, Naoki Inoue, Michihiro Shirakawa, Akiyoshi Goto
  • Publication number: 20200021717
    Abstract: An illumination condition, which is used to irradiate a print product with light having illuminance higher than normal illumination, is derived based on exposure condition information at the time of photographing.
    Type: Application
    Filed: July 2, 2019
    Publication date: January 16, 2020
    Inventors: Takeshi Yazawa, Satoshi Wada, Kei Yoshizawa, Naomi Yamamoto, Makoto Torigoe, Yuji Konno, Hiroshi Tajika, Hidetsugu Kagawa
  • Patent number: 10529643
    Abstract: A semiconductor device that reduces the deformation of a metal base due to pressure during transfer molding, to thereby suppress the occurrence of cracks in an insulating layer to achieve high electrical reliability. The semiconductor device includes: a metal member provided, on its lower surface, with a projection and a depression, and a projecting peripheral portion surrounding the projection and the depression and having a height greater than or equal to a height of the projection of the projection and the depression; an insulating layer formed on an upper surface of the metal member; a metal layer formed on an upper surface of the insulating layer; a semiconductor element joined to an upper surface of the metal layer; and a sealing resin to seal the semiconductor element, the metal layer, the insulating layer and the metal member.
    Type: Grant
    Filed: September 20, 2016
    Date of Patent: January 7, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kei Yamamoto, Hodaka Rokubuichi, Dai Nakajima, Kiyofumi Kitai, Yoichi Goto
  • Patent number: D876349
    Type: Grant
    Filed: November 8, 2017
    Date of Patent: February 25, 2020
    Assignee: OMRON Corporation
    Inventors: Masaaki Nagano, Masahiko Kubo, Tadahiko Ogawa, Tomonori Watanabe, Kei Okada, Masayuki Ueuchi, Takema Sato, Tomoki Konno, Yuki Tsuruguchi, Michihiro Yamamoto, Masato Shimizu, Hiroki Niwa
  • Patent number: D879036
    Type: Grant
    Filed: November 9, 2017
    Date of Patent: March 24, 2020
    Assignee: OMRON Corporation
    Inventors: Masaaki Nagano, Tadahiko Ogawa, Masahiko Kubo, Yuki Tsuruguchi, Hiroki Niwa, Masayuki Ueuchi, Tomonori Watanabe, Tomoki Konno, Takema Sato, Masato Shimizu, Kei Okada, Michihiro Yamamoto
  • Patent number: D897539
    Type: Grant
    Filed: January 4, 2019
    Date of Patent: September 29, 2020
    Assignee: Tokuyama Dental Corporation
    Inventors: Tatsuya Yamazaki, Kei Nakashima, Youichi Yamamoto, Hitoshi Motohashi